Asscon Vapor Phase technology is said to be the most versatile reflow system for Pb-free and leaded applications. Maintains peak temperature of a small resistor while reaching a suitable liquidous period for larger, adjacent devices. All parts reportedly reach the same peak temperature; local differentials are reportedly nonexistent. Bringing the circuit back to a liquidous state in a non-turbulent chamber permits removal of and replacement of high mass/value parts without exerting high levels of mechanical stress on the PCB or parts by creating local temperature differentials. Is conducted in an oxygen-free environment, with minimal or no fluxing, and no extraction for operators. Removal process guaranteed not to take place until the joints are liquidous.
 
Asscon / A-Tek, www.atekllc.com