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The APR-5000-DZ array package rework system is said to enable fast ramp and tighter delta temperature control for Pb-free rework without affecting adjacent and underside components. Expands capability to rework odd-form and temperature-sensitive components. Reportedly delivers highly targeted and controlled heating for rework of high thermal demand boards, including multilayer assemblies up to 12" x 12". Has a dual convection bottom-side heater that consists of large and small area heaters. Can rework components with 0.4 mm pitch. Enables rework of components where vacuum pickup is not an option. Strobe light facilitates viewing the dual image of both component and board. Is for small, high-density boards used in mobile phones, handheld instruments and personal media players.

OK International, www.okinternational.com