The CM602 provides the speed to meet high-volume manufacturing requirements, as well as the flexibility required for high mix/low volume – all in one platform.

The enhanced machine features 3-D vision, by a light-head, high-speed recognition camera. The machine also supports next-generation technologies such as package-on-package (PoP), adaptive process control (APC) and PCB warp mapping.


Adaptive Process Control links the entire SMT process to provide high first-pass yields for high-density 01005 component placement.

Other new enhancements include 12 more heads, fluxer/PoP capability and direct tray picking.

The platform comes with four heads, configurable as four high-speed, four multifunctional, or two of each. It can be reconfigured onsite as manufacturing needs require. The high-speed heads have eight nozzles; the multifunctional heads have three. The best-suited head can be selected for each stage, depending on the product and production volume.

The high-speed heads can reportedly place a chip every 0.048 sec., or 75,000 cph, with an accuracy of ±50 µm/chip (Cpk>1). The multifunctional heads place a QFP every 0.18 sec. at accuracy rating of ±35 µm/chip (Cpk>1). High-speed placement is achieved by using a linear motor and an accurate recognition system. In addition, the main body has a space-saving footprint of roughly 7.5' x 8.75' x 4.5'.

The machine can place components ranging from 01005 to 90 x 100 mm, and handles PCBs from 2" x 2" to 18" x 20".

The platform is said to be fully compatible with the CM402 series feeder units, nozzles and operation.

Tape feeder styles include 88 and 104 mm, bulk or stick. Tape feed pitch can be set digitally. The parts count recording function issues a warning when the number of parts remaining is low. For the 8 mm tape, up to 216 kinds can be placed.

Available from Panasonic Factory Solutions Company of America, panasonicfa.com.