An evaluation of five systems showed broad performance differences.

Energy dispersive x-ray fluorescence (XRF) is ideal for materials screening for RoHS compliance. The fluorescent light is called the characteristic x-ray of the element. In a given element, energies between two specific orbital shells are always the same. Photons emitted when an electron moves between these two levels will always have the same energy. Therefore, it is possible to determine the identity of that element by determining the energy of the x-ray light (photons). There are two types of XRF: handheld and desktop from different vendors. To understand individual XRF capabilities and accurate levels, we conducted this study in two phases.

Phase 1: Evaluate five XRF systems with standard samples; compare Cpk; Gage R&R; stability test and detection level versus acquisition time.

Phase 2: Correlation study of production sample results from XRF against XRF or ICP method from outside two laboratories. The section of experiments and analysis describes experiment design, data collection, and analysis that included the results from five XRF equipments and two test laboratories.

The purpose of this study was not to identify superior equipment, but to show each XRF analyzer’s technical performance compared with external test laboratories.

Experiments and Analysis

We selected two handheld and three desktop XRF spectrometers because of their main specifications, performance and cost. They are Vendor 1-D, Vendor 2-D, Vendor 3-D, Vendor 4-H and Vendor 5-H. We used this XRF equipment for Cpk, stability, Gage R&R, detection level versus acquisition time studies with 12 standard samples, and correlation studies with 11 production samples.

We found:


Image


References
  1. Rob Rowland, “Demonstrating RoHS Compliance User Perspective,” Web presentation, Aug. 31, 2006.
  2. IEC-62321, Ed. 1, Environmental Standardization for Electrical and Electronics Products and Systems, 2005.
  3. Flextronics XRF evaluation report, September 2005.
  4. Dongkai Shangguan, “Lead-Free Solder Interconnect Reliability,” ASM International, 2005.
Acknowledgments
The team of Flextronics GDL Technology Center, Mexico: Maria Luisa Hernández Eusebio, Juan Coronado, Omar Garcia, Martin Murguia, George Liu, Amador Virgen Oneida, Monreal Zárate Yolanda, Santos Ruiz Luz Arcelia, Aceves, Conrique Carlos Humberto and Jayapaul Basani; the five XRF vendors’ support engineers, and the two external test labs.

Ed.: This article was first published at Apex in February 2007 and is published with permission of the authors.

Hector Rene Marin Hernandez, RefugioVicente Escobedo Alva, Zhen (Jane) Feng, Ph.D., Joao Ofenboeck, and Murad Kurwa are with Flextronics International (flextronics.com); jane.feng@flextronics.com.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account