Medical-grade adhesive portfolio adds five IBOA- and TPO-free formulations for electronics applications, including Photobond MG4202, MG4191, MG4094, MG4186 and MG4164. The adhesives are adapted from semiconductor and consumer electronics technologies and designed for structural bonding, sealing and multi-purpose use in medical devices. Fast-curing formulations support LED curing in one second at 400nm and operate across a temperature range of -40°C to 125°C. Variants include fluorescence for process control, peel resistance for durability, and sealing capabilities for FIPG and CIPG applications. 

Delo

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