EnviroMark 907 (EM907) is a no-clean, lead-free solder paste.
Designed for high-yield, lead-free manufacturing, was
engineered specifically for the higher thermal demands and higher melting temperature
lead-free alloys, such as the SnAgCu (SAC) alloys. Features a long
stencil life, offers lead-free joints that closely resemble those achieved with
Sn/Pb solder paste. Capable of extended downtimes in printing, maintains
excellent print quality at print speeds up to 6 in/sec. (150 mm/sec). Has
excellent cold and hot slump behavior, preventing bridges and solder ball
formation. Said to have excellent solderability to a variety of board surface
metallizations, including OSP, Ni/Au, Immersion Sn and Immersion Ag. Features
solderability to an array of component metallizations, including Pd/Ag and
Alloy 42. Flux chemistry offers bright solder joints, even in air reflow.
This cosmetic feature is an added benefit during inspection. The paste leaves
only a light-colored residue and provides a stable tack life.
Reflowable
in air or nitrogen, prints down to 0201 pad sites, has superior printing
characteristics to 16 and 20 mil pitches (0.4 and 0.5 mm) and meets J-STD-004
Flux Classification ROL0.
Kester, kester.com, Booth 5636
