The Semiconductor Feeding Solutions Group of Hover-Davis will highlight the latest addition of its Direct Die Feeding product line ¾ the DDf Ultra.
 
Is capable of feeding a range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
 
Performance is optimized around the handling of small flip chips. Can feed die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hr. ¾ with smaller die sizes and higher throughputs planned.
 
Roland Heitmann, director of the Semiconductor Feeding Solutions Group, said, “We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with an SMT chip shooter, we can create a “die shooter” or “flip chip shooter,” which is essentially new class of die assembly solution.”
 
Hover-Davis, hoverdavis.com
Booth A5 224