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Portland, OR – Milwaukee Electronics today announced that its facilities in Portland, OR and Milwaukee Electronics have both completed the registration process for AS9100:2016. The registrar is DQS Inc. Both facilities are also ITAR-registered.

“We are seeing increasing opportunities in the defense sector as well as commercial avionics. Our AS9100 certification combined with our ITAR registration position us as an excellent source for US-based manufacturing in these sectors,” said Jered Stoehr, Milwaukee Electronics’ CEO.

About Milwaukee Electronics

Milwaukee Electronics (www.milwaukeeelectronics.com) is an electronics manufacturing services (EMS) company bridging the gap between traditional forecasted manufacturing and the future of online, on-demand manufacturing. Established in 1954, it has proven staying power as one of the longest established manufacturing service providers in the country. That staying power comes from a philosophy of constant innovation combined with the traditional customer-first values of a privately held family business.

Milwaukee Electronics manufactures custom printed circuit board assemblies (PCBA) for the medical, telecommunications, transportation, military and other industries. The company operates over 135,000 square feet of manufacturing in Portland, Oregon; Milwaukee, Wisconsin; and Tecate, Mexico. In addition to EMS, it offers quick-turn prototyping through its Screaming Circuits business unit.

Cranston, Rhode Island USA. AIM Solder is pleased to promote Timothy O’Neill to Vice President of Technology, effective March 1, 2026.

In this newly created role, O’Neill will unify Research & Development (R&D), Applications Engineering, and Technical Marketing under a single technology organization. This alignment will strengthen AIM’s long-term technology strategy. It will additionally enhance new product development, expand internal technical training, and deepen technical collaboration with industry partners, OEM customers, and EMS customers.

“Tim has built a rare breadth of experience across sales, marketing, and product and technology leadership during more than 28 years with AIM,” said David Suraski, President, Assembly Materials Division. “He has a strong track record of turning customer and market needs into practical, high-performing solutions. This role reflects both the scale of our technology opportunities and Tim’s ability to connect strategy, innovation, and execution across the organization.”

O’Neill joined AIM more than 28 years ago, beginning his career with the company as a District Sales Manager. Over the years, he has held roles spanning marketing and product management, building deep expertise across AIM’s technologies, markets, and customer applications.

You can reach Timothy O’Neill at toneill@aimsolder.com

Cranston, Rhode Island USA – AIM Solder is pleased to hire Francisco Rodriguez as Regional Sales Manager for Northeast Mexico.

Francisco comes to AIM with decades of experience in electronics manufacturing and sales. In addition, his strong technical background is supported by his degree in Electronic Engineering from Instituto Tecnológico de Ciudad Guzmán.

“Francisco brings the rare combination of deep electronics manufacturing knowledge and a strong commercial mindset,” said Oscar Lopez, AIM’s LATAM National Sales Manager. “His technical foundation and experience in the region will help us strengthen customer partnerships across Northeast Mexico, and I’m excited to have him on the AIM team.”

In his role, Francisco will support electronics manufacturers throughout Northeast Mexico, working closely with customers to understand production needs and connect them with AIM’s solder materials and technical resources. He will partner with AIM’s technical support and operations teams to help ensure responsive service and long-term customer success.

You can reach Francisco Rodriguez at frodriguez@aimsolder.com.

Baltimore, MD – March 2026 – The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, has added the Prime TruVision™ X-ray and computed tomography (CT) inspection system from Creative Electron to its engineering and analysis services. The system allows TTCI to examine the internal structure of electronic assemblies with high-resolution imaging, supporting more detailed failure analysis and process investigation for its customers.

The Prime TruVision platform combines imaging software with a mechanically stable inspection platform designed for precision motion and repeatable results. The system supports 2D X-ray imaging, laminographic analysis, and full 3D CT scanning, allowing engineers to view internal structures such as solder joints, plated through holes, vias, and component connections without destructive cross-sectioning.

Using the system’s imaging and reconstruction tools, TTCI engineers can evaluate voiding levels, inspect BGAs and QFNs, detect barrel cracks in plated through holes, and investigate structural defects that may affect long-term reliability. These capabilities allow engineers to analyze internal features of assemblies and identify manufacturing issues during failure analysis.

“At The Test Connection, Inc., we continuously invest in technologies that strengthen the value we bring to our customers,” said Bert Horner, President of The Test Connection, Inc. “The Prime TruVision system from Creative Electron combines powerful imaging software with exceptionally stable hardware, allowing our team to deliver advanced X-ray and CT inspection services that complement our electrical test capabilities. This investment supports our mission to help manufacturers improve quality, reliability, and root-cause analysis across their products.”

The X-ray and CT capability complements TTCI’s electrical test engineering services, which include flying probe test, in-circuit test (ICT), boundary scan, and functional test development. Combining electrical validation with internal structural inspection allows TTCI engineers to investigate both electrical and physical causes of product issues within a single engineering workflow.

“TTCI’s investment in our TruView Prime X-ray system strengthens their ability to perform deeper and faster failure analysis on complex electronic assemblies,” said Bill Cardoso. “With higher resolution and rapid inspection capability, their engineers can pinpoint root causes more quickly and deliver more reliable insights to their customers.”

“Creative Electron’s Prime TruVision platform brings together powerful imaging software and robust hardware stability, giving our team a highly capable tool for advanced X-ray and CT inspection,” Horner added. “By integrating this technology into our services, The Test Connection is expanding beyond traditional electrical test into deeper structural analysis of electronic assemblies. We see a strong growth pathway both within the CCA and PCB industries and in emerging sectors where non-destructive inspection plays a critical role in reliability and quality.”

The system will be used across a range of applications including failure analysis, process validation, counterfeit component investigation, and reliability studies for high-performance electronics. Industries supported by TTCI include aerospace, defense, medical devices, and other high-reliability sectors where internal inspection is often required.

The Test Connection, Inc. will highlight its expanded inspection and test services at IPC APEX EXPO 2026, booth #3522.

To learn more about TTCI’s test services, visit www.ttci.com.

Plymouth, WI — February 2026 — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.

This strategic integration unites Kurtz Ersa’s established reflow soldering expertise with ATV’s advanced vacuum and specialty thermal processing technologies, creating a complete solution portfolio for microelectronics, semiconductor packaging, and power electronics manufacturing.

Advanced Thermal Solutions for Semiconductor Applications

At the core of the expanded lineup is the SRO i-Line reflow platform, engineered for high-precision semiconductor and substrate processing. The system delivers exceptional temperature uniformity, tightly controlled heating zones, optimized cooling performance, and vacuum in combination with Formic Acid and Nitrogen, making it well suited for DCB/AMB substrate soldering, power module assembly, and other thermally demanding applications. Its stable heating technology ensures repeatable results across both development and production environments.

The portfolio also supports sintering, curing, and additional specialty thermal processes required for next-generation semiconductor devices. With programmable process control, data logging, and controlled atmosphere capabilities, the systems are built to meet strict quality, traceability, and performance standards.

A Dedicated Semiconductor Focus

The formation of Kurtz Ersa Semicon GmbH reflects the company’s long-term investment in microelectronics and semiconductor technology. By combining inline reflow platforms with batch vacuum systems, Kurtz Ersa now offers customers a coordinated path from R&D and pilot production to scalable manufacturing—while maintaining precise thermal control and documented process repeatability.

“Semiconductor manufacturers are facing tighter process windows and increasing reliability requirements,” said Ernie Grice, Vice President Sales at Kurtz Ersa, Inc. “With Kurtz Ersa Semicon GmbH, we are bringing together complementary technologies and focused expertise to deliver advanced thermal solutions tailored specifically for microelectronics and power electronics production.”

With decades of experience in thermal processing and a growing global presence, Kurtz Ersa continues to expand its capabilities to support the evolving needs of semiconductor manufacturers worldwide.

For more information about Kurtz Ersa and its semiconductor solutions, visit www.ersa.com.

ATLANTA, GA – The average index score reported by the ECIA’s February Industry Pulse survey shows sales optimism continuing to soar at lofty heights. Average sales sentiment inched up to 139.7 from 138.0 in January.

“This marks the ninth straight month of strong positive sentiment overall and in each of the major component categories,” observed ECIA Chief Analyst Dale Ford. “This is also the fifth consecutive month where every subcategory has registered robust positive results. The outlook for March points to expectations for continued robust strength with a projected overall score of 141.1. Results from the Q1 quarterly survey extend this expectation for a healthy sales climate all the way through the first half of 2026,” he continued. “The overall average share of survey respondents reporting positive sales growth was 71% in Q1 and 72% in Q2.

For the complete summary report, click here.

ECIA’s Industry Pulse: Electronic Component Trends and Sentiment provides highly valuable and detailed visibility on industry expectations in the near-term through the monthly and quarterly surveys. This “immediate” perspective is helpful to participants up and down the electronics components supply chain.

The complete ECIA Industry Pulse: Electronic Component Trends and Sentiment Report is delivered to all ECIA members as well as others who participate in the survey. All participants in the electronics component supply chain are invited and encouraged to participate in the report so they can see the highly valuable insights provided by the Industry Pulse: Electronic Component Trends and Sentiment report. The return on a small investment of time is enormous! Members can log in here to see the full report.

The monthly and quarterly Industry Pulse: Electronic Component Trends and Sentiment reports present data in detailed tables and figures with multiple perspectives and cover current sales expectations, sales outlook, product cancellations, product decommits and product lead times. The data is presented at a detailed level for six major electronic component categories, six semiconductor subcategories and eight end markets. Also, survey results are segmented by aggregated responses from manufacturers, distributors, and manufacturer representatives.

Non-members can now purchase the report at https://www.ecianow.org/purchase-stats-reports.

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