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NEWS

Global Enterprise Storage Systems Factory Revenue Up 2.1% in Q2

Global Enterprise Storage Systems Factory Revenue Up 2.1% in Q2

FRAMINGHAM, MA – Total worldwide enterprise storage systems factory revenue grew 2.1% year-over-year to $8.8 billion during the second quart...  Read More...

Smart Group’s European Conference Set for Sept. 22-23 at NPL

Smart Group’s European Conference Set for Sept. 22-23 at NPL

TEDDINGTON, LONDON – Smart Group is holding its European Conference Sept. 22 and 23 at the National Physical Laboratory here.  Read More...

CIRCUITS ASSEMBLY Announces 2016 NPI Awards

CIRCUITS ASSEMBLY Announces 2016 NPI Awards

SMYRNA, GA – CIRCUITS ASSEMBLY opened its 2016 New Product Introduction Awards (NPI) for printed circuit board assembly.  Read More...

ASM Inaugurates Brazil HQ

ASM Inaugurates Brazil HQ

ALPHAVILLE, BRAZIL – ASM Assembly Systems has inaugurated its Brazil headquarters, offering a tour and demonstrations to guests.  Read More...

IPC: Over 40% Opt for ICT on Products Using Test

IPC: Over 40% Opt for ICT on Products Using Test

BANNOCKBURN, IL – More than 40% of respondents to a recent IPC survey indicate use of ICT on products using test.  Read More...

EC Electronics Buys Subassembly Services

EC Electronics Buys Subassembly Services

BASINGSTOKE, ENGLAND – EC Electronics has acquired fellow EMS provider Subassembly Services for an undisclosed price.  Read More...

Foxconn Still Considering Facility in Indonesia

Foxconn Still Considering Facility in Indonesia

JAKARTA – Foxconn is disputing published reports that it has decided to forgo plans to invest in a facility here.  Read More...

Ace Opens Demo Site in Guadalajara

Ace Opens Demo Site in Guadalajara

GUADALAJARA, MEXICO – Ace Production Technologies is opening a demonstration center here in conjunction with one of its reps.  Read More...

Wearables Shipments Jump in Q2 on Apple Watch Demand

Wearables Shipments Jump in Q2 on Apple Watch Demand

FRAMINGHAM, MA – Total wearables shipment volume for the second quarter came to 18.1 million units, up 223.2% from a year ago.  Read More...

Q2 Global Ethernet Switch Market Revenues Up 1% YoY

Q2 Global Ethernet Switch Market Revenues Up 1% YoY

FRAMINGHAM, MA – The worldwide Ethernet switch market produced revenues of $5.8 billion in the second quarter, up 1% year-over-year and 7.6%...  Read More...

Fujitsu, Sify Ink Global ICT Agreement

Fujitsu, Sify Ink Global ICT Agreement

TOKYO – Fujitsu and Sify Technologies have signed a memorandum of understanding agreeing to a strategic partnership to provide global ICT so...  Read More...

N.A. PCB Orders Offer Promise for Future Growth

N.A. PCB Orders Offer Promise for Future Growth

BANNOCKBURN, IL — North American printed circuit board fabricators reported shipments rose 2.7% year-over-year in July.  Read More...

IPC Releases Conflict Minerals Due Diligence White Paper

IPC Releases Conflict Minerals Due Diligence White Paper

BANNOCKBURN, IL – IPC has released IPC-1081, Conflict Minerals Due Diligence White Paper.  Read More...

OMP Mechtron to Open South Carolina Manufacturing Facility

OMP Mechtron to Open South Carolina Manufacturing Facility

GILBERT, SOUTH CAROLINA – OMP Mechtron is investing $2.9 million to open a facility in here.  Read More...

Fabrinet Posts Record Q4 Revenue Up 29%

Fabrinet Posts Record Q4 Revenue Up 29%

PATHUMTANI, THAILAND – Fabrinet reported total fourth quarter revenue of $206.5 million, up 29% year-over-year, its highest quarterly revenu...  Read More...

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FEATURES

China in Charge

China in Charge

The 2014 ranking of the largest board fabricators reveals quiet but steady growth by domestic Chinese companies.  Read More...

US or Mexico: Which Option Makes Most Sense for Your Project?

US or Mexico: Which Option Makes Most Sense for Your Project?

Making accurate cost comparisons goes beyond hourly labor rates.  Read More...

Depaneling of Circuit Boards

Depaneling of Circuit Boards

A review of the impacts various methods have on the final product.  Read More...

Managing Your Environmental Waste

Managing Your Environmental Waste

An outline of procedures for determining and recycling hazardous material.  Read More...

Rigid-Flex PCB Design for an Innovative Helmet-Mounted Display

Rigid-Flex PCB Design for an Innovative Helmet-Mounted Display

Developing a wearable high-speed board with severe timing constraints.  Read More...

Advanced Acoustic Methods for Locating Flip Chip Faults

Advanced Acoustic Methods for Locating Flip Chip Faults

Echoes can reveal otherwise elusive defects beneath the die.  Read More...

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PRODUCTS

SPEA, Goepel Integrate Boundary Scan into SPEA3030 ICT

SPEA, Goepel Integrate Boundary Scan into SPEA3030 ICT

Boundary scan is now available in SPEA3030 multi-core in-circuit test. Boundary scan tests are now possible on all cores of the ICT (up to four). Can perform pa...  Read More...

Juki Introduces JX-350 SMT Placement Machine

Juki Introduces JX-350 SMT Placement Machine

JX-350 is a long board SMT placement machine. Is the successor to LED dedicated mounter JX-300LED. Reportedly improves the placement ability of diffusion lenses...  Read More...

Techspray Introduces Precision-V No-Clean Flux Remover

Techspray Introduces Precision-V No-Clean Flux Remover

Precision-V no-clean flux remover is nonflammable and non-ozone depleting. Works on no-clean, halide-free, rosin, and aqueous OA fluxes. Has low toxicity. Tech...  Read More...

Shenmao Introduces PF606-P26 Halogen-Free Solder Paste

Shenmao Introduces PF606-P26 Halogen-Free Solder Paste

PF606-P26 no-clean, halogen-free solder paste is said to prevent BGA non-wet opens and head-on-pillow defects. Is printable, wets and solders well even if BGA c...  Read More...

Master Bond Releases EP21NDCL Epoxy

Master Bond Releases EP21NDCL Epoxy

EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. ...  Read More...

Polyonics Develops XF-731, XF 732 Labels

Polyonics Develops XF-731, XF 732 Labels

XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elev...  Read More...

Manncorp Introduces RW1210 Rework System

Manncorp Introduces RW1210 Rework System

RW1210 rework system contains selectable operating modes that fully automate removal, placement, and soldering sequences. Includes enlarged board holder to han...  Read More...

FSInspection Unveils VERSAMag HD Inspection System

FSInspection Unveils VERSAMag HD Inspection System

VERSAMag high-magnification HD inspection system has a multi-axis, high-res camera that tilts and rotates for multiple angle inspection with an adjustable Z-hei...  Read More...

Nordson EFD Releases PICO Touch Controller

Nordson EFD Releases PICO Touch Controller

PICO Toµch controller reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts. Featur...  Read More...

Nordson EFD Introduces PICO Pulse Valve

Nordson EFD Introduces PICO Pulse Valve

PICO Pµlse non-contact jet valve reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz max. bursts...  Read More...

Techcon Systems Develops TS5624DMP Valve

Techcon Systems Develops TS5624DMP Valve

Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning....  Read More...

Nordson March Upgrades StratoSphere Series Plasma Treatment Equipment

Nordson March Upgrades StratoSphere Series Plasma Treatment Equipment

StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for i...  Read More...

Production Solutions Introduces Vault Tooling Part Holder

Production Solutions Introduces Vault Tooling Part Holder

Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can...  Read More...

Finetech Releases Martin MiniOven 05

Finetech Releases Martin MiniOven 05

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature ...  Read More...

Henkel Develops Gap Pad EMI 1.0 TIM

Henkel Develops Gap Pad EMI 1.0 TIM

Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy contr...  Read More...

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