-
PCB Designers Hold Smart Factories Ransom
Many companies have ended up “just living with” multiple, repeated PCB fabrication and assembly issues for years, regarding them as a given. If smart factories are to work, however, this has to change. Here’s how. READ MORE...
-
Savings and Efficiencies with Printed Silver Flexible Circuits
Historically, a designer’s only recourse as electronics packaging became denser was to incorporate flexible PCBs to route traces around 3D structures. Innovations in printing and component attach are seeing light, flexible printed silver circuitry in high-density applications where more costly traditional etched copper circuits were once exclusive. READ MORE...
-
Mitigation of Head-in-Pillow Defect
HiP (or HoP or ball in socket) is a solder joint defect that occurs mainly with BGA, CSP and package-on-package components. Most common causes of HiP defect relate to poor wetting or component warpage. Fortunately, there are solutions. READ MORE...
-
The Truth Behind Lean Materials
A common myth about Lean materials is they are not effective in high-mix scenarios. Advanced Lean material computerization can shave 30% of the logistics costs. READ MORE...
-
Automotive and Automation
In a year of stalled outsourcing – even mighty Foxconn took a step back – two sectors
continued to drive EMS forward. Who were 2016’s individual winners and losers? READ MORE...
Circuits Assembly Landing Page Showcase
PCB Designers Hold Smart Factories Ransom
Many companies have ended up “just living with” multiple, repeated PCB fabrication and assembly issues for years, regarding them as a given. If smart factories are to work, however, this has to change. Here’s how.
Savings and Efficiencies with Printed Silver Flexible Circuits
Historically, a designer’s only recourse as electronics packaging became denser was to incorporate flexible PCBs to route traces around 3D structures. Innovations in printing and component attach are seeing light, flexible printed silver circuitry in high-density applications where more costly traditional etched copper circuits were once exclusive.
http://circuitsassembly.com/ca/magazine/27542-additive-processing-1706.html
Mitigation of Head-in-Pillow Defect
HiP (or HoP or ball in socket) is a solder joint defect that occurs mainly with BGA, CSP and package-on-package components. Most common causes of HiP defect relate to poor wetting or component warpage. Fortunately, there are solutions.
http://circuitsassembly.com/ca/magazine/27514-soldering-1706.html
The Truth Behind Lean Materials
A common myth about Lean materials is they are not effective in high-mix scenarios. Advanced Lean material computerization can shave 30% of the logistics costs.
http://circuitsassembly.com/ca/magazine/27498-getting-lean-1706.html
Automotive and Automation
In a year of stalled outsourcing – even mighty Foxconn took a step back – two sectors
continued to drive EMS forward. Who were 2016’s individual winners and losers?http://circuitsassembly.com/ca/magazine/27413-ems-top-50-1705.html
