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Auto Dip is a compact semiautomatic Pb-free solder dipping machine, reportedly capable of processing a single board or pallets of up to 490 mm x 320 mm in 2 to 12 sec. Boards are placed on a fixtureless ultra-fine needle bed, which is said to retain PCBs without components being dislodged when dipped into the solder bath. Solder is applied while surface tension “floats” the boards at wetting height. Activation is controlled by microprocessor at adjustable intervals, or by foot pedal. A built-in motorized skimmer removes dross as needed. Adjustments exist for dwell time, temperature from 220º to 299 Cº, and dipping angle. Startup and shutdown times are controllable and can be preset for up to one week.

Manncorp, www.manncorp.com
The RFID Smart Reel Detection system uses RFID technology on reels of electronics components to complement traditional barcode labels during assembly. Is said to eliminate manual scanning of reels, by being automatically associated with feeders in a machine, offline setup area or storage location. Complements the Smart Feeder system.
 
Cogiscan Inc., www.cogiscan.com 

Firefly laser-based automated selective soldering includes a SMEMA-compatible board conveyor system and fiducial recognition. Includes integrated temperature control system that reportedly provides continuous feedback and displays thermal profiles clearly in real-time, then stores the profiles and images of each soldered point, ensuring complete traceability. Integrates VIP software.

Seica, www.seica.com 

Desktop systems for hot bar bonding applications use pulsed heat technology; can be used for hot bar reflow soldering, ACF bonding, heat-seal bonding and heat staking. Provide a method for joining flexible circuits, edge connectors, ribbon cables and PCMCIA connectors to PCBs or substrates. Are a series of modular systems consisting of a pulsed heat power supply (Uniflow), a pneumatic bonding head and a quick connect block with thermo-plane thermode. Modules are mounted on an adjustable frame. Can be upgraded with a left-right slide, front-rear slide, and a manual or pneumatic 2-position index table. Available options include camera alignment modules, Kapton or Silicon interposer feeders, water-cooling and fume extraction.

Miyachi Unitek, www.muc.miyachi.com 

Select Coat SL-940E conformal coating dispenser is said to have up to 30% faster throughput, a vision system, closed-loop process controls, traceability, and advanced integrated software. A motion system attains 750 mm per sec. speed and 1 g peak acceleration. Accommodates product sizes up to 500 mm. Enables velocity with up to 2 kg payload. Has a dispense area of 500 x 475 mm. Viscosity control system and SC-204 and SC-205 film coater modules are available. The Swirl Coat SC-300 applicator is a three-mode swirl system, while the PreciseCoat SC-400 jet applicator can be used for high selectivity applications. Downdraft and spill containment are integrated.
 
Asymtek, www.asymtek.com
The film base connector is said to provide a small space interconnection with high-density flexible circuits. Micro bump arrays built on thin film substrates reportedly reduce the thickness of the connection height by more than 70% to 300 µm thick for over 100 pins.
 
With printable flexible electronics, finer patterns than 30 µm line and space reportedly can be generated with smaller via holes than 80 µm diameters for double sides or multi-layer flexible circuits. The multiple screen printing processes enable embedded passive for all of LCR and active components with thin flexible substrates, including polyimide and polyethylene naphthalate films.
 
DKN Research, www.dknresearch.com 

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