While cheaper to use, uncoated stencils can have a detrimental effect on printing performance.

In a recent study focused on optimizing solder paste transfer efficiency, the initial phase used factory-applied coated stencils to isolate and understand the effects of solder alloy powder size on print performance. This approach ensured precise data by minimizing stencil-induced variations.

Our follow-up study explores the implications of using uncoated stencils, which are used in many manufacturing settings.

Factory-applied nanocoated stencils are designed to enhance the release of solder paste, while uncoated stencils are still widely used due to their cost-effectiveness. The choice between these stencils can play a significant role in determining the quality and efficiency of solder paste application.

STI Electronics prides itself on reliability and training the next generation of workers.

With its home just a few miles from a major military and aerospace testing center, STI Electronics has built a reputation for providing electronics that continue to work through the toughest conditions.

Now in its 43^rd year of operation, STI moved to Madison, AL, from California in 1993. The company settled into its current location – just down the road from Redstone Arsenal, a US Army base that houses NASA’s Marshall Space Flight Center and more than 75 federal agencies – in 2008.

The benefits of capillary flow underfills on solder joint reliability.

In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3-D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.

Underfill materials are essential in modern electronics manufacturing and are used extensively to enhance the reliability, performance and longevity of electronic assemblies. These materials improve mechanical strength by enhancing the physical bond between the chip and substrate, reducing the risk of solder joint failure due to mechanical stress.