A manufacturer’s perspective on determining parts layout.

A land pattern refers to the footprint or layout of surface-mount components on a printed circuit board (PCB). It includes the arrangement of pads, or lands, to which component leads or terminals will be soldered. An accurate land pattern is crucial for ensuring reliable solder joints, proper alignment of components and optimal electrical performance of the circuit. Most electronic component manufacturers provide detailed specifications and guidelines for creating land patterns specific to each component, which should be followed closely during PCB design.

Catching the stray solder paste.

Manufacturing defects in surface mount technology (SMT) assembly can prove persistent and challenging to diagnose without a structured troubleshooting approach. When a contract assembler encountered recurring solder balling on a single capacitor, initial efforts to correct the issue through reflow profile adjustments proved ineffective. This case study demonstrates how a systematic troubleshooting framework can effectively identify and resolve assembly defects.

The art of designing TFT modules in America is trending downward. It doesn’t have to.

In today’s rapidly evolving tech landscape, engineers may not be as well-informed on TFT module optimization as counterparts in Asia. (TFT modules are a type of liquid crystal display panel.) The knowledge gap can be attributed to various factors, leading to American-based EMS providers to operate with a less comprehensive understanding of the latest TFT technology. To the American EMS, it is worth considering the discrepancies in knowledge and areas to focus on.