BANNOCKBURN, IL – More than 40% of respondents to a recent IPC survey indicate use of ICT on products using test.

The trade group's annual study on quality benchmarks for electronics assembly also shows 10.4% of responding companies use flying probe, while 5.9% use boundary scan, and 3.7% indicate use of manufacturing defect analyzers.

The survey sampled 65 OEMs and EMS companies from the Americas, Europe and Asia, with annual sales ranging from under $10 million to more than $500 million.

IPC Study of Quality Benchmarks for Electronics Assembly 2015 addresses five groups of manufacturing and service measurements: production, quality control, customer satisfaction, supplier performance and certification status. Respondents reported on use of various electronics assembly test and inspection methods, including in-circuit testing, manufacturing defects analyzer, flying probe, boundary scan, automated optical inspection, x-ray inspection and final functional tests.

They also reported their average test and inspection results, such as first-pass yield, defect rate in defects per million opportunities and yield at final inspection.

Internal yields were reported for surface mounting, wave soldering and selective soldering. Data on average cost of poor quality was reported for rework and scrap.

The study also reports industry production data, including median numbers of printed board assemblies and components placed, as well as the proportion of surface mount and plated through-hole components placed.

The status of the industry’s major quality certifications received is covered. Customer satisfaction metrics such as returns and on-time delivery are also provided, in addition to supplier performance metrics for printed circuit board and component on-time deliveries and lot rejection rate.

New in this year’s report are demographic data on the participating companies’ production by end-use applications and IPC usage classes.

For more information, visit www.ipc.org/AssemblyBenchmark2015.

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