2017 Magazine Archives

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FEATURES

DfX
PCB Designers Hold Smart Factories Ransom
Many companies have ended up “just living with” multiple, repeated PCB fabrication and assembly issues for years, regarding them as a given. If smart factories are to work, however, this has to change. Here’s how.
by Michael Ford

ADDITIVE PROCESSING
Savings and Efficiencies with Printed Silver Flexible Circuits
Historically, a designer’s only recourse as electronics packaging became denser was to incorporate flexible PCBs to route traces around 3D structures. Innovations in printing and component attach are seeing light, flexible printed silver circuitry in high-density applications where more costly traditional etched copper circuits were once exclusive.
by Greg Kuchuris

SOLDERING
Mitigation of Head-in-Pillow Defect
HiP (or HoP or ball in socket) is a solder joint defect that occurs mainly with BGA, CSP and package-on-package components. Most common causes of HiP defect relate to poor wetting or component warpage. Fortunately, there are solutions.
by Jennifer Nguyen

GETTING LEAN
The Truth Behind Lean Materials
A common myth about Lean materials is they are not effective in high-mix scenarios. Advanced Lean material computerization can shave 30% of the logistics costs.
by Michael Ford

FIRST PERSON

• CAVEAT LECTOR
  The PCB tool continuum.
  Mike Buetow

MONEY MATTERS

• ROI
  Measuring customer service.
  Peter Bigelow
  

• FOCUS ON BUSINESS
  Finding workers in unexpected places.
  Susan Mucha
• GLOBAL SOURCING
  Best friend, best customer.
  Greg Papandrew

TECH TALK

• DATA TRANSFER
  Cutting the bottlenecks.
  Gary Carter
• SCREEN PRINTING
  Sub 0.4 area ratio paste release.
  Clive Ashmore
• DEFECTS DATABASE
  Where are the chips?
  Martin Wickham