TAIPEI, Oct. 11 -- Chip-on-board packages could get caught in an upward draft as image sensor modules in camera phones are switched from CSPs.

As much as 50% of camera phone models will be 1.3-megapixel type in 2005, DigiTimes reported today, citing market sources. The models will use COB packaging for CMOS-sensor modules, the Asian-based news service said.

Micron Technology and IC Media began offering COB CMOS sensors earlier this yer, DigiTimes said.