COB Seen for Camera Phones
Published: 12 October 2004
by Mike Buetow
TAIPEI, Oct. 11 -- Chip-on-board packages could get caught in an upward draft as image sensor modules in camera phones are switched from CSPs.
As much as 50% of camera phone models will be 1.3-megapixel type in 2005, DigiTimes reported today, citing market sources. The models will use COB packaging for CMOS-sensor modules, the Asian-based news service said.
Micron Technology and IC Media began offering COB CMOS sensors earlier this yer, DigiTimes said.
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