Circuits Assembly Magazine
FactoryLogix 2019.1 manufacturing execution software incorporates more customer-reported enhancements.
Master Bond EP29LPTCHT is a two-component, low-viscosity epoxy compound that can be used for underfill and encapsulation applications.
Inspectis software 5.0 offers overlay features, including a built-in DXF creator and editor for producing scaled overlay graticules.
Microcut 6080 offers positioning and cutting tailored to requirements of small apertures, for cutting exact openings with a size of 18μm on the laser entry side and 10μm on the exit side, in 30μm stainless-steel foil.
JNASE is for rework of 0402, 0201, 01005 and 008004 components.
ASM ProcessExpert consists of ASM ProcessLens 5-D SPI system and ASM ProcessEngine software.
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