Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes. 

Rigol DNA5000 and DNA6000 Series vector network analyzers support RF and microwave analysis across a frequency range from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations, the instruments support testing of passive components including filters, antennas, cables, dielectric materials, and high-speed interconnects. The analyzers offer dynamic range up to 127dB and low trace noise to support characterization of high-rejection devices and stable measurement performance. Fixture removal and de-embedding functions allow measurement correction for test fixtures, adapters, and cables, enabling direct S-parameter analysis of the device under test. Built-in analysis tools include limit testing, standing wave ratio (SWR) measurement, Smith chart display, and time domain reflectometry (TDR). An integrated calibration wizard guides setup procedures to support measurement repeatability across laboratory and production environments. The instruments feature a touchscreen interface and support HDMI, LAN, USB, and GPIB connectivity for integration with automated test systems. The compact DNA5000 Series targets bench-space-constrained environments, while the benchtop DNA6000 Series supports long-duration testing and automated production test configurations.

Summit LT150 rework system supports rework of components up to 150mm on large, high-density electronics assemblies. Platform includes a 150×150mm vision area that allows full-component viewing while enabling corner-level alignment during placement. System accommodates board sizes up to 24×36in, with optional configuration for larger formats. Rework platform provides up to 100mm top- and bottom-side clearance to allow access around tall connectors, heat sinks, and power modules commonly used in high-power assemblies. Thermal system combines a 4.4kW top heater with up to 11.2kW of bottom-side heating to support temperature uniformity across large component footprints. Dual PID control, programmable airflow, and a 1.5kW spot heater support thermal profile adjustment during rework operations. System developed for electronics manufacturing environments addressing large components used in AI and power electronics assemblies.

Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.