Circuits Assembly Online Magazine

NEWS

ACE Proposes Extension on Merger with Tempo Automation

SAN FRANCISCO – Following a merger announcement between Tempo Automation and ACE Convergence Acquisition Corp. in October, yesterday ACE fil... Read More...

NASA, Lockheed Martin, TTM Technologies Engineers Win Best Conference Papers for IPC Apex Expo

BANNOCKBURN, IL — Winners of the Best of Conference papers for IPC Apex Expo 2022 include the following: Read More...

Q4 Global PC Shipments Up 1%

NEEDHAM, MA – Worldwide shipments of traditional PCs (desktops, notebooks, and workstations) reached 92.7 million units during the fourth qu... Read More...

Q3 Electronic Component Sales Up 21% in the Americas

ATLANTA – The third quarter distributor total available market for electronic components built on the second quarter surge in sales growth f... Read More...

Scanfil to Expand Atlanta EMS Factory 50%

ATLANTA – Scanfil plans to increase its electronics manufacturing factory’s production area 50% here, according to reports. The production s... Read More...

Dixon Forms JV with Rexxam to Manufacture PCBs for ACs

UTTAR PRADESH, INDIA – Dixon Technologies formed a joint venture with Rexxam to manufacture PCBs for air conditioners for the global market,... Read More...

Teltonika to Open EMS Center in Lithuania

MOLETAI, LITHUANIA – Electronics manufacturer Teltonika began construction on its technology center here, expected to be completed in the la... Read More...

Naprotek Acquires Nexlogic

SAN JOSE – Naprotek completed the acquisition of NexLogic for an undisclosed sum. The addition expands Naprotek's capabilities into microele... Read More...

AIM Acquires UK Solder Distributor BLT Circuit Services

CRANSTON, RI – AIM Solder has acquired its UK distributor BLT Circuit Services, which also manufactures consumable products for the printed ... Read More...

FEATURES

State-of-the-Art Technology Flashes

Updates in silicon and electronics technology. Ed.: This is a special feature courtesy of Binghamton University. Next-gen chips will be powered from below. As... Read More...

Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change?

A series of experiments test the well-known area ratio rule. A stencil aperture’s area ratio (AR) is a simple calculation that divides the area of the aperture... Read More...

Understencil Wipe Cleaning Yield Improvements

A study of the behavior of flux-stencil interactions. Understencil wiping has gained increased interest over the past several years. Changes in circuit design ... Read More...

Will ECAs Finally Stick?

A new study reveals emerging applications for attaching very-fine-pitch parts using low-temp methods. Electrically conductive adhesives (ECAs) have been toute... Read More...

Leveraging Systems and Processes to Evolve NPI

A cross-functional team approach for completing prototypes and ramping to production. Faster, better, cheaper has always been a mantra in electronics manufactu... Read More...