Extending stencil cleaning intervals to 50 prints maintained consistent deposition while improving throughput and reducing downtime.

Solder paste printing is an essential part of the electronics manufacturing process. Having a solder paste that can print high solder paste volumes with high repeatability of paste volume will improve process yields. Solder paste inspection is used to validate paste printing volumes and consistency of printed paste deposition. During paste printing, under stencil cleaning is employed to ensure high printed paste volumes are maintained between board prints to reduce printing defects. The frequency of under stencil cleaning varies based on the solder paste used, the product board type, the stencil thickness and stencil aperture openings used during paste printing.

What tight supply and rising costs mean for your sourcing strategy.

The first quarter of 2026 made clear that the semiconductor market is no longer moving in a normal cycle. Instead of supply rising and falling evenly across industries, we’re seeing a structural shift in how chips are produced and distributed.

How DfX eliminates the hidden costs in product design and development.

OEMs outsource manufacturing to control costs and accelerate product delivery. But by the time designs are transferred to a chosen manufacturer, many opportunities for optimization and cost savings have been lost.

A smarter path is to partner early with an EMS provider that offers robust DfX (design for excellence) capabilities – a team that understands not just how to build your product, but how to design to build.