A noted solutions architect offers an audacious plan for AI acceptance. It just might work.

The talk of AI-based printed circuit design – and the idea that artificial intelligence could theoretically design a board faster and more efficiently than a human – has inevitably led to the fear that designers will be replaced by their algorithmic counterparts.

Smaller components do not always need a smaller paste.

As components shrink in size, the demand for finer solder pastes increases. But the selection of solder paste is not just about matching component size; it’s also about optimizing printing and reflow processes to prevent defects and ensure reliability.

Here we explore the significance of solder paste powder size, particularly when and why manufacturers should consider downsizing from standard types to finer alternatives.

Types of TIMs and their application methods.

As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has become a critical challenge. Thermal interface materials (TIMs) are pivotal in ensuring efficient thermal management by facilitating heat transfer between heat-generating components and heat-dissipating devices. Here, we examine the various types of TIMs and their application methods, including insights into modern dispensers and the advantages and disadvantages of these methods in electronics manufacturing.