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CA Magazine Issues
2020 Issues
2020 Issues
December 2020
Details
Written by
Mike Buetow
Published: 19 January 2021
High-reliability low-temperature solder alloys
The CIRCUITS ASSEMBLY EMS Company of the Year
Why you should consider a certification program
Apertures for 01005 components
Process questions to ask before taking action
When through-hole connectors move
A look back at friends and colleagues who left us in 2020
Download the pdf
November 2020 Issue
Details
Written by
Mike Buetow
Published: 28 October 2020
Solder mask and low-standoff component cleaning
Counterfeit components: Attack of the clones
Low-temperature solders under x-ray PCB delamination root causes
PCB delamination root causes
The cost-reduction conundrum
Will the US support R&D in manufacturing?
The time is now for a new US tech policy
Advanced packages in portable products
Download the pdf
October 2020 Issue
Details
Written by
Mike Buetow
Published: 28 October 2020
Test methods to identify counterfeit MLCCS?
Five ways to ensure seamless program transfer
Solder joint corrosion causes
Stencil life
Covid: The ultimate organizational stress test
Is your customer service costing you customers?
Download the pdf
August 2020 Issue
Details
Written by
Mike Buetow
Published: 28 July 2020
BGA package inspection using x-ray and ultrasound
Leveraging systems and processes to evolve NPI
Recommendations for ensuring long-term access to key component packages
Rethinking and repurposing marketing dollars
Navigating the flex circuit roadmap
Remote access to process equipment
Lifted parts, their causes and remedies
Low-temperature solders
Download the pdf
September 2020 Issue
Details
Written by
Mike Buetow
Published: 28 August 2020
Enabling technologies for medical electronics
The world's largest printed circuit board fabricators
Updates in silicon and electronics technology
The role of AR and VR in longer, better lives
Will the OSP spec finally be finished?
Leveraging the IT department to reduce operation-caused variation
X-ray images and the dangers of overmodification
High-temperature soldering of through-hole connectors
Who audits the auditors?
Download the pdf
May 2020 Issue
Details
Written by
Mike Buetow
Published: 26 April 2020
The CIRCUITS ASSEMBLY Top 50 largest EMS companies
Qualified manufacturing process development by applying IPC J-STD-001G cleanliness standard
An hour-by-hour look at the quickturn fabrication process
Component wettability tests
The factory pf the future, and what flexibility really buys us
Factory automation and Lean Six Sigma
Your PCB supplier was acquired. What now?
A Covid crisis? Or just poor management?
Download the pdf
DECEMBER ISSUE
View the Digital
Edition Here!
Press Releases
ViTrox Welcomes Gemaddis as a New Sales Channel Partner in France
NCMS Releases White Paper: “Artificial Intelligence to Improve Supply Chain Resilience Throughout American Manufacturing”
E-tronix Expands Team with Strategic Hires to Strengthen Technical Solutions Support in 2025
Leading Defence Manufacturer Awards Kitron Order for Deliveries to U.S. Army
POPULAR
Editorial Contributions
Verifying PCBA Cleanliness with Ion Chromatography
Filling the Gap: Underfill Materials Dispensing for Electronics
Ensuring Optimal Performance of Solder Paste in Challenging Environments
When to Downsize Solder Paste Powders
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