August 2020 Issue
Published: 28 July 2020
by Mike Buetow
- BGA package inspection using x-ray and ultrasound
- Leveraging systems and processes to evolve NPI
- Recommendations for ensuring long-term access to key component packages
- Rethinking and repurposing marketing dollars
- Navigating the flex circuit roadmap
- Remote access to process equipment
- Lifted parts, their causes and remedies
- Low-temperature solders
- Download the pdf
Press Releases
- NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
- Cofactr Democratizes their Complete Procure-to-Ship Automation Service at a Pivotal Moment for US, Unlocking Support for Agile Hardware Manufacturers in America—with No Upfront Costs
- Semi-Kinetics Adds 2nd Pemtron X-Ray Inspection and Component Counting Capabilities as Part of California Expansion
- The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver