August 2020 Issue
Published: 28 July 2020
by Mike Buetow
- BGA package inspection using x-ray and ultrasound
- Leveraging systems and processes to evolve NPI
- Recommendations for ensuring long-term access to key component packages
- Rethinking and repurposing marketing dollars
- Navigating the flex circuit roadmap
- Remote access to process equipment
- Lifted parts, their causes and remedies
- Low-temperature solders
- Download the pdf
Press Releases
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments
- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments
- NEOTech CEO Emphasizes Workforce Investment and Nearshoring Strategy for 2025
- Cybord’s Visual AI Solution to Be Integrated with Siemens’ Opcenter MES; Markus Sauter and Oshri Cohen Comment