Given the extended time frames required to build fab infrastructure and enhance workforce skills, semiconductor companies need a long-term strategy for achieving design and manufacturing excellence—one that considers construction issues, equipment costs, and the need to enhance internal capabilities. Here’s a road map for moving forward.
YINCAE Advanced Materials
With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However, there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue.
In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability.The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper.
Nordson March research evaluated the effects of RF plasma processing prior to conformal coating on adhesion, conformity of coverage, and electrical functionality.
This paper sets out to explain the value of -- and the path to -- smarter reflow ovens. It discusses trends such as Industry 4.0, Smart Factory, IoM and IoT as well as offers an explanation of benefits that can be gained by making ovens smarter and connected.
Successful data acquisition for barcode reading or part inspection depends on the ability of the data acquisition device, such as a barcode reader or machine vision camera, to function at peak performance within the restrictions of the application. In applications where barcode reading or machine vision inspection processes are embedded inside of equipment, limited integration space puts a unique set of restric¬tions on how a device can be installed, not to mention demands on the size and capabilities of the device itself. Before installation, it is important to choose a device with optimal specifications to ensure inspections can be done accurately and consistently throughout the life of the machine. This white paper outlines the five things an engineer should know before choosing a data acquisition device for embedding into equipment, including:
1. Barcode Type and Orientation
2. Inspection Requirements
3. Application Speed
4. Integration Space
5. Data Communication Needs
This white paper has been written as a follow-up to our well-received CE marking paper. It is intended to give the reader an overview of the journey from idea to
CE marking your new product is not as difficult or as expensive as you probably think. Many entrepreneurs worry that the process will drain them of cash, bury them in regulation and paperwork and leave them exposed if they do not do it exactly right. If you are clever about it, it is none of these.