New Product Introduction

By ASM Siplace

New product introductions (NPIs) involve complex processes. This new publication presents solutions for everyday challenges, lots of tips and tricks, and a convenient checklist for the NPI process. It is directed toward manufacturers who want to implement robust NPI processes in their high-mix electronics production environments with consistent tool chains in order to raise the efficiency and quality of their new product introductions, which occur with increasing frequency. Readers will learn how even the first yield can be produced efficiently and error-free despite faulty Gerber data, incomplete bills of material, and missing or late component descriptions.

"Decision Factors of China's Engineers"

by SupplyFrame and EEFocus

Abstract: Price, availability and familiarity are the main factors behind purchasing decisions of Chinese electronics engineers. The firms talked with 862 Chinese engineers, and the results "strongly suggest that a marketing strategy should emphasize an electronics company’s reputation for quality, ability to provide materials that shorten design time, and commitment to personal technical support," the companies said in a press release.

"Electronics organizations that sell into the China market can leverage the findings of our study to influence decision makers and uncover opportunities to land more design wins," said SupplyFrame Vice President of Worldwide Sales, John Schirmer. "For example, the study reveals what kinds of sites electronics professionals use to research, buy, and make design decisions. Based on the data, companies can understand where to best reach engineers and buyers during the design cycle."

57 pages. Released June 2012.

SMT Placement for ICs, Connectors and Odd-Shaped Components

by Gerry Padnos, Juki Automation Systems

Abstract: Accurate component placement is a basic requirement for any pick-and-place machine. The first step
toward accurate placement is accurate centering, or measurement of the component’s position on the
placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped
components are a camera based system that measures the component position relative to a known
point. Camera based centering systems include three main elements: lighting, camera, and software.
Each of these elements are critical to obtaining an accurate measurement of the component and
ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as
strong as its weakest link.

Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-­to-Use Format

by Art Ackerman and Jason Brandi, Henkel Electronic Materials

Abstract: When considering which thermal management materials are the right products for the task, top-­of-­mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well-­-known? For certain applications, there’s one class of materials that may be more suitable than any of the more common thermal management products. In fact, these materials may be the only solution in some cases. We're talking about thermal adhesive films (often referred to as assembly adhesive films) and their advantages are many, especially when there is a requirement for bonding large areas or complex parts together.

Though thermal adhesive films are most often found in the defense and automotive markets, the advantages they deliver can extend to any application where robust thermal and electrical performance, voide-free bond lines and controlled thicknesses are required. For certain products, thermal adhesive films are quite simply the only thermal management solution.

June 12, 2012

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

by Neil Poole, Ph.D. and Brian Toleno, Ph.D., Henkel

Abstract: As use of ultra fine-pitch devices grows and the industry moves from 0201s to 01005s and from 0.4mm CSPs to 0.3mm CSPs, prevailing Type 3 solder pastes will no  longer be sufficient to address smaller deposit volume requirements.   Simply moving  from Type 3 to Type 4, however, will not necessarily deliver the desired result either. It  is critical that the Type 4 materials are optimized for today’s miniaturization demands. 

In this instance, optimizing means tightly controlling not only the particle size but the  distribution of those particles within the material as well.  While current industry  standards tend to be a bit unclear as to allowable particle size in the upper end of the  range, the published IPC J-STD-006A is fairly liberal with the distribution range of particle sizes. But, recent testing has suggested that a tighter distribution range and a smaller upper limit particle size may prevent some problems  down the line.

Current work has focused on not only condensing the distribution and size range of the Type 4 particles, but also on producing the powder in such a way that the integrity of the surface finish is maintained, as this is also essential to lowering oxidation risk. The smaller particles of Type 4 materials make for a higher surface are to volume ratio which, in turn, introduces more opportunity for oxidation. Left uncontrolled, the oxidation can lead to a variety of performance issues including non-coalescence, poor wetting, and/or graping (more on that later), just to name a few.  New powder production technology, however, has delivered consistent, smooth surfaces even on powder spheres less than 35 microns in diameter.