caLogo

NEWS

Reshoring Job Announcements Continue Record Growth in H1

Reshoring Job Announcements Continue Record Growth in H1

SARASOTA, FL – Reshoring and foreign direct investment job announcements continued their record-breaking run in the first half of 2023, acco...  Read More...

Q3 Semiconductor Equipment Billings Drop 11%, SEMI Reports

Q3 Semiconductor Equipment Billings Drop 11%, SEMI Reports

MILPITAS, CA – Global semiconductor equipment billings contracted 11% year-over-year to $25.6 billion in the third quarter, while quarter-ov...  Read More...

Worldwide Smartphone Shipments to Grow 7% in Q4, Says IDC

Worldwide Smartphone Shipments to Grow 7% in Q4, Says IDC

NEEDHAM, MA – Worldwide smartphone shipments are forecast to see 7.3% year-over-year growth in the fourth quarter, according to IDC's Worldw...  Read More...

WSTS Forecasts Semiconductor Market Contraction in 2023, Recovery in 2024

WSTS Forecasts Semiconductor Market Contraction in 2023, Recovery in 2024

MORGAN HILL, CA – The World Semiconductor Trade Statistics organization has revised its 2023 forecast for the global semiconductor market, a...  Read More...

Escatec Appoints New CEO

Escatec Appoints New CEO

PENANG, MALAYSIA – Escatec's board of directors has appointed Charles-Alexandre Albin chief executive officer, effective March 31, 2024.  Read More...

Nano Dimension Reports 22% Q3 Revenue Increase

Nano Dimension Reports 22% Q3 Revenue Increase

WALTHAM, MA – Nano Dimension reported revenue of $12.2 million in the third quarter, up 22% compared to the same quarter in 2022.  Read More...

PE Firm Invests in Oregon's SisTech Manufacturing

PE Firm Invests in Oregon's SisTech Manufacturing

NASHVILLE, TN – LFM Capital has announced an investment in SisTech Manufacturing, a printed circuit board assemblies manufacturer for defens...  Read More...

Syrma Sets Up Semiconductor Unit

Syrma Sets Up Semiconductor Unit

CHENNAI, INDIA – Syrma SGS Technology has formed a semiconductor-focused subsidiary, named Syrma Semicon, according to a filing with the Bom...  Read More...

Foxconn to Invest $1.5B in India

Foxconn to Invest $1.5B in India

TAIPEI – Foxconn will invest more than $1.5 billion in an Indian construction project to fulfill its “operational needs,” the company announ...  Read More...

«
»

FEATURES

5G Open Radio Unit White Box

5G Open Radio Unit White Box

An overview of the design and development process. 5G radio networks provide increased bandwidth at the expense of reduced range. To compensate for the reduced...  Read More...

Will IC Package Substrate Makers be Next to Rule?

Will IC Package Substrate Makers be Next to Rule?

Massive investment suggests the segment could occupy a major portion of the largest fabricators' production. The heartbreak of the pandemic of 2020-21 is reced...  Read More...

The Power of Personal Branding: Creating an Authentic and Sustainable Perception

The Power of Personal Branding: Creating an Authentic and Sustainable Perception

Learn from successful entrepreneurs and specialists at the annual Women’s Leadership Program. We can find heroes all around us, but we will challenge you to lo...  Read More...

Closed-Loop Process Optimization between Screen Printer and SPI in an SMT Line

Closed-Loop Process Optimization between Screen Printer and SPI in an SMT Line

An experiment investigating print alignment adjustments. Printed circuit board assembly requires extraordinary precision and repeatability. The screen printing...  Read More...

3-D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies

3-D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies

A design, equipment, process and materials methodological approach. Electronics for automotive applications, as well as for other industries, are expected to r...  Read More...

Selectively Assembling High-Value Components Based on Warpage in Order to Improve Reliability

Selectively Assembling High-Value Components Based on Warpage in Order to Improve Reliability

Can predicting board and part flatness at critical points in the reflow/reliability profile reduce failures? Surface warpage, or flatness, is an established so...  Read More...

Public Sector Efforts ‘Chip Away’ at PCB Funding Deficit

Public Sector Efforts ‘Chip Away’ at PCB Funding Deficit

The PCBAA is ramping up efforts to secure funding for R D and capacity in the US. What constitutes the printed circuit board industry? And how much, if any, in...  Read More...

A Plethora of Pitches

A Plethora of Pitches

The unstructured evolution of integrated circuit package technology (and its consequences). I purchased my first "integrated circuit" around 1957, wh...  Read More...

The Heat is On

The Heat is On

Claire Wemp is hot on the trail of better thermal interface materials and more engineering roles for women. Thermal interface materials (TIM) are used between ...  Read More...

«
»

PRODUCTS

Hirose Releases SMT Wire-to-Board Connector

Hirose Releases SMT Wire-to-Board Connector

Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.  Read More...

AIM Rolls Out NC259FPA Solder Paste

AIM Rolls Out NC259FPA Solder Paste

AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertur...  Read More...

Master Bond Releases UV23FLDC-80TK Dual Cure Epoxy

Master Bond Releases UV23FLDC-80TK Dual Cure Epoxy

Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.  Read More...

Tagarno Launches T50 Digital Microscope

Tagarno Launches T50 Digital Microscope

Tagarno's T50 digital microscope is equipped with a 4K/60FPS block camera to provide users with a seamless and lag-free viewing experience.  Read More...

Nordson Releases Asymtek SL-1040 Conformal Coater

Nordson Releases Asymtek SL-1040 Conformal Coater

Nordson Electronics Solutions' Asymtek Select Coat SL-1040 conformal coating system includes system-level advancements to elevate automation, control, precision...  Read More...

Kurtz Ersa Rolls Out Powerflow Ultra

Kurtz Ersa Rolls Out Powerflow Ultra

Kurtz Ersa's Powerflow Ultra wave soldering machine features a new soldering module that can achieve speeds of up to 5mm/s.  Read More...

Kurtz Ersa Launches Versaflow One X-Series

Kurtz Ersa Launches Versaflow One X-Series

Kurtz Ersa's Versaflow One X-Series of selective soldering machines offers the option of two pots per soldering module, and can process up to eight assemblies (...  Read More...

Mek Launches SpectorBOX X1 AOI

Mek Launches SpectorBOX X1 AOI

Mek's SpectorBOX X series is a modular full 3-D AOI system for Through-Hole Technology (THT) solder joints and THT components.  Read More...

Murata Manufacturing Releases 1µF Capacitance Ceramic Capacitor

Murata Manufacturing Releases 1µF Capacitance Ceramic Capacitor

Murata Manufacturing's GRM188D72A105KE01 multilayer ceramic capacitor is said to feature the world's largest capacitance of 1µF in a 1608M (1.6 x 0.8mm) size. ...  Read More...

«
»

PCB Chat

Tweets by Mike Buetow

Tweets by Mike Buetow

Don't have an account yet? Register Now!

Sign in to your account