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NEWS

PCEA Opens Registration for PCB Detroit Conference

PCEA Opens Registration for PCB Detroit Conference

PEACHTREE CITY, GA – Registration for PCB Detroit, a new technical conference and tabletop event, is now open, the Printed Circuit Engineeri...  Read More...

Lacroix Sees 12% Drop in Annual Electronics Revenue

Lacroix Sees 12% Drop in Annual Electronics Revenue

SAINT-HERBLAIN, FRANCE – Lacroix reported €494.3 million in annual revenue for its Electronics segment, down 12.1% from 2023's total.  Read More...

Foxconn Sees 3% Climb in January Revenue

Foxconn Sees 3% Climb in January Revenue

TAIPEI – Foxconn's January revenue rose 3.16% year-over-year to NT$538.7 billion ($16.4 billion), the second-highest total the company has r...  Read More...

Mycronic's Q4 Sales Rise on SMT Gains

Mycronic's Q4 Sales Rise on SMT Gains

TABY, SWEDEN -- Mycronic reported fourth quarter net sales increased 5% to SEK 2.1 billion ($191.9 million). Based on constant exchange rate...  Read More...

SVI Public Co. Sees 1% Rise in Q4 Revenue

SVI Public Co. Sees 1% Rise in Q4 Revenue

BANGKOK -- SVI Public Company reported consolidated revenue for the fourth quarter was THB 5.34 billion ($157.4 million), down 4% sequential...  Read More...

Keytronic Q2 Revenue Drops on Lower Demand, Parts Shortages

Keytronic Q2 Revenue Drops on Lower Demand, Parts Shortages

SPOKANE VALLEY, WA — Key Tronic reported fiscal second revenue of $113.9 million, down from $147.8 million the same period of 2024.  Read More...

SIA: Semi Sales Up Huge in Q4

SIA: Semi Sales Up Huge in Q4

WASHINGTON — The 90-day moving average global semiconductor sales hit $170.9 billion in the fourth quarter, 17.1% more the year ago period a...  Read More...

AIM Solder Acquires Solder Assembly Materials Firm Canfield Technologies

AIM Solder Acquires Solder Assembly Materials Firm Canfield Technologies

CRANSTON, RI – AIM Solder has acquired the assets of Canfield Technologies, a fellow producer of solder assembly materials.  Read More...

ITW's Electronics Unit Sales Rise 2% in Q4

ITW's Electronics Unit Sales Rise 2% in Q4

GLENVIEW, IL -- Illinois Tool Works today reported fourth quarter revenue at its Test Measurement and Electronics segment was $747 million...  Read More...

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FEATURES

Understanding Solder Paste Viscosity and Thixotropy

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe...  Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ...  Read More...

‘It’s Got to Work’

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te...  Read More...

Comparing Coated vs. Uncoated Stencils

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef...  Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ...  Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the...  Read More...

Keeping Electronics Cool

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec...  Read More...

When to Downsize Solder Paste Powders

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ...  Read More...

Royalty Flush

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art...  Read More...

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PRODUCTS

ECD Launches M-VP Vapor Phase Soldering Barrier

ECD Launches M-VP Vapor Phase Soldering Barrier

ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.  Read More...

Hirose Releases DF53 Series Connector

Hirose Releases DF53 Series Connector

Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.  Read More...

MacDermid Alpha Releases Alpha HiTech CF31-4026 Edgebond

MacDermid Alpha Releases Alpha HiTech CF31-4026 Edgebond

MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-perform...  Read More...

Kyocera AVX Releases SpiCAT SpiSCAP Simulation Software

Kyocera AVX Releases SpiCAT SpiSCAP Simulation Software

SpiCAT SpiSCAP online engineering simulation software is for evaluating and selecting SCC and SCM Series supercapacitors for power challenges in industrial, ene...  Read More...

Yamaha Robotics Introduces Surface-Mounter Options

Yamaha Robotics Introduces Surface-Mounter Options

Yamaha Robotics added three hardware-based performance options for high-speed mounters that enhance productivity, quality control, and flexibility for handling ...  Read More...

Würth Launches Vibration-Resistant Capacitors

Würth Launches Vibration-Resistant Capacitors

Würth Elektronik's Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors are now available in vibration-resistant versions in their SMT variants.  Read More...

SV Microwave Rolls Out Angled Solderless Connectors

SV Microwave Rolls Out Angled Solderless Connectors

SV Microwave's 30° solderless PCB compression mount connectors are able to attain edge launch-like performance anywhere on the board.  Read More...

Henkel Releases Loctite AA 3952 and SI 5057 Adhesives

Henkel Releases Loctite AA 3952 and SI 5057 Adhesives

Henkel's Loctite AA 3952 and Loctite SI 5057 light cure adhesives are designed to bond TPE substrates and overcome the limitations of traditional assembly metho...  Read More...

Vishay Releases TSM3 SMD Trimmers

Vishay Releases TSM3 SMD Trimmers

Vishay Intertechnology's TSM3 multi-turn, surface-mount cermet trimmers are designed for space-constrained industrial, consumer and telecom applications in hars...  Read More...

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