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NEWS

Éolane Expands in Estonia

Éolane Expands in Estonia

LASNAMAE, ESTONIA – Éolane’s subsidiary here opened a 118,000 sq. ft. manufacturing plant in Lasnamäe, Tallinn. The second-largest France-ba...  Read More...

Master Bond Offers White Paper on Low CTE Adhesives

Master Bond Offers White Paper on Low CTE Adhesives

HACKENSACK, NJ – Master Bond is offering a white paper that explains the importance of low CTE adhesives.  Read More...

Plexus Reports Fiscal Q1 Revenue Up 13%

Plexus Reports Fiscal Q1 Revenue Up 13%

NEENAH, WI – Plexus reported fiscal first quarter revenue of $765.5 million, up 13% year-over-year and down 0.73% sequentially.  Read More...

ECIA Updates 2-D Barcode Labeling Specification

ECIA Updates 2-D Barcode Labeling Specification

ALPHARETTA, GA – The Electronic Components Industry Association updated its 2-D barcode labeling specification.  Read More...

All Circuits Expands EMS Ops to Guadalajara

All Circuits Expands EMS Ops to Guadalajara

GUADALAJARA, MEXICO -- All Circuits opened a new factory here on Friday, part of its strategy to become a global EMS company.  Read More...

Global NAND Flash Capex to Dip 2% in 2019

Global NAND Flash Capex to Dip 2% in 2019

TAIPEI CITY – Total capital expenditures in the global NAND flash industry is expected to be $22 billion in 2019, down about 2% year-over-ye...  Read More...

IDC: Q4 PC Shipments Down Nearly 4%

IDC: Q4 PC Shipments Down Nearly 4%

FRAMINGHAM, MA – Fourth quarter shipments of traditional PCs (desktops, notebooks, and workstations) totaled more than 68.1 million units, d...  Read More...

IPC, WHMA Form Alliance

IPC, WHMA Form Alliance

BANNOCKBURN, IL – IPC and the Wire Harness Manufacturer’s Association entered into an affiliation agreement. The boards of the respective tr...  Read More...

Gartner: Global Semi Revenue Up 13% in 2018

Gartner: Global Semi Revenue Up 13% in 2018

STAMFORD, CT – Worldwide semiconductor revenue totaled $476.7 billion in 2018, a 13.4% increase over 2017, according to Gartner.  Read More...

Foxconn’s December Revenue Down 8%

Foxconn’s December Revenue Down 8%

TAIPEI – Foxconn reported December revenue fell 8% to $20.1 billion. This is the firm’s first year-over-year monthly revenue drop in 10 mont...  Read More...

ATA IMS Expanding SMT, Plastic Molding Operations

ATA IMS Expanding SMT, Plastic Molding Operations

JOHOR BAHRU, JOHOR, MALAYSIA -- ATA IMS will add at least six SMT lines in 2019 as part of a major expansion, the firm said this week.  Read More...

Near-Term Slowdown Won't Stop VS Industry Expansion

Near-Term Slowdown Won't Stop VS Industry Expansion

KUALA LUMPUR -- VS Industry is working on a pair of new facilities with a combined 300,000 sq. ft. of production floor space to meet anticip...  Read More...

Global Spending on 3D Printing to Increase 21% in 2019

Global Spending on 3D Printing to Increase 21% in 2019

FRAMINGHAM, MA – Global spending on 3D printing, including hardware, materials, software, and services, is expected to increase 21.2% year-o...  Read More...

East West Manufacturing Makes 2d EMS Deal in Past 4 Months

East West Manufacturing Makes 2d EMS Deal in Past 4 Months

ATLANTA -- East West Manufacturing has acquired EMS provider General Microcircuits in a deal between privately held companies.  Read More...

Private Equity Firm to Acquire PCI for $150M Cash

Private Equity Firm to Acquire PCI for $150M Cash

SINGAPORE – A private equity firm is acquiring EMS firm PCI in an all-cash offer of $150 million, according to reports.  Read More...

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FEATURES

From the Archives: Design and Assembly of 01005 Passives Using Pb-Free Solder

From the Archives: Design and Assembly of 01005 Passives Using Pb-Free Solder

This study finds a process similar to 0201 parts, with a 100 µm thick stencil and a nitrogen environment.  Read More...

As-Shipped vs. Mounted Height for BGA and LGA Packages

As-Shipped vs. Mounted Height for BGA and LGA Packages

A methodology to calculate solder joint height is used to conduct a tolerance analysis on BGAs.  Read More...

It’s Not Easy Being Green Circuits

It’s Not Easy Being Green Circuits

Silicon Valley’s choice for one-stop shoppers is gaining a national reputation for handling the toughest boards.  Read More...

SMT 4.0 and CTF

SMT 4.0 and CTF

AI Industry 4.0-aided manufacturing should incorporate CTF quality methodology.  Read More...

Jet-Printed Solder Paste and Cleaning Challenges

Jet-Printed Solder Paste and Cleaning Challenges

Are process settings for Type 3 and 4 pastes sufficient for Type 5 and 6 too?  Read More...

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PRODUCTS

Bowman Rolls Out G Series XRF

Bowman Rolls Out G Series XRF

G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.  Read More...

KIC, iTAC Integrate Smart Reflow Process Data into iTAC.MES.Suite i4.0 Software

KIC, iTAC Integrate Smart Reflow Process Data into iTAC.MES.Suite i4.0 Software

Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.  Read More...

Zestron Releases Zestron Eye Mobile Bath Monitor

Zestron Releases Zestron Eye Mobile Bath Monitor

Zestron Eye Mobile monitors concentration of multiple cleaning processes.  Read More...

Yamaha Launches YSP10 Solder Paste Printer

Yamaha Launches YSP10 Solder Paste Printer

YSP10 solder paste printer has an automatic changeover system.  Read More...

Grieve Releases No. 934 Cabinet Oven

Grieve Releases No. 934 Cabinet Oven

No. 934 is an 850°F cabinet oven used for heat treating.  Read More...

EMS Introduces TM-6520 Adhesive

EMS Introduces TM-6520 Adhesive

TM-6520 low-temperature cure adhesive is designed for die attach and general PCB assembly applications. Is electrically insulating.  Read More...

Domino Printing Unveils CL125, BK129 UV-Activated Inks

Domino Printing Unveils CL125, BK129 UV-Activated Inks

CL125 clear UV-activated ink enhances security of internal track and trace processes.  Read More...

Nordson Select Debuts Integra 508.3 Selective Soldering System

Nordson Select Debuts Integra 508.3 Selective Soldering System

Integra 508.3 multistation selective soldering system is for high-volume applications.  Read More...

FKN Systek Introduces S300 Depaneling Saw

FKN Systek Introduces S300 Depaneling Saw

S300 multiple blade depaneling saw is for singulating assembled PCBs.  Read More...

Aegis Offers CFX-Enabled FactoryLogix

Aegis Offers CFX-Enabled FactoryLogix

FactoryLogix MES software now leverages the IPC Connected Factory Exchange (CFX) standard from data acquisition to analytics and process control automation.  Read More...

Kester Rolls Out NP505-LT Solder Paste

Kester Rolls Out NP505-LT Solder Paste

NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.  Read More...

VJ Electronix Upgrades Summit LXi Rework System

VJ Electronix Upgrades Summit LXi Rework System

Summit LXi large board rework system is now available with an optional 650mm x 1200mm board support table.  Read More...

SCS Develops ParyFree Parylene Coating

SCS Develops ParyFree Parylene Coating

ParyFree halogen-free Parylene coating is applied through vapor deposition process.  Read More...

Samtec Releases HSEC8-PV Series Socket/Connector Combo

Samtec Releases HSEC8-PV Series Socket/Connector Combo

HSEC8 series high-speed edge card socket on 0.8mm pitch now has option of signal and power card edge combo connector.  Read More...

Cohu Debuts cDragon RF Test Pin

Cohu Debuts cDragon RF Test Pin

cDragon pin combines advanced test features at temperatures from -55° to +155°C.  Read More...

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