Circuits Assembly Online Magazine

NEWS

Reshoring Job Announcements Continue Record Growth in H1

SARASOTA, FL – Reshoring and foreign direct investment job announcements continued their record-breaking run in the first half of 2023, acco... Read More...

Q3 Semiconductor Equipment Billings Drop 11%, SEMI Reports

MILPITAS, CA – Global semiconductor equipment billings contracted 11% year-over-year to $25.6 billion in the third quarter, while quarter-ov... Read More...

Worldwide Smartphone Shipments to Grow 7% in Q4, Says IDC

NEEDHAM, MA – Worldwide smartphone shipments are forecast to see 7.3% year-over-year growth in the fourth quarter, according to IDC's Worldw... Read More...

WSTS Forecasts Semiconductor Market Contraction in 2023, Recovery in 2024

MORGAN HILL, CA – The World Semiconductor Trade Statistics organization has revised its 2023 forecast for the global semiconductor market, a... Read More...

Escatec Appoints New CEO

PENANG, MALAYSIA – Escatec's board of directors has appointed Charles-Alexandre Albin chief executive officer, effective March 31, 2024. Read More...

Nano Dimension Reports 22% Q3 Revenue Increase

WALTHAM, MA – Nano Dimension reported revenue of $12.2 million in the third quarter, up 22% compared to the same quarter in 2022. Read More...

PE Firm Invests in Oregon's SisTech Manufacturing

NASHVILLE, TN – LFM Capital has announced an investment in SisTech Manufacturing, a printed circuit board assemblies manufacturer for defens... Read More...

Syrma Sets Up Semiconductor Unit

CHENNAI, INDIA – Syrma SGS Technology has formed a semiconductor-focused subsidiary, named Syrma Semicon, according to a filing with the Bom... Read More...

Foxconn to Invest $1.5B in India

TAIPEI – Foxconn will invest more than $1.5 billion in an Indian construction project to fulfill its “operational needs,” the company announ... Read More...

FEATURES

5G Open Radio Unit White Box

An overview of the design and development process. 5G radio networks provide increased bandwidth at the expense of reduced range. To compensate for the reduced... Read More...

Will IC Package Substrate Makers be Next to Rule?

Massive investment suggests the segment could occupy a major portion of the largest fabricators' production. The heartbreak of the pandemic of 2020-21 is reced... Read More...

The Power of Personal Branding: Creating an Authentic and Sustainable Perception

Learn from successful entrepreneurs and specialists at the annual Women’s Leadership Program. We can find heroes all around us, but we will challenge you to lo... Read More...

Closed-Loop Process Optimization between Screen Printer and SPI in an SMT Line

An experiment investigating print alignment adjustments. Printed circuit board assembly requires extraordinary precision and repeatability. The screen printing... Read More...

3-D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies

A design, equipment, process and materials methodological approach. Electronics for automotive applications, as well as for other industries, are expected to r... Read More...

Selectively Assembling High-Value Components Based on Warpage in Order to Improve Reliability

Can predicting board and part flatness at critical points in the reflow/reliability profile reduce failures? Surface warpage, or flatness, is an established so... Read More...

Public Sector Efforts ‘Chip Away’ at PCB Funding Deficit

The PCBAA is ramping up efforts to secure funding for R D and capacity in the US. What constitutes the printed circuit board industry? And how much, if any, in... Read More...

A Plethora of Pitches

The unstructured evolution of integrated circuit package technology (and its consequences). I purchased my first "integrated circuit" around 1957, wh... Read More...

The Heat is On

Claire Wemp is hot on the trail of better thermal interface materials and more engineering roles for women. Thermal interface materials (TIM) are used between ... Read More...