Circuits Assembly Landing Page Showcase

• A Holistic Approach for Technology and Quality Audits in the New Era of Computer Server Design and Manufacturing

  Streamlining governing processes in audit execution and auditor training, as well as on IT applications development.

  https://circuitsassembly.com/ca/editorial/menu-features/30698-supplier-audits-1902.html

• Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly

  A printing investigation revealed unexpectedly stable and adequate paste transfer levels for metric 0201 components.

  https://circuitsassembly.com/ca/editorial/menu-features/30705-paste-transfer-1902.html

• STI: Steady as They Go

  Over 27 years, STI has been as unique as they come: EMS company, training provider,
  engineering consultant, distributor and failure analysis lab. And that’s not all.

  https://circuitsassembly.com/ca/editorial/menu-features/30702-ems-company-of-the-year-1902.html

• As-Shipped vs. Mounted Height for BGA and LGA Packages

  When a component is surface-mounted to the motherboard, the x- and y- dimensions do not change.
  Not so for the height. LGA height increases; BGA height decreases.

  https://circuitsassembly.com/ca/editorial/menu-features/30567-determining-standoff-1901.html

• It’s Not Easy Being Green Circuits

  From 5G reference boards to 20,000 01005 parts on a single assembly, Silicon Valley’s choice for one-stop shoppers is gaining a national reputation for handling the toughest boards.

  https://circuitsassembly.com/ca/editorial/menu-features/30566-it-s-not-easy-being-green-circuits.html

• From the Archives: Removing No-Clean Flux on Class III PCBs

  https://circuitsassembly.com/ca/index.php/magazine/24107-cleanliness-assessment-for-class-iii-lead-free-no-clean-assemblies