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NEWS

European Chips Act Set to Increase Microprocessor Manufacturing

European Chips Act Set to Increase Microprocessor Manufacturing

BRUSSELS – The European Commission is creating a European Chips Act to increase microprocessor R D and manufacturing with dedicated funds, s...  Read More...

Trendforce Offers 10 Top Tech Trends for 2022

Trendforce Offers 10 Top Tech Trends for 2022

TAIPEI – Market research firm TrendForce has issued its 10 major technology trends expected to take place across various segments in 2022: ...  Read More...

NCMS Publishes Report Analyzing Digital PLM Implementation

NCMS Publishes Report Analyzing Digital PLM Implementation

ANN ARBOR, MI — The National Center for Manufacturing Sciences published a report featuring analysis for successful digital product lifecycl...  Read More...

Q2 Worldwide Server Market Revenue Down Nearly 3%

Q2 Worldwide Server Market Revenue Down Nearly 3%

NEEDHAM, MA – Worldwide server market revenue declined 2.5% year-over-year to $23.6 billion during the second quarter, according to the Inte...  Read More...

iNEMI to Hold Call-for-Participation Webinar on Benefits of AI for AOI of PCBAs

iNEMI to Hold Call-for-Participation Webinar on Benefits of AI for AOI of PCBAs

MORRISVILLE, NC – iNEMI is holding a call-for-participation webinar Oct. 13 and 14 for its new project on artificial intelligence enhancemen...  Read More...

SigmaTron Reports Fiscal Q1 Revenues Up 42%

SigmaTron Reports Fiscal Q1 Revenues Up 42%

ELK GROVE VILLAGE, IL – SigmaTron International reported revenues of $85.7 million in the fiscal first quarter, up 41.8% year-over-year.  Read More...

Enics to Expand EMS Site in Suzhou

Enics to Expand EMS Site in Suzhou

SUZHOU, CHINA – Enics is expanding its high-volume manufacturing site here, one of its largest in the region.  Read More...

Kasdon Electronics Moves into New Factory in UK

Kasdon Electronics Moves into New Factory in UK

WILLENHALL, UK – Contract manufacturer Kasdon Electronics moved into a new 20,000 sq. ft. facility here, consolidating from two buildings, a...  Read More...

Global Semi Equipment Billings Up 48% in Q2

Global Semi Equipment Billings Up 48% in Q2

MILPITAS, CA – Global semiconductor equipment billings surged 48% year-over-year to a record high of $24.9 billion in the second quarter, a ...  Read More...

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FEATURES

AOI Operation Control by MES Using IPC-CFX

AOI Operation Control by MES Using IPC-CFX

A connected factory automates the AOI validation process. Automated optical inspection (AOI) is typically used after solder reflow to detect missing components...  Read More...

The Interaction of 2 Solder Paste Alloys with 5 Surface Finishes, Part 2

The Interaction of 2 Solder Paste Alloys with 5 Surface Finishes, Part 2

SAC 305 shows faster shear strength degradation than Innolot, while the surface finish has no effect. When a solder joint is exposed to cyclic stresses, therma...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

Lloyd Instruments Launches NexygenPlus 4.1 Materials Testing Software

Lloyd Instruments Launches NexygenPlus 4.1 Materials Testing Software

NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design...  Read More...

Palomar Releases 3880-II Die Bonder

Palomar Releases 3880-II Die Bonder

3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.  Read More...

Vishay Offers PHPA Series Resistors

Vishay Offers PHPA Series Resistors

Thin film wraparound PHPA series resistors have power ratings of 1.0W and 2.5W in 1206 and 2512 case sizes, respectively, with a self-passivated tantalum nitrid...  Read More...

Dymax Releases  9771 Conformal Coating

Dymax Releases 9771 Conformal Coating

9771 conformal coating is for use on printed circuit boards in missiles, satellites, and spacecraft. Is dual-cure and reworkable, and cures with light and moist...  Read More...

Saki Develops 3Di-LS2-CASE 3-D AOI

Saki Develops 3Di-LS2-CASE 3-D AOI

3Di-LS2-CASE 3-D AOI has unique, highly rigid gantry structure and AI-based inspection automation functionality reduce false calls for solder defects (non-wetti...  Read More...

Solderstar Releases SLX Wave, Convection Reflow Profiler

Solderstar Releases SLX Wave, Convection Reflow Profiler

SLX is a zero-setup profiling system for reflow and wave solder applications.  Read More...

Solderstar Introduces VP Nano Thermal Profiler

Solderstar Introduces VP Nano Thermal Profiler

Solderstar VP Nano captures thermal profiles of electronics assemblies that use numerous components or require higher mass PCB substrates.  Read More...

Mek Launches ISO-Spector M2 3-D AI AOI

Mek Launches ISO-Spector M2 3-D AI AOI

ISO-Spector M2 inline 3-D AOI system with artificial intelligence is for high-end electronics assembly.  Read More...

Vishay Adds Draloric RCV-AT e3 Chip Resistors

Vishay Adds Draloric RCV-AT e3 Chip Resistors

Draloric RCV-AT e3 thick-film chip resistors are AEC-Q200-qualified and have operating voltages up to 3kV in 2010 and 2512 case sizes.  Read More...

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