Circuits Assembly Online Magazine

NEWS

Semiconductor Equipment Sales to Reach a Record of $139B in 2026, SEMI Reports

TOKYO – Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry r... Read More...

Cicor to Receive Takeover Bid from PE Firm

BRONSCHHOFEN, SWITZERLAND – An affiliate of US investment firm One Equity Partners will make a cash offer of CHF84.6 million ($96.3 million)... Read More...

Kitron Reiterates 2024 Financial Outlook

BILLINGSTAD, NORWAY – Kitron expects revenue between €635 million and €660 million ($667 million and $694 million) for the year, with strong... Read More...

Global Semiconductor Sales Increase 22% in October

WASHINGTON – Global semiconductor sales hit $56.9 billion during the month of October 2024, an increase of 22.1% compared to the October 202... Read More...

PC and Tablet Shipments Expected to Grow in 2024, Says IDC

NEEDHAM, MA – The global market for personal computing devices, including PCs and tablets, is set to grow 3.8% in 2024, reaching 403.5 milli... Read More...

Foxconn Revenue Increases 3.5% in November

TAIPEI – Foxconn reported a 3.5% year-over-year increase in revenue for November, reaching the company's second-highest total for the month ... Read More...

VS Industry Announces $249M in Q1 Revenue

SENAI, MALAYSIA – VS Industry reported MYR1.11 billion ($249 million) in revenue for its first quarter, down 2.6% from the same quarter last... Read More...

Eagle Electronics Building OH Manufacturing Facility

SOLON, OH – Eagle Electronics has raised $14 million to build a new manufacturing facility here in partnership with CO-AX Technology. Read More...

SEMI Publishes Recommendations for EU Semiconductor Policies

BRUSSELS, BELGIUM – SEMI has published recommendations for the European Union to bolster its semiconductor ecosystem, urging new commissione... Read More...

FEATURES

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...

When to Downsize Solder Paste Powders

Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...

Royalty Flush

A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...

Reflow Profiling in PCB Assembly

Optimizing temperatures will ensure the best possible conditions for soldering. Verifying and optimizing the temperature profile of a reflow oven ensures an id... Read More...

Identifying Solder Mask Problems with Simple Tests

Diagnosing sources of crazing, delamination and peeling. In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, de... Read More...

Water Quality Matters

A novel approach leverages ion exchange technology with continuous monitoring for superior tank management. Aqueous cleaning operations in printed circuit boar... Read More...

Dendrite Growth Dynamics

Are industry standards sufficient for characterizing the effects of cleanliness at high voltages? The increasing popularity of high-voltage electronics, partic... Read More...