PEACHTREE CITY, GA – Registration for PCB Detroit, a new technical conference and tabletop event, is now open, the Printed Circuit Engineeri... Read More...
SAINT-HERBLAIN, FRANCE – Lacroix reported €494.3 million in annual revenue for its Electronics segment, down 12.1% from 2023's total. Read More...
TAIPEI – Foxconn's January revenue rose 3.16% year-over-year to NT$538.7 billion ($16.4 billion), the second-highest total the company has r... Read More...
TABY, SWEDEN -- Mycronic reported fourth quarter net sales increased 5% to SEK 2.1 billion ($191.9 million). Based on constant exchange rate... Read More...
BANGKOK -- SVI Public Company reported consolidated revenue for the fourth quarter was THB 5.34 billion ($157.4 million), down 4% sequential... Read More...
SPOKANE VALLEY, WA — Key Tronic reported fiscal second revenue of $113.9 million, down from $147.8 million the same period of 2024. Read More...
WASHINGTON — The 90-day moving average global semiconductor sales hit $170.9 billion in the fourth quarter, 17.1% more the year ago period a... Read More...
CRANSTON, RI – AIM Solder has acquired the assets of Canfield Technologies, a fellow producer of solder assembly materials. Read More...
GLENVIEW, IL -- Illinois Tool Works today reported fourth quarter revenue at its Test Measurement and Electronics segment was $747 million... Read More...
Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...
A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...
STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...
While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...
Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...
The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...
Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...
Smaller components do not always need a smaller paste. As components shrink in size, the demand for finer solder pastes increases. But the selection of solder ... Read More...
A noted solutions architect offers an audacious plan for AI acceptance. It just might work. The talk of AI-based printed circuit design – and the idea that art... Read More...
ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler. Read More...
Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform. Read More...
MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-perform... Read More...
SpiCAT SpiSCAP online engineering simulation software is for evaluating and selecting SCC and SCM Series supercapacitors for power challenges in industrial, ene... Read More...
Yamaha Robotics added three hardware-based performance options for high-speed mounters that enhance productivity, quality control, and flexibility for handling ... Read More...
Würth Elektronik's Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors are now available in vibration-resistant versions in their SMT variants. Read More...
SV Microwave's 30° solderless PCB compression mount connectors are able to attain edge launch-like performance anywhere on the board. Read More...
Henkel's Loctite AA 3952 and Loctite SI 5057 light cure adhesives are designed to bond TPE substrates and overcome the limitations of traditional assembly metho... Read More...
Vishay Intertechnology's TSM3 multi-turn, surface-mount cermet trimmers are designed for space-constrained industrial, consumer and telecom applications in hars... Read More...