The time is now for serial inventor Joe Fjelstad’s answer to simplifying component assembly.

Joe Fjelstad is a renowned innovator, environmental advocate and the visionary mind behind the Occam Process, a groundbreaking advancement in electronics manufacturing. In this in-depth conversation, Fjelstad shares the journey of Occam, its transformative potential, and the wisdom gathered over his illustrious career.

Introducing nitrogen to the solder process can enhance reliability and yields.

Inert gas soldering systems, which use a controlled nitrogen blanket atmosphere and an entry vacuum oxygen/nitrogen exchange chamber, offer several key benefits:

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types.

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can attributed to the solder paste screen (stencil) printing process. This process comprises different key elements designed to work together to generate the most optimal performance and results. These elements include the following:

Selecting the right paste requires an understanding of its properties.

A solder paste’s viscosity and thixotropic properties influence its performance in different production environments.

Viscosity is a measure of a fluid’s resistance to flow. Think of it as a fluid’s “thickness” or “thinness.” A fluid that flows slowly, like molasses, has a high viscosity, while one that flows easily, like water, has a low viscosity.