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Solder paste dispensing can solve the challenges posed by differing component sizes.

While stencil printing has long been the cornerstone of applying solder paste, it faces limitations with extremely small or large components. This challenge underscores the need for adaptable and innovative solder paste application methods. Here we delve into the realm of advanced dispensing technologies, exploring solutions that can help overcome common production challenges.

Stencil printing, despite its efficiency, struggles with the dual extremes of component sizes – area array and bottom termination components continue to shrink, while connectors and other components may increase in size. This variance stretches the capabilities of stencil printing. Dispensing offers the advantage of infinite flexibility, capable of producing both minuscule and substantial deposits while seamlessly integrating into the existing SMT process.

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Perhaps you have heard it’s election season around the world. SMTA is undergoing an election of its own this fall, with ballots due July 31. PCD&F/CIRCUITS ASSEMBLY asked the two candidates for president of the electronics assembly organization to provide their priorities, should they be elected. Their responses are lightly edited for grammar and style. 

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One year out from its merger with American Standard Circuits, the West Coast fabricator is evolving to meet a changing customer base.

From its inception as part of Electronic Controls Design in 1972, to its joining with American Standard Circuits last July, Sunstone Circuits has been committed to innovating in the industry – for instance, it is said to be the first to offer online quoting and ordering in the 1990s – as well as providing exceptional customer service.

To better understand what makes Sunstone go, PCD&F visited the company's 32,000 sq. ft. facility in Mulino, OR, in late April, and took an inside look at its operations.

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The East Coast trade show brings news of a steady industry, while puncturing myths about AI.

Members of the electronics community gathered in the Boston suburb of Boxborough in early June for the return of PCB East, PCEA's annual event featuring four days of technical sessions and a one-day exhibition.

This year's exhibition featured more than 65 companies running the gamut of the PCB industry, from fabrication, design, and assembly to test and inspection, and most of those companies reported steady growth thus far, with small gains over 2023.

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Moving forward on the ‘More than Moore’ roadmap.

We’re witnessing a rapid evolution in advanced semiconductor nodes and market growth due to the meteoric rise of AI, mobile, autonomous automotive, IoT, communications and cloud, health tech, and wearables. The various technologies driving the overall functionality of systems and devices associated with these applications have increased exponentially, impacting factors such as device performance, energy consumption, power dissipation, and space (miniaturization).

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Navigating the balancing act with the application constraints.

Understanding and controlling the assembly process window is not just about managing the solder paste. It’s about mastering all process variables across the entire SMT assembly process for optimal outcomes.

The assembly process window defines the range of parameters within which solder paste will meet optimal performance standards. Straying outside this window can lead to defects, rework and inconsistencies, affecting the efficiency and output of the electronics manufacturing process.

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