Diagnosing sources of crazing, delamination and peeling.

In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, designed to shield the copper surfaces and prevent solder bridging between components, plays a crucial role in ensuring the reliability and functionality of electronic devices.

Solder masks can face several issues, however: crazing, delamination, peeling, and the presence of waxy or oily residues. These defects can lead to complications like micro solder balling, bridging, and solder snail trails, especially noticeable after wave soldering processes.

Not only do these challenges compromise the PCB’s quality and long-term reliability, but they can also lead to significant production rework and increased costs.

Indium Corporation celebrates its 90th anniversary with a look at its past and future innovations.

A sense of curiosity and discovery drove the founding of Indium Corp. in the early 1930s, and that continued drive to innovate has carried the company to success over the past 90 years of its existence – leading it to become a premier manufacturer and supplier for the PCB, semiconductor and thermal management industries.

After reaching the 90^th anniversary milestone this year, the company is celebrating with the theme of “A Legacy of Innovation Fueled by Curiosity,” meant to reflect the technological breakthroughs and the people who have fueled them.

Solder paste dispensing can solve the challenges posed by differing component sizes.

While stencil printing has long been the cornerstone of applying solder paste, it faces limitations with extremely small or large components. This challenge underscores the need for adaptable and innovative solder paste application methods. Here we delve into the realm of advanced dispensing technologies, exploring solutions that can help overcome common production challenges.

Stencil printing, despite its efficiency, struggles with the dual extremes of component sizes – area array and bottom termination components continue to shrink, while connectors and other components may increase in size. This variance stretches the capabilities of stencil printing. Dispensing offers the advantage of infinite flexibility, capable of producing both minuscule and substantial deposits while seamlessly integrating into the existing SMT process.

Perhaps you have heard it’s election season around the world. SMTA is undergoing an election of its own this fall, with ballots due July 31. PCD&F/CIRCUITS ASSEMBLY asked the two candidates for president of the electronics assembly organization to provide their priorities, should they be elected. Their responses are lightly edited for grammar and style.