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Yincae's Diamond Underfill UF 158D is engineered to deliver exceptional thermal management in advanced semiconductor applications, achieving 8 W/m·K thermal conductivity through nano-engineered diamond particles. Designed for flip-chip, 2.5D/3D integration and high-density interconnects, UF 158D reduces solder fatigue, mitigates CTE mismatch and enhances long-term device reliability. Its strong adhesion and mechanical robustness make it well-suited for next-generation packaging demands. Available in both dispensable and jettable formulations, UF 158D has passed JEDEC reliability standards.

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Metcal PT4-4000 and PT4-8000 Series 4-Zone Circuit Board Preheaters deliver thermal control for advanced electronics manufacturing and rework applications. Using Resistive Radiant Heat Technology, the systems radiate heat from a ceramic plate through a tempered glass surface, eliminating hot spots and ensuring consistent temperature distribution across the board. Each unit features four independently controlled temperature zones to accommodate a wide range of PCB sizes and thermal profiles, with real-time feedback from external thermocouples that continuously monitor and adjust heat output for maximum accuracy.

Advanced temperature control modes and programmable thermal profiles enable repeatable, application-specific performance, while enhanced flexibility makes the preheaters ideal for high-density assemblies, multilayer boards, and thermally demanding components. Designed to support both production and repair workflows, the PT4 Series integrates seamlessly into processes ranging from consumer electronics and data center hardware to aerospace, defense, and medical devices. The series is compatible with Metcal’s premium circuit board holders, which provide stable, adjustable support during heating and rework operations. 

Mectal

https://www.metcal.com/

Master Bond's LED422DC90 is a nanosilica-filled, one-component dual cure adhesive designed for high-speed fixturing and bonding of opaque substrates. The system’s side-bonding capability allows rapid polymerization up to 3–4 mm deep using angled 405 nm LED light, with final curing achieved through a secondary heat process at 90–95°C for 30–45 minutes.  Combines dimensional stability with low thermal expansion (30–40 x 10⁻⁶ in/in/°C), and delivers strong mechanical properties, including tensile strength of 6,000–7,000 psi and lap shear strength of 800–900 psi (aluminum-to-aluminum). The adhesive is optically clear with a refractive index of 1.49, Shore D hardness of 85–90, and elongation of 1–3%. Functions as a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm and meets NASA low-outgassing requirements.

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Keysight's NA5305A Frequency Extender (up to 170 GHz), NA5307A Frequency Extender (up to 250 GHz), and 85065A Precision Calibration Kit 0.5 mm expands the capabilities of its PNA/PNA-X VNA solutions. Delivers calibrated single-sweep broadband S-parameter measurements from 100 kHz to 250 GHz, enabling faster testing for high-speed interconnects, next-generation semiconductors and sub-THz wireless devices. Designed to reduce design cycles and enhance accuracy, the offering provides up to 105 dB system dynamic range and differential measurement capabilities, while partnerships with FormFactor, MPI, Spinner and Junkosha bring advanced probes, adapters and cables to complement the test ecosystem.

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Cybord's fully air-gapped Visual AI platform brings advanced inspection and traceability capabilities on-premises for industries with strict data security requirements such as aerospace, defense and aviation. Integrated with Siemens’ Opcenter Execution Electronics, the platform inspects 100% of components during SMT processes, authenticating parts by lot and origin, enforcing BOM and AVL compliance and detecting tampering or defects. By eliminating reliance on cloud connectivity, the solution ensures data sovereignty while safeguarding against counterfeit or defective components, reducing recalls and strengthening hardware cybersecurity in highly restricted environments.

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Shenmao Technology's SMF-WC58 is a halogen-free, water-soluble tacky flux. Engineered for ultra-fine bump pitch flip-chip and BGA/CSP processes. Designed for advanced semiconductor packaging. Delivers wettability on a broad range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG and ImSn. Offers a work life of 12 hours or more. After reflow, residues are removed using deionized water. Compatible with printing, transfer and dipping applications.

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