New Products
Yamaha Robotics SMT Section YSUP-PG programming module now features automated programming capabilities said to streamline program generation for all surface-mount processes, including dispensing, printing, placement and inspection.
BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.
AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.
Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.
Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Press Releases
- Q Source Strengthens Partnership with PACE Worldwide, Showcasing Advanced Soldering and Rework Solutions
- Kimball Electronics Releases 2024 Annual Sustainability Report; Richard Phillips Comments
- Hon Hai Technology Group (Foxconn) Completes Independent Audits At 9 More Manufacturing Sites
- ROCKA Solutions Mexico Partners with MIRTEC to Offer Leading Inspection Systems Exclusively in Mexico, Brazil and Argentina; Brian D’Amico and Rodrigo Cacho Comment