TORRANCE, CA — July 2026 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will present the third session of its SMI 2026 Summer Webinar Series on Wednesday, July 22 at 10 a.m. PDT, exploring the importance of PCB cleanliness before solder paste printing and its impact on SMT process performance.

Webinar Registration: https://us02web.zoom.us/j/83262582054

Titled “Starting the SMT Process with a Clean PCB,” the webinar will examine how particulate and ionic contamination can affect solder paste printing, contributing to defects, reduced adhesion and inconsistent manufacturing results. As electronic assemblies continue to become smaller and more complex, maintaining a clean PCB surface has become an increasingly important step in achieving reliable production.

The presentation will review common sources of PCB contamination and discuss the impact contaminants can have throughout the SMT process. Attendees will gain a better understanding of why cleaning boards prior to stencil printing helps improve print quality, reduce defects and support overall product reliability.

The session will also introduce the Unitech inline PCB cleaner, an automated cleaning system designed to remove particulate and ionic contaminants immediately before solder paste printing. By cleaning the PCB surface inline, the system helps improve solder paste adhesion, supports more consistent printing results, and enhances overall manufacturing performance without disrupting production flow.

Whether manufacturers are experiencing print quality issues or looking to strengthen process control, the webinar will provide practical information on incorporating PCB cleaning into existing SMT production lines.

The webinar is complimentary, but advance registration is required.

Date: Wednesday, July 22, 2026

Time: 10 a.m. PDT

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.

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