Baltimore, MD – March 2026 – The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, has added the Prime TruVision™ X-ray and computed tomography (CT) inspection system from Creative Electron to its engineering and analysis services. The system allows TTCI to examine the internal structure of electronic assemblies with high-resolution imaging, supporting more detailed failure analysis and process investigation for its customers.

The Prime TruVision platform combines imaging software with a mechanically stable inspection platform designed for precision motion and repeatable results. The system supports 2D X-ray imaging, laminographic analysis, and full 3D CT scanning, allowing engineers to view internal structures such as solder joints, plated through holes, vias, and component connections without destructive cross-sectioning.

Using the system’s imaging and reconstruction tools, TTCI engineers can evaluate voiding levels, inspect BGAs and QFNs, detect barrel cracks in plated through holes, and investigate structural defects that may affect long-term reliability. These capabilities allow engineers to analyze internal features of assemblies and identify manufacturing issues during failure analysis.

“At The Test Connection, Inc., we continuously invest in technologies that strengthen the value we bring to our customers,” said Bert Horner, President of The Test Connection, Inc. “The Prime TruVision system from Creative Electron combines powerful imaging software with exceptionally stable hardware, allowing our team to deliver advanced X-ray and CT inspection services that complement our electrical test capabilities. This investment supports our mission to help manufacturers improve quality, reliability, and root-cause analysis across their products.”

The X-ray and CT capability complements TTCI’s electrical test engineering services, which include flying probe test, in-circuit test (ICT), boundary scan, and functional test development. Combining electrical validation with internal structural inspection allows TTCI engineers to investigate both electrical and physical causes of product issues within a single engineering workflow.

“TTCI’s investment in our TruView Prime X-ray system strengthens their ability to perform deeper and faster failure analysis on complex electronic assemblies,” said Bill Cardoso. “With higher resolution and rapid inspection capability, their engineers can pinpoint root causes more quickly and deliver more reliable insights to their customers.”

“Creative Electron’s Prime TruVision platform brings together powerful imaging software and robust hardware stability, giving our team a highly capable tool for advanced X-ray and CT inspection,” Horner added. “By integrating this technology into our services, The Test Connection is expanding beyond traditional electrical test into deeper structural analysis of electronic assemblies. We see a strong growth pathway both within the CCA and PCB industries and in emerging sectors where non-destructive inspection plays a critical role in reliability and quality.”

The system will be used across a range of applications including failure analysis, process validation, counterfeit component investigation, and reliability studies for high-performance electronics. Industries supported by TTCI include aerospace, defense, medical devices, and other high-reliability sectors where internal inspection is often required.

The Test Connection, Inc. will highlight its expanded inspection and test services at IPC APEX EXPO 2026, booth #3522.

To learn more about TTCI’s test services, visit www.ttci.com.

ANN ARBOR, Mich. – Coherix, a global leader in AI-based quality-control systems for adhesive and sealant dispensing, will host a two-day open house program at its new Innovation Center in Ann Arbor, Michigan.

The event is designed to give manufacturing engineers, automation specialists, industry partners and news media an opportunity to explore the next generation of intelligent manufacturing and precision dispensing technology.

Three half-day “open house” sessions are available for guests to attend on Thursday and Friday, April 9–10 at the company’s recently opened North American headquarters and Innovation Center at 1168 Oak Valley Drive. Each session will include luncheon discussions and live technology demonstrations, technical presentations and Q&A sessions focused on solving real-world manufacturing challenges related to automated dispensing processes.

“Manufacturers today face increasing pressure to improve quality while accelerating production and reducing costs,” notes Coherix Chairman and CEO Dwight Carlson. “We’ll show open house attendees how real-time 3D inspection and AI-driven adaptive-process-control technologies will enable manufacturers to move from traditional inspection methods to a fully closed-loop process-control system.

“Companies are moving toward fully autonomous production environments where quality must be verified and controlled in real time. Engineers who attend one of our open-house sessions will have an opportunity to see firsthand how Coherix technology transforms dispensing operations from reactive inspection to proactive process control.”

Coherix 3D inspection systems and adaptive-process-control solutions used to monitor and automatically adjust adhesive and sealant dispensing operations at production speeds will be on display and demonstrated during each open house session. The demonstrations will highlight several advanced technologies designed to improve robotic dispensing accuracy and process reliability.

Attendees also will learn how manufacturers across automotive, battery production, electronics and advanced mobility industries are using Coherix technology to improve product quality, reduce material waste and eliminate costly production defects.

“Dispensing variability is one of the most persistent automated-manufacturing challenges,” says Coherix Vice President and General Manager, Dr. Zhen Huang. “By combining 3D vision, machine learning and adaptive process control, we help manufacturers move from inspection to true defect prevention.”

The open house program also will give many visitors a first look at the new Coherix Innovation Center, part of the company’s recently expanded 25,000-square-foot North American headquarters and product development facility in Ann Arbor.

The facility includes robotic demonstration cells, engineering labs and training areas designed to support collaboration with OEMs, system integrators and manufacturing partners. Innovation Center resources enable Coherix to develop and test next-generation dispensing solutions in real-world automation environments.

“Our Innovation Center was designed to bring customers and engineers together to solve complex manufacturing challenges,” Huang adds. “Our open house program is a great opportunity for industry professionals to see how we’re advancing intelligent manufacturing.”

Registration information for the open house program is available on the company’s website at https://coherix.com/coherix-open-house-2026.

Coherix offers the only manufacturing technology capable of automatically inspecting and controlling the application of adhesives and sealants at assembly-line speeds. Its 3D laser-based quality control systems are equipped with machine learning, artificial intelligence and process control software proven to deliver savings of 25 percent in labor and material.

To meet a need for mechanical engineers, as well as training for engineers currently involved with adhesives and sealants, Coherix also is working closely with Eastern Michigan University, the University of Michigan, various trade organizations and its customers.

In addition, Coherix has developed a dispensing workshop program to help improve the use of adhesives and sealants in product manufacturing. Co-sponsored by the Engineering and Manufacturing Alliance (EMA), more than 100 system integrators, robot suppliers, dispensing equipment suppliers, material suppliers and end users have attended the program over the past year.

FREMONT, CA – March 19, 2026 – Datest, the industry’s favorite second set of eyes (and hands, and solder joints), is kicking off its 2026 Technical Webinar Series, bringing together some of the industry’s sharpest minds to tackle the problems engineers actually face every day—false calls, slow test development, complex boards and inspection data that sometimes raises more questions than answers.

Let’s be honest: Electronics manufacturing doesn’t come with a neat instruction manual. Boards are getting denser, assemblies more complex and the tolerance for defects is somewhere between “zero” and “absolutely zero.”

That’s why Datest isn’t just running tests and scanning boards. We’re helping engineers understand the technology behind them. The Datest webinar series brings together industry leaders to share practical knowledge about inspection, testing, and manufacturing reliability, no marketing fluff, no buzzword soup, just real technical insight.

Two Industry Leaders, Two Real-World Challenges
The 2026 series kicks off with two expert-led sessions from technology partners who spend their days pushing the boundaries of electronics inspection and test.

AXI That Knows When to Speak Up—and When to Stay Quiet
April 14, 2026, 10:00 AM PT

Datest will host Jesper Lykke, CEO of Viscom, for a technical deep dive into “Improving AXI Accuracy: Reducing False Calls Through Better Programming & Image Analysis.”

Anyone who has worked with inspection systems knows the problem: when AXI flags everything, operators stop trusting it. Production slows. Confidence drops. This session explores how modern AXI platforms use intelligent algorithms, precise 3D measurement, and AI-supported image processing to improve inspection accuracy while minimizing unnecessary line disruptions. 

Register here: https://meet.zoho.com/pjzz-tnc-ozi

From CAD File to Test Program in Under an Hour
May 21, 2026, 10:00 AM PT

Next, Datest welcomes Dustin Warren, VP of sales and regional director at SPEA, to explore “Streamlining Test Development: From CAD to Production-ready Test Program in Under 60 Minutes.”

Because in today’s manufacturing environment, test coverage isn’t the only metric that matters; time to deploy that test is just as critical. During this session, Warren will demonstrate how manufacturers can move from board CAD data to a production-ready test program in under 60 minutes using SPEA’s latest automatic programming tools. The result? Faster ramp to production, improved repeatability, and far less time spent wrestling with test program development. 

Register here: https://meet.zoho.com/ovcl-tsk-qwi

Datest spends its days living in the reality of electronics manufacturing, helping OEMs and EMS providers diagnose failures, validate assemblies, and see inside boards without taking them apart. So when we bring industry leaders together to share technical insight, it’s not about promotion. It’s about education.

“Our customers rely on us not only for inspection and test services, but also for guidance,” said Datest President Rob Boguski. “By hosting these sessions with partners like Viscom and SPEA, we’re dispelling the mystery that often envelops test technology with facts and helping engineers better understand the technologies that ultimately determine the reliability of the products they build.  Technologies once warily viewed as black boxes are now valued as indispensable tools for process and product improvement.”

Because the truth is simple:

• Better knowledge leads to better testing.
• Better testing leads to better reliability.
• Better reliability leads to better products.
• Better products contribute to better living.

And everyone, from engineers to end users, benefits from that.

About Datest
Based in Fremont, California, Datest has been a trusted partner in the electronics industry since 1984. With a commitment to speed and flexibility, Datest offers a comprehensive suite of advanced testing, engineering, inspection, and failure analysis services designed to meet each client’s unique needs.  Datest proudly serves contract manufacturers (CMs), EMS providers, and OEMs, delivering advanced PCBA testing and inspection services focusing on quality and reliability. As an ISO 9001:2015 and AS9100D-certified company, Datest is dedicated to helping you achieve success with solutions you can depend on. For more information, visit www.datest.com.

ORLANDO, FL – March 18, 2026 – The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for an exchange of technical information and breakthrough research.

ECTC 2026 is the flagship conference of the IEEE Electronics Packaging Society, delivering a technical program of more than 450 papers in 41 technical sessions, including five interactive presentations, one of which is a student session; 12 special sessions on selected topics; a series of 16 CEU-approved professional development opportunities; more than 130 exhibits representing industry-leading product and service companies from around the world; and multiple social events and student outreach activities to provide networking opportunities.

Topics in the ECTC 2026 program include advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D & heterogeneous integration, interposers, advanced substrates, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, as well as flexible and printed electronics.

“Advanced packaging has evolved from a back-end protection process into a front-line enabler of system-level innovation,” said Bora Baloglu, ECTC 2026 technical program chair and director of business development at Intel Foundry Services. “These technologies are now essential for driving the massive computing power required for AI infrastructure, data centers, and high-performance computing (HPC).”

The 2026 IEEE Electronic Components and Technology Conference program highlights include:

Keynote Address: Wednesday, May 27
Advanced Packaging & the Future of System Optimization, by Dr. Tien Wu, CEO of Advanced Semiconductor Engineering (ASE).

As global AI infusion redefines performance, power, and integration requirements, advanced packaging is at the forefront of semiconductor innovation. As chip architecture complexity increases, the industry is progressing beyond device-level scaling toward system-level optimization. Advances in heterogeneous integration and packaging-enabled co-design are shaping more efficient, scalable, and resilient systems. Moving forward, system-centric strategies that align architecture, packaging, and collaboration across the ecosystem will be paramount to shaping the golden era of AI and semiconductors.

Special Sessions: Tuesday, May 26 – Friday, May 29
ECTC 2026 includes a series of Special Sessions, which feature industry experts discussing technology status and roadmaps in key areas of interest, including:
• Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap
• New Packaging Technologies Enabled By Panel Level Integration • AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging
• Photonics-Based Systems for AI and Exascale Computing
• System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications
• Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging
• Enabling Next-Generation Advanced Packaging Technology from Wafer to Panel
• Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance
• IEEE EPS Seminar: Redefining System Integration – The Rise of Organic Substrates in the Chiplet Era
• ECTC 2026 Plenary Session: Efficiency Is Not Enough – Are We Solving the Wrong Problem in the Data Center Energy Use?
• IEEE EPS President’s Panel: Data Centers in the Age of AI – Challenges and Solutions

Student Innovation Challenge: Wednesday, May 27
Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance. Students in bachelor’s and master’s programs will compete on the topic:
• Low-cost Robust Thermal Solution for High Power AI/Datacenter Processor
PhD students will compete in one of two topics:
• Materials, Interfaces, & Processes for Ultra-Scalable Interconnects
• Electromigration Solutions for BGA Interconnects in AI-Focused Packages

Startup Competition: Thursday, May 28
Under the theme “The Light Age: Strategic Investment in Photonics to Power the Next Computing Era,” startup companies will pitch their innovative ideas to a panel, followed by audience Q&A, jury deliberation, and then awards and a networking event.

Professional Development Courses: Tuesday, May 26
In addition to the technical program, ECTC 2026 offers 16 Professional Development Courses (PDCs). These four-hour courses on relevant electronic packaging topics are taught by world-class experts, enabling participants to broaden their technical knowledge base. Attendees will be awarded either CEU (continuing education units) or PDH (professional development hours) credits. These courses are offered in conjunction with the co-located IEEE ITherm Conference, which focuses on thermal/thermomechanical issues in electronic systems.

Further information about ECTC 2026
For registration and other information, please visit: https://ectc.net/registration/