LYON, FRANCE – Yole Group Yole Group today announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, glass core substrates, substrate-like PCBs, and Embedded Die technologies.

After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is expected to reach $31 billion by 2030, driven by AI and HPC, as well as broader penetration into consumer, automotive, and defense segments….

Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, comments: “This growth reflects sustained demand for larger, complex, high-ASP substrates capable of supporting generative AI, data center, and advanced package requirements, including finer interconnects, higher yield, and controlled lead times.”

• To read the full story, please click: Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
• ICEPT 2025, Shanghai: Ask for a meeting with our advanced packaging expert at, with Yik Yee Tan, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group. Contact: Sandrine Leroy

LYON, France - July 3, 2025 | Yole Group today announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, glass core substrates, substrate-like PCBs, and Embedded Die technologies.

After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is expected to reach $31 billion by 2030, driven by AI and HPC, as well as broader penetration into consumer, automotive, and defense segments….

Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, comments: “This growth reflects sustained demand for larger, complex, high-ASP substrates capable of supporting generative AI, data center, and advanced package requirements, including finer interconnects, higher yield, and controlled lead times.”

• To read the full story, please click: Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
• ICEPT 2025, Shanghai: Ask for a meeting with our advanced packaging expert at, with Yik Yee Tan, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group. Contact: Sandrine Leroy

Ryder Vietnam from strength to strength

At Ryder, our forward-looking approach to the EMS sector has allowed us to partner with some of the world’s leading brands. In addition to delivering high quality manufacturing services, we’ve also had the honour of helping design and develop their flagship products.

More recently, the support we offer our customers in supply chain diversification and resilience have become of increasing importance. Global supply chains continue to face disruption and shifting trade dynamics, so businesses must invest wisely to stay ahead of their needs.

The same applies to us at Ryder. For our business, Vietnam has proved to be the right investment. Within just six months, our initial Phase 1 Vietnam facility became a core part of our operations - offering customers greater supply chain resilience, flexibility in a changing tariff environment and access to Southeast Asia’s rapidly growing electronics ecosystem.

Announcing Vietnam Phase 2

Phase 2 of our Vietnam investment builds on this success. By expanding our local capabilities - with fully integrated production from PCBA to plastic moulding and injection through to final assembly - we can offer even more robust pan-Asian production, all while maintaining Ryder’s rigorous quality standards and operational consistency.

To enable this, we are investing in the development of a new facility on a 22,000 m² site, including 8,400 m² of green space. The project will comprise four buildings totalling 38,000 m²: two production buildings and supporting facilities, a 4-floor multi-function building and dedicated parking. In line with Ryder’s sustainability objectives, the facility will also include 6,000 m² of rooftop solar PV with a capacity of 1.0MW.

The new facility is 30 minutes’ drive from the new Long Thanh International Airport that opens next year to serve Ho Chi Minh City. Critically. It is only 5km away from our existing Phase 1 facility, enabling us to develop based on the team that we have successfully built up. We are well advanced with government approvals so today we are engaged in the planning of building design, permitting, construction, fit-out and solar infrastructure. Completion is targeted for 2027. Overall, we anticipate that Phase 2 will expand our existing production capacity in Vietnam by about four times.

Adding value to our customers

Vietnam continues to present compelling advantages. The country’s electronics sector is booming, with exports surpassing US$140 billion in 2024. Many of the world’s global technology leaders share our interest in Vietnam, and this is driving innovation and supply chain maturity. Vietnam also offers a skilled workforce, reliable infrastructure and an economic environment that encourages investment in long-term, sustainable growth.

Ultimately, this next phase is about delivering even greater value to our customers. By deepening our presence in Vietnam, Ryder is better positioned to support them with resilient, efficient supply chains, and to seize new opportunities as they arise.

About Ryder

Ryder Industries is a premium electronics manufacturing services provider trusted by leading global brands.

Ryder operates as a one-stop-shop for design and manufacturing services, helping our customers accelerate their time-to-market and capture greater market share. We have built our reputation through a deep commitment to precision and quality in the things we create.

We invest in building close and transparent relationships with our customers and across our supply chain. This is why some of the world's leading brands trust us to be part of their team – from early design through to delivery of the finished products at scale.

Drawing on our Swiss heritage, Ryder has a long-standing track record of minimising our environmental impact, creating a great work environment for our employees and maximising our positive impact within the community.

For further information visit; http://www.RyderEMS.com.

Scanfil and Etteplan have signed a service agreement in production test development. Etteplan will support Scanfil in the development of the Odin functional test platform, and they plan to offer joint test application projects to customers.

Strategic partnership in product development with Scanfil and Etteplan started in 2019. Since then, they have together developed multiple new products for customers. Scanfil owned test platforms and applications are an integral part of Scanfil’s strategy. Standardized platforms will enable faster time to market and lower customer investment costs. Product development services are a key success factor.

“We see that having Etteplan support us with test development will add a lot of synergies to our ‘Design Driven Manufacturing’ project portfolio and will give us even better opportunities to offer a truly turnkey service. We see that more and more customers are looking for support in production testing and we look forward to improving our offering together with Etteplan,” says Reijo Kalenius, Global Development Manager at Scanfil.

“We are proud to continue deepening our collaboration with Scanfil in production testing. This new phase in our partnership reflects the trust and ambition shared between our companies. By combining Scanfil’s manufacturing excellence with Etteplan’s production solutions, we can deliver even more value to our joint customers and help them accelerate innovation and time to market,” says Jari Luotonen, Director, EPS Finland at Etteplan.