SHENZHEN, CN / ACCESS Newswire / December 31, 2025 / PCBsync, a trusted name in PCB assembly and electronic manufacturing service, today announced the launch of its comprehensive full-scale electronic manufacturing service platform. This strategic expansion positions PCBsync as a complete turnkey solution provider for businesses seeking reliable PCB assembly services combined with advanced electronic manufacturing service capabilities.

The global PCB assembly market continues its unprecedented growth trajectory, with projections indicating the electronic manufacturing service sector will exceed $89 billion by 2027. As consumer electronics, automotive systems, IoT devices, and medical equipment manufacturers increasingly seek streamlined production partners, the demand for integrated PCB assembly and electronic manufacturing service solutions has reached new heights.

"The electronics industry is evolving rapidly, and manufacturers need partners who can deliver complete electronic manufacturing service solutions under one roof," said a spokesperson from PCBsync. "Our expanded PCB assembly capabilities now include everything from prototype development to high-volume production, component sourcing to final product testing. This full-scale electronic manufacturing service approach eliminates supply chain complexity and accelerates time-to-market for our clients."

PCBsync's enhanced electronic manufacturing service offering encompasses the complete product lifecycle. The company's PCB assembly services now integrate seamlessly with design support, material procurement, and quality assurance to deliver a truly end-to-end electronic manufacturing service experience.

Key services within the expanded PCB assembly and electronic manufacturing service platform include advanced SMT PCB assembly utilizing high-speed pick-and-place technology, through-hole PCB assembly to meet specialized component requirements, mixed technology PCB assembly that combines both SMT and through-hole processes, BGA and QFN PCB assembly supported by X-ray inspection for verification, turnkey electronic manufacturing services that include full component procurement, box build electronic manufacturing services for complete product-level assembly, prototype-to-production electronic manufacturing services that enable seamless scaling, and integrated test and inspection services embedded within PCB assembly workflows.

To support its expanded electronic manufacturing service capabilities, PCBsync has invested significantly in advanced PCB assembly equipment and infrastructure. The company's electronic manufacturing service facilities now feature next-generation SMT lines capable of placing over 80,000 components per hour, ensuring both prototype and high-volume PCB assembly orders meet the most demanding production schedules.

Austin, Texas, Jan 01, 2026 — Magic Leap today announced it has signed an agreement with Pegatron, a leading global electronics manufacturer, to collaborate on the production of augmented reality (AR) glasses components. Under the agreement, Pegatron will leverage its high-volume manufacturing capabilities to support the scaled production of Magic Leap’s AR components, including its industry-leading waveguides.

The collaboration bridges Magic Leap’s advanced optical innovation with Pegatron’s manufacturing readiness. Magic Leap’s waveguides are designed to deliver high visual performance in wearable form factors, supporting high resolution and brightness within lightweight AR glasses designs. Pegatron’s experience producing complex, high-precision components at scale provides a strong foundation for translating these designs into manufacturable systems.

“This agreement reflects a shared focus on meeting demand for advanced AR components,” said Jade Meskill, SVP of Product and Partner Development at Magic Leap. “By combining our optical and systems expertise with Pegatron’s manufacturing depth, we’re creating a clear path to bring AR components to market at scale.”

Magic Leap has spent more than a decade developing waveguide technology and optical components purpose-built for AR wearables, with a focus on manufacturability and performance. Its approach integrates optical design, materials science, and process engineering to address the industry challenges of miniaturization, power efficiency, and visual quality—critical requirements for next-generation AR glasses.

Beyond waveguides, Magic Leap’s component portfolio includes optics technologies and display systems expertise designed to work together as part of a complete AR system. This agreement with Pegatron creates opportunities to align these technologies with production processes that meet the reliability, yield, and volume requirements of commercial devices.

“This collaboration reflects the growing maturity of the AR ecosystem,” said Jason Cheng, Vice Chairman at Pegatron. “By combining Magic Leap’s component-level expertise with Pegatron’s manufacturing infrastructure, we can support more efficient pathways from development to production.”

Santa Clara, California, USA – TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, announces the appointment of ARK Mfg Solutions, LLC and Dave Murrin to represent the company’s flying probe test systems and technology in the state of Arizona. The company is based in Phoenix, AZ, and can be reached at Tel. 602-684-4636, e-mail: Dmurrin@ARKmfgsolutions.com.

Dave Murrin is an accomplished sales professional with 40 years of sales experience in the electronics industry. Dave’s approach is solutions-oriented, which has benefited customers in high-tech, medical, military, and commercial electronics.

About TEXMAC

TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, is based in Charlotte, North Carolina, and offers a full range of sales and support services, including test and programming services. Locations include facilities in the Boston, Chicago, Dallas, and Silicon Valley areas, with system stock and parts support in two US locations, and support personnel coast to coast. For more information, contact TEXMAC, Inc., 2225 Martin Ave, Suite K, Santa Clara, CA 95050, Tel. (408) 970-8500, and visit www.texmac.com/takaya/.

Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco Airport in San Francisco, California.

The technical program features two exciting keynote presentations. On Tuesday, February 17, 2026, Ashkan Seyedi, Director, Networking at NVIDIA will present “Pioneering System Integration for Tomorrow's AI Workloads.” On Wednesday, February 18, 2025, Ritesh Jain, Senior Vice President, Engineering & Operations at Lightmatter, will present, “3D Photonic Interposers: Lighting the Path Beyond Moore’s Law.” For more information, view the keynote presentation descriptions online.

Technical sessions include over 20 expert speakers who delve into Metrology and Characterization, Assembly and Test, Co-Packaged Optics, Flip Chip, Panel Level Packaging and Innovation in Substrates, and more. The program features presentations from leading organizations including National Institute of Standards and Technology, Nhanced Semiconductors, Purdue University, SkyWater Technology, USHIO, and more. View the technical program here.

The symposium concludes with two professional development courses on Thursday, February 19, 2026. The first course, “The Critical Role of PCB Strain Measurement in Ensuring Reliability of Advanced Wafer-Level Packages,” will be instructed by Takahiro James Hara, Kyowa Americas, Inc. Gamal Refai Ahmed, Ph.D., GAMA63, will instruct the second course, “Current and Future Challenges and Solutions in AI & HPC System Thermal Management.” Access to these courses is included in standard registration. For details about professional development courses, visit this page.

Registration for this event is open online here. All presentations, professional development courses and events open to attendees are included in registration.

For more information about the Wafer-Level Packaging Symposium, please contact Kristin Nafstad at kristin@smta.org or +1-952-920-7682.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.