Press Releases
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
SINGAPORE — July 27, 2021 — With the resurgence of COVID-19 cases in Southeast Asia, SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that SEMICON Southeast Asia (SEA) – 23-27 August 2021 – will be held as a virtual platform to ensure the safety of exhibitors, partners and guests. Registration is open.
SAN JOSE, CA ― July 2021 ― Naprotek, LLC, the leading provider of high-reliability, quick-turn prototypes, and low-to-medium volumes PCBAs and box builds, today announced the appointment of Jim Apfel as the Senior Vice President of Business Development.
As the world witnesses the rapid rise of the IoT revolution, sensor usage is being leveraged to a whole new level. Electrolube, the global manufacturer of electro-chemicals, has collaborated with device manufacturers to ensure RF signals, components and sensors are reliably protected. Sensors detect and respond to changes in an environment with inputs from a variety of sources such as light, temperature, motion and pressure. To facilitate efficient use in a broad mix of end-use environments, particularly harsh environments, sensors need to be protected to ensure reliability and performance especially within the remit of critical applications.
NORTH BILLERICA, Mass., July 2021 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX Vacuum Reflow Oven.
July 22, 2021 – Z-AXIS, Inc. (www.zaxis.net) has added an Ersa VersaFlow 3/45 selective soldering system at its electronics design and contract manufacturing center near Rochester, NY. The latest investment in manufacturing automation increases the company’s capacity and quality for mixed-technology printed circuit board (PCB) assemblies that are made in the USA.
The high-end selective soldering system, valued at more than $1 million, features three stages for board heating, fluxing, and mini-wave or multi-wave soldering. This allows for nine PCBs in process at one time for high throughput and high-volume applications. Offline programming and rapid change-over support Z-AXIS’ high-mix manufacturing business.
“The addition of the new selective solder machine is just a recent example of how Z-AXIS continues to evolve its supply chain management approach in response to the ever-changing global business environments and its customers’ evolving product life cycles,” said David Colangelo, Sales Manager at Z-AXIS. “Some of our customers feed their products into supply chains in new markets that require us to be flexible enough to respond to wide fluctuations in demand, we also have customers that deliver their products in fully gestated, stable markets where low-cost delivery from us is one of their highest priorities. Investing in automation is one of the ways that we maintain our responsiveness to the wide variety of customer needs we satisfy through the evolution of our supply chain. Higher profit achievement and reduced risk are goals we understand and share with our customers.”
Press Releases
- Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components
- SEMICON Southeast Asia 2021 Goes Virtual as COVID-19 Cases Rise in the Region
- Naprotek Appoints New SVP of Business Development
- Electrolube’s UR5118 resin Ticks All The Boxes for IoT RF Sensor Application