Press Releases
SAN JOSE, CA — Zero Defects International [ZDI] has announced their participation as an exhibitor at the Silicon Valley Expo & Tech Forum. This one day event, on December 8th, is organized by the Northern California SMTA Chapter and will be held at the Juniper Dome in Sunnyvale, CA located at 1081 Innovation Way.
Among the printed circuit board assembly [PCBA] products to be shown are Tagarno digital microscopes, Arcadia intelligent component storage and dispensing racks and ZDI's own PCBA contract test and inspection services. Additionally ZDI partner, Viscom USA, will be exhibiting their advanced PCBA X-Ray, AOI and SPI inspection systems in a booth adjacent to ZDI's.
CLINTON, NY — The next episode of Indium Corporation’s free webcast series, EV InSIDER Live, will examine the ups and downs that marked the electric vehicle (EV) and EV charging industry this year.
The free webcast will be held on Thursday, Dec. 8 at 11:30 a.m. EST. Register at https://indium.news/EV-recap.
Join the webcast’s co-hosts, Indium Corporation’s Global Head of e-Mobility and Infrastructure Brian O’Leary and Loren McDonald as they share their favorite highlights of the first season of the EV InSIDER Live webcast and provide your predictions and theirs for the rapidly evolving industry in 2023. Participate in Indium Corporation’s poll on LinkedIn and Twitter to share your predictions for 2023.
Milestones to be discussed from the past year include supply chain issues, massive legislative changes, including bans on internal combustion engine vehicles, and the funneling of billions of dollars in funding for fast charging and battery infrastructure.
NEW BRITAIN, CT — MicroCare LLC, a global manufacturer of high-performance fluids and tools for critical cleaning, coating, and lubricating, will present their full range of products at IPC Apex Expo 2023 from January 24-26 in San Diego, CA. As well as presenting their extensive portfolio, the company will showcase some new additions to assist the electronics assembly, precision manufacturing, telecommunications, and medical device manufacturing industries with their critical cleaning needs.
With a range of environmentally-progressive products designed to improve efficiency, reliability and cost effectiveness, the team of cleaning experts from MicroCare will introduce visitors to its latest innovative products. Taking center stage will be the Sticklers™ Pro360™ Touchless Cleaner and the new product line of Standard Presaturated IPA Wipes.
An increasing number of PCB fabricators are incorporating fiber optic components on their PCBs, thus making the cleaning of the fiber optic connectors a critical step to ensure reliability and performance. Debuted for the first time in the Autumn of 2022 at major fiber industry expos and now introduced here at the IPC APEX Show is the Sticklers™ Pro360™ Touchless Cleaner. The Pro360™ is the industry’s first true, touchless, full fiber end-face cleaner providing the highest level of cleaning performance.
Unlike anything else in the market, the Sticklers™ Pro360™ Touchless Cleaner uses a hand-held dispensing wand to deliver a micro-dose of atomized, high-purity cleaning fluid within a narrow column of pressurized air onto a fiber optic connector end face. The contamination is carried away from the end face with the cleaning fluid during the drying process. The end face is left clean and dry after just one 3.5 second cycle making light work of end-face cleaning.
“The real star of the show will be the Sticklers™ Pro360™ Touchless Cleaner as it will revolutionize the way fiber end-faces are cleaned,” said Ray Bellavance, MicroCare Vice President of Global Sales and Marketing.
“We are seeing many of our products crossing industries now. This touchless cleaner was once only relevant to those in the telecom and fiber optics industries, but with the demand for more sophisticated, complex electronic and fiber assemblies rising, our new product addition will make a real difference to cleaning efficiency and compliance in electronics facilities.”
Another product addition addressing cost-effective cleaning, the new Standard Presaturated IPA Wipes, are being presented for the first time at IPC Apex.
Available as a prestaurated wipe with 99.8% high-purity IPA (Isopropyl Alcohol) or presaturated with a combination of 70% IPA and 30% D.I. (deionized) water, these wipes deliver cleaning solutions to help manufacturers quickly get perfectly clean surfaces at the lowest cost per clean.
The new Standard Presaturated IPA Wipes are ideal for cleaning everything from dust and dirt on work tables and hand tools, to fingerprints from machine control panels and material handling equipment. Contained within a convenient “slam-shut” reusable tub for optimum freshness, and with an economical 175-count drop in refill available, the product helps to reduce reorder frequency and stocking inventory levels and decrease waste.
“IPC Apex offers the perfect opportunity to speak directly to those in the industry and demonstrate our latest cleaning fluids and tools that can make a real difference to their cleaning processes and budgets,” said Bellavance.
To discover all of the MicroCare products, visitors are invited to meet the team at booth 2901 at IPC Apex Expo 2023 from January 24-26 in San Diego, CA.
CHINO, CA — Scienscope International, a leading American supplier of cabinet-style micro-focus X-ray systems, is pleased to announce the appointment of Cesar Gomez Martinez to Optical Inspection Manager for Mexico and Latin America.
Martinez is an industrial engineer with 25 years of experience working in the electronics industry, within the maquiladora industry in the material supply (purchasing) and sales with distributors such as EIS for 21 years.
During his 21 years in sales, Martinez marketed numerous Scienscope products, and was personally able to verify the quality, service and guarantee of the products. When he left EIS, he started a representation company ITSREP, where he was Scienscope’s commercial representative.
"The opportunity arose to take over the optical inspection management in Mexico and Latin America for Scienscope International," stated Martinez. "I am happy be part of a company that likes to serve the client, innovate and continue to grow. I am sure Scienscope will be in the industry for many years to come."
With expertise in machine vision, X-ray and automation, Scienscope is a one-stop solution provider for warehouse automation and optical and X-ray inspection. Scienscope also offers customization based on your facility needs.
For more information, please email Scienscope at info@scienscope.com, call 1-909- 590-7273 or visit www.scienscope.com.
MINNEAPOLIS, MN – The Anti-Counterfeiting Forum, CALCE and SMTA are very pleased to announce that they will be jointly hosting the Counterfeit Electronics and Materials Symposium at the Manufacturing Technology Centre in Coventry, UK, on 14th and 15th March 2023. This international event will feature domain expert speakers from Europe and USA and builds on the history of past events held in the USA by SMTA and CALCE and by the Anti-Counterfeiting Forum in the UK.
The event will focus on current trends, threats and new developments in combating counterfeits in the supply chain. As well as current and emerging new threats, delegates will also be able to hear about current and developing best practice for the management of counterfeits in the supply chain, current and developing new methods for the detection of counterfeits and how to access further information.
The organizers are currently seeking abstracts from interested parties and recommend that you look at the event website to view all topics of interest.
If you plan to submit an abstract, please do so online in the next few weeks. A powerful industry wide technical committee will determine the programme in the coming months.
There will be plenty of opportunity for delegates to raise questions, participate in a discussion and interact with speakers during the day. Delegates will also be able to meet potential solution providers during breaks in the co-located tabletop exhibition space. Industry professionals who are new to the threat and want to learn more as well as experienced practitioners in counterfeit mitigation practices are sure to find this seminar valuable. Online booking will soon be available on the event website: www.anticounterfeitingforum.com
CLINTON, NY — Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San Francisco, Calif., US.
Indium Corporation is the leading solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- Highly accurate thickness control
- Precision edge quality, virtually burr-free
- Optimized cleanliness control
- Default waffle-pack method
Indium Corporation’s Au PDA preforms are available in the following alloys:
- 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, 75Au/25Sn
- 88Au/12Ge
- 82Au/18In
- 96.8Au/3.2Si
Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
Indium Corporation’s AuLTRA™ ThInFORMS™ are 0.00035″-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA™ ThInFORMS™ help combat common issues such as:
- Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035″ preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280°C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- Highest tensile strength of any solder
- High melting point compatible with subsequent reflow processes
- Superior thermal conductivity
- Resistance to corrosion
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #3085 at the show.
