Press Releases
CERN, the European Organization for Nuclear Research, is one of the world’s most important and renowned centers for fundamental physics research. In its large-scale experimental facilities, scientists investigate the fundamental building blocks of matter and the underlying laws of nature. Some of the most complex technical systems ever built are used for this purpose.
As part of a joint project, SEHO is currently working with CERN on a prototype system for a key process step in the production of non-insulated coils made from high-temperature superconductors. These superconductors are considered as a key technology for high-performance, highly compact magnetic coils that will enable unprecedented magnetic field strengths in future particle accelerators, while also increasing efficiency. The project is part of the MuCol (Muon Collider) program coordinated by CERN and thus makes an important contribution to the development of the next generation of accelerator technologies.
SEHO contributes its many years of experience in the precise handling of liquid solder and in the design of stable, reproducible process sequences. A particular focus in on the controlled and process-reliable application of flux – a decisive quality factor for reliable metallic joints and the functional integrity of the superconducting components. With this combination of process expertise and system engineering competence, SEHO supports CERN in taking the step from experimental development toward a robust, industrial-grade prototype solution.
The on-site exchange at CERN was not only to align technical details, but also to develop a shared understanding of the entire process chain – from material science requirements to system-level implementation.
SEHO is pleased and proud to be part of this international project and to contribute its technologies in an environment where cutting-edge research and industrial manufacturing expertise are closely linked. www.seho.de
PENANG, MALAYSIA - JANUARY 2026 - ViTrox aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is pleased to announce the appointment of Juan Alfaro as Mexico Sales and Support Manager, effective 1 January 2026.
In this role, Juan will strengthen ViTrox’s presence and customer support capabilities in Mexico and the broader Latin American region, handling the full solutions of SMT PCBA, including SPI, AOI, AXI, and ARV, supporting the company’s continued growth and commitment to delivering high-quality inspection and automation solutions to customers.
About Juan Alfaro
Juan brings over 15 years of experience in the SMT and electronics manufacturing industry, with extensive regional leadership experience across Mexico and Latin America. He has a proven track record in sales development, customer engagement, system installations, training, and technical services, working closely with customers to enhance manufacturing efficiency and quality.
Throughout his career, Juan has progressed from Field Service Engineering roles to General Management and Regional Management positions, providing him with strong technical expertise as well as strategic leadership capabilities. He possesses a deep understanding of SMT manufacturing processes and automation, with hands-on exposure to technologies including AOI, SPI, selective soldering, routing, reflow ovens, and other automation equipment.
Juan holds a Bachelor’s degree in Mechatronics Engineering and has established strong relationships within the Mexican SMT and EMS market, enabling him to effectively support customers and partners across the region.
“We are excited to welcome Juan to the team,” said Carlos Ponce, Business Development Director for the Mexico Region at ViTrox. “His expertise across the SMT manufacturing processes and automation and deep understanding of the Latin American market will be invaluable as we continue to strengthen our customer engagement and expand ViTrox’s footprint in the region.”
ViTrox’s commitment to strengthening its team and capabilities in the Latin American region is further reinforced with the addition of Juan Alfaro. His leadership and market expertise are expected to play a key role in delivering ViTrox’s full suite of SMT PCBA solutions while ensuring continued customer success across this important region.
Peoria, Arizona, USA – HyRel™ Technologies, a global provider of high quality, quick turn semiconductor modification solutions, announces the appointment of Horizon Sales as Rep in the U.S. Midwest as well as Florida.
“Horizon offers Hyrel Technologies a rare blend of proven experience and fresh momentum in the Midwest region,” states Joshua Casper, Owner and Sales Manager at Horizon. “Our team has spent years building trusted customer relationships, and we are confident Hyrel’s innovative manufacturing services will translate into a reliable resource for years to come.”
Dave Trail founded Horizon Sales more than 30 years ago when he recognized, early on, that Surface Mount Technology (SMT) was poised to revolutionize the industry. Since then, Horizon Sales has been the Midwest’s trusted source for electronics assembly and soldering equipment. Headquartered in Brighton, Michigan, Horizon Sales has grown into a leading manufacturer’s representative and distribution group representing cutting-edge products and also providing outstanding support and service to clients.
About HYREL
HYREL is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HYREL is known for their Quick Turn Precision capability and rapid turnaround. For more information, visit hyrel.tech, or Tel. 480-253-1295.
OSAKA, JAPAN – The board of directors for EMS provider SIIX Corporation has approved a formal business collaboration with Hagiya New Techno Co. Ltd. The strategic partnership is designed to strengthen domestic production capacity and meet the surging demand for high-precision electronic assembly in the automotive and digitalization sectors.
As the global automotive industry shifts toward CASE (connected, autonomous, shared, and electric) technologies, the demand for sophisticated PCB manufacturing and substrate implementation has reached an all-time high. This collaboration allows both companies to address the reshoring trend by combining their technical expertise and manufacturing footprints.
Key Objectives of the Collaboration
Resource Optimization: The organic sharing of production capacity and resources to improve overall operational efficiency and scale.
Knowledge Integration: Combining Hagiya’s on-site responsiveness with SIIX’s global experience in automotive-grade quality management and production technology.
Supply Chain Resilience: Strengthening business continuity planning (BCP) and risk diversification specifically within the Greater Kanto Region.
Cost Leadership: Implementing joint component sourcing initiatives to reduce material costs and pass those efficiencies on to global customers.
Through this synergy, SIIX and Hagiya New Techno aim to provide a robust, high-tech manufacturing alternative that meets the rigorous standards of the modern digital economy.
For more information, visit www.siix.co.jp and https://hagiya.biz-web.jp.
LAKEVILLE, MN – ITW EAE is pleased to announce an extension of its partnership with IPP, expanding their role to include representation and distribute Electrovert soldering and cleaning equipment. This enhancement builds upon IPP’s existing representation of ITW EAE’s Vitronics Soltec soldering equipment, further strengthening the collaboration between the two companies. IPP has been a long-standing and trusted partner since 2009, marking more than 15 years of successful cooperation.
“We are delighted to extend our cooperation with IPP for the UK & Ireland market by appointing them as our official dealer for the Electrovert wave and cleaning range of equipment,” said Frank van Erp, EMEA Sales Director for ITW EAE. “Over the years, IPP has consistently demonstrated values that align closely with our own – a strong technical sales mindset, high ethical standards, transparency, and a proactive approach to problem – solving. We are confident that our existing customers will continue to receive exceptional support as we guild on our successful partnership.”
“Having worked with Vitronics Soltec part of ITW EAE, for over 20 years, and being involved in many solder wave projects, IPP are delighted to add the Electrovert wave and cleaning equipment to the IPP portfolio,” said Jack Daly, managing director for IPP. “The Electrovert range adds more quality solutions for our customer, while enjoying the same level of support and customer service that they have come to expect from IPP, as the leading distributor of Electronics Manufacturing equipment in the UK and Irish markets “.
IPP has been a trusted provider of products and services to the electronics industry for over 40 years. Serving many of the leading global electronics manufacturers across the UK and Ireland, IPP attributes its sustained growth to strong relationships with both clients and suppliers. With extensive experience in the volume electronics manufacturing environment, the IPP team offers deep technical knowledge and highly responsive engineering support, making equipment sales and service a natural fit for the organization.
CHIRYU, AICHI – Fuji Corporation is pleased to announce that it has achieved the world’s first placement of 016008 mm (0.16 x 0.08 mm or 006 x 003 inches) size components on printed circuit boards (PCBs) with its SMT pick and place machine, NXTR, following the successful development of machine technology designed to handle next-generation ultra-small electronic components. This achievement was showcased at the 40th NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo exhibition on January 21, 2026 at Tokyo Big Sight. Note: Based on Fuji's research (as of January 15, 2026).
There is currently an accelerating shift toward edge AI, where AI processing is performed on the device itself. An era is also emerging in which a wide range of everyday devices, including smartphones, wearable devices, and even medical and healthcare equipment, are autonomously analyze information. Amid these trends toward greater functionality in electronic devices, the number of mounted electronic components is increasing significantly. As a result, further miniaturization and higher-density integration of electronic components have become critical and unavoidable technological challenges.
Even the 0201 mm (0.25 x 0.125 mm, 008004 inches) size component, which has long been considered the smallest standard among currently commercialized electronic components, will eventually reach its limits in the pursuit of higher density to integrate more electronic functions into limited board space. A next-generation component size, 016008 mm (006003"), is being developed in response. 016008 mm (006003") size components require approximately half of the placement area compared to 0201 mm size components, allowing for higher-density circuit designs.
Four key control technologies enabling the world's first 016008 mm (006003") size component placement
Fuji has been providing high-speed, high-accuracy pick and place machines capable of reliably handling very small components. Advancements in the following four key control technologies have made the world's first placement of 016008 mm (006003") size components on PCBs possible.
- Stance recognition during handling: The orientation and stance of very small components are checked in real time to ensure optimal part handling.
- Highly-accurate part pickup control: Deviations in pickup position and the effects of static electricity are addressed for stable part pickup.
- Super-fine control of placement pressure: Pressure is precisely controlled to ensure that very small components are not damaged during placement.
- Ultra-high precision placement positioning control: With nano-level position compensation, the highest level of placement accuracy in the industry is achieved.
Aiming to build a comprehensive solution for next-generation very small component placement
To place components 016008 mm (006003") or smaller, it is essential to optimize not only the placement process but also all processes related to placement, including panel design, solder paste materials, stencils, reflow, and inspection, at a high level.
Fuji is developing machine technology for placement robots while deepening cooperation with partners to build a total process solution, including production materials and related materials, taking the race for the miniaturization of electronic components to a new stage as the edge AI era gets fully underway.
