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Guadalajara, Jalisco – On August 5, ASMPT, a global leader in solutions for the electronics industry, together with SMarTsol Technologies, officially inaugurated the Advanced Competence Center in Guadalajara. This center, located at ASMPT Mexico’s facilities, is designed to provide training, demonstrations, and specialized technical guidance to professionals in the electronics industry.update is 

The event was attended by over 30 industry executives from the region, as well as Cindy Blanco, Secretary of Economic Development of the State of Jalisco, and featured a keynote speech by Macario Schettino, who shared insights on development and innovation in the Clean Cacheindustry.

During the inauguration, attendees had the opportunity to experience ASMPT’s advanced technologies firsthand, including demonstrations of placement, inspection, and process management equipment, and explore how these solutions can optimize efficiency and quality in electronic manufacturing.
Ivan Romo, Director of SMarTsol Technologies, highlighted:

"The opening of this center reaffirms our commitment to the electronics industry in Mexico, providing industry leaders access to cutting-edge training for their teams and solutions that drive productivity and innovation."

Ramon Hernandez, Director of ASMPT Mexico & Brazil, commented:

"We are proud to have this space in Guadalajara, enabling industry professionals to learn, experience, and apply advanced technologies directly in their production processes within their companies."

HUTTO, TX – ViTrox Americas Inc. is pleased to announce the promotion of Edward Pechin to Technical Support Manager, effective August 1, 2025. In this role, Ed will lead the U.S.-based technical support team, overseeing field service, installations, and customer satisfaction across ViTrox’s growing North American footprint.

Since joining ViTrox, Ed has played a key role in supporting a wide range of vision inspection platforms, including AOI, AXI, and conformal coating systems. He brings extensive experience in troubleshooting, programming, and automation, along with a proven ability to mentor and grow technical teams.

“Ed has shown a natural leadership ability and deep technical knowledge across all of our systems,” said Richard Osborne, Sr. General Manager of U.S. and Canada. “He’s taken the initiative to master both hardware and software, and he always approaches support with the customer’s perspective in mind. His promotion is a reflection of the trust he’s earned from both our internal team and our customers.”

Prior to his promotion, Ed held roles in field service engineering and integration management, supporting the development of custom automation systems and collaborating with mechanical, electrical, and control engineers. He also holds Fanuc Academy certifications in mechanical, electrical, and safety programming, and has hands-on experience with four- and six-axis robotic systems.

Ed is a subject matter expert in a wide range of SMT and inspection equipment, with deep knowledge of ViTrox systems, screen printers, scanners, AOI and SPI platforms, reflow ovens, laser etchers, and robotic vision integration. His familiarity with both legacy systems and next-generation automation makes him a versatile leader equipped to support ViTrox’s customers across diverse industries.

ECD today announced that it has appointed Advanced Manufacturing Services Ltd. (AMS) as its representative and distribution partner in the United Kingdom. AMS has served the electronics industry for nearly 25 years and has three locations across the UK and Ireland staffed by a team of over a dozen electronics professionals.

Emphasizing the importance of accessible local expertise, ECD President Tara Fischer comments on the decision to engage AMS to bolster its UK sales and support efforts. “Electronics manufacturers are navigating a climate of supply chain and geopolitical challenges, demanding production expectations, and increasingly complex technology,” says Fischer. “There is little room for error, and a dependable, knowledgeable, hands-on support team is critical for success. That is precisely what AMS offers. We are thrilled to welcome them into the ECD network.”

Historically strong in sectors such as aerospace, automotive, defense, and industrial controls, the UK electronics manufacturing market is also experiencing growth in medical devices and alternative energy technologies. Enabling these high-reliability applications requires excellent process control, efficient production protocols, and traceability. High-performance thermal profiling tools are a vital component in ensuring repeatable, reliable, and high-yield soldering processes to secure high-reliability assemblies.

Recognizing the role of cutting-edge thermal profiling in today’s electronics sector, AMS believes ECD’s long-standing reputation as a soldering process authority makes it an ideal principal.

“ECD stood out to us for their innovation, product build quality and usability, and deep understanding of customer needs,” shares Richard Jones, Founder of AMS. “ECD, however, is far more than a product company. They are a solutions partner built on a foundation of integrity, trust, and a commitment to delivering exceptional technology and award-winning support. We look forward to a long and productive relationship.”

As of July 1, AMS is ECD’s sole UK representative and distributor of its solder profiling solutions, including M.O.L.E.® thermal profilers, SelectiveRIDER®, OvenRIDER® NL 2+, and WaveRIDER® NL 2 machine quality management pallets, as well as the brand new M-VP™ sealed barrier for vapor phase soldering processes. Contact AMS via email at sales@ams-electronics.co.uk or call +44 (0) 1260 270 950.

The Board of TT Electronics PLC ('TT') is delighted to announce the appointment of Eric Lakin, who has been acting Chief Executive Officer and a member of the Board since 10 April 2025, as its Chief Executive Officer with immediate effect. This decision follows an external search process conducted by the Nomination Committee.

Commenting on the appointment, Warren Tucker, Chair of the Board said:

"After an extensive, externally facilitated search that considered a strong field of external candidates, the Board unanimously concluded that Eric is the best person to lead TT forward. Eric is a proven leader, with sector experience and has made good progress in stabilising the company since taking over in April. I look forward to supporting him as we focus on our short-term priorities and the turnaround of TT, ensuring it delivers for all our stakeholders."

Commenting on his appointment, Eric Lakin said:

"I am very pleased to take on the role of CEO and grateful for the trust placed in me by the Board. I look forward to continuing to work alongside our strong team as we deliver on our commitments to customers, employees, and shareholders."

Save as set out above, there are no further matters requiring disclosure pursuant to Rule 6.4.8R of the UK Listing Rules in relation to this appointment.

Atlanta, GA – Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025. Organized by the Binghamton University Integrated Electronics Engineering Center (IEEC), EPS brings together thought leaders from industry, academia, and government to share the latest advances in electronic packaging, assembly, and reliability.

The two-day program will feature keynote addresses, technical sessions, and panel discussions covering heterogeneous integration, advanced materials, system reliability, thermal management, and additive manufacturing. Attendees will gain insight into emerging trends and manufacturing challenges across defense, aerospace, automotive, semiconductor, and high-performance computing applications.

As an exhibitor, Koh Young will showcase how its AI-powered True 3D dimensional metrology and inspection solutions are helping manufacturers meet the exacting demands of advanced packaging and semiconductor processes. From wafer-level to system-in-package measurement, Koh Young’s technology delivers accurate, repeatable data that enables smarter process control, higher yields, and zero-defect production goals.

Dimensional Metrology for Advanced Packaging

Koh Young’s Meister Series is engineered specifically for advanced packaging applications such as system-in-package (SiP), wafer-level packaging (WLP), and die stacking. These systems provide ultra-high-resolution inspection capabilities to handle the smallest features and tightest tolerances in next-generation designs. Complementing the Meister series, ZenStar delivers wafer-level dimensional metrology to detect and measure critical parameters at the earliest possible stage, ensuring that only known-good components move forward in the process. Together, these solutions help manufacturers maintain tight process windows, improve yield, and reduce costly rework.

“Advanced packaging technologies are driving rapid innovation in electronics manufacturing, but they also introduce new complexities in process control and quality assurance,” said Joel Scutchfield, General Manager at Koh Young Ameria. “EPS offers a valuable opportunity to connect with engineers, researchers, and decision makers to demonstrate how our True 3D solutions can help them overcome these challenges and accelerate innovation.”

In addition to networking with attendees, Koh Young will be available to discuss real-world case studies and technology roadmaps that address next-generation packaging needs. The exhibition floor will provide a hands-on look at the tools and solutions shaping the future of electronics manufacturing.

Clemsa, a manufacturer based in Spain and part of the Italy-headquartered FAAC Technology Group, has transformed its electronics production capabilities through the installation of a new Europlacer SMT placement line. Facing the challenge of producing a wide variety of access control products in a competitive and fast-changing market, Clemsa sought a solution that would increase flexibility, reduce production and inventory costs, and improve overall quality.

“We needed to expand our production capacity in terms of product diversity, not volume,” said Miguel Angel Lopez, CEO of Clemsa. “With Europlacer, we can produce exactly what we need at any time, without delays or extensive reconfiguration. That has helped us dramatically reduce both production and inventory costs while staying highly competitive.”

Clemsa manufactures electronics for access systems, including automatic doors, remote control units, RFID cards, and control boards. With 20 to 30 distinct products in active production, frequent changeovers and fast response times are critical. The Europlacer platform delivers exceptional component feeder capacity, allowing all components to remain loaded and ready. Changeovers take just 10 minutes, compared to 30–40 minutes with other brands – up to a 75% improvement.

“We simply switch programs and adjust the conveyor width — the line is instantly ready,” explained Luis Miguel, Production Manager at Clemsa. “This level of agility helps us maintain efficiency despite a complex product mix.”

One key advantage has been Europlacer’s integration of a bulk feeder for battery contactors, a component used across multiple Clemsa products. During the selection process, Clemsa requested as a prerequisite that the machine be capable of positioning battery clips, served in bulk in large bags. This component needed to be fed from a hopper that, by means of vibration, would advance to the picking area, allowing the pick and place machine to position it from there. Unlike other systems that require separate handling or third-party solutions, Europlacer integrated this functionality directly into the machine, increasing accuracy and reliability during assembly, and was the only provider that Clemsa engaged with that could meet this requirement.

The hopper was sent to the Europlacer factory where it was revised and its feeding system improved. Crucially, it was converted into an intelligent hopper with connection to Europlacer’s RC software, thereby optimising the feeding process, efficiency, and reliability. Similar bespoke solutions have been developed by Europlacer for other customers, such as automatic feeding of LED lenses.

Clemsa also praised Europlacer’s support and training services. “Their engineers have been knowledgeable and always available,” added Luis. “From installation to training, the experience has been outstanding.”

When evaluating solutions, Clemsa compared multiple SMT equipment providers. Ultimately, Europlacer stood out for its flexibility, ease of use, and commitment to automation — all of which aligned perfectly with Clemsa’s manufacturing goals.

“If another manufacturer were considering their options, I’d simply invite them to visit us,” said Miguel. “They will see the speed, flexibility, and most importantly, the consistent quality we achieve with Europlacer. In my opinion, it is an easy decision.”

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