Baltimore, MD – March 2026 – The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, has added the Prime TruVision™ X-ray and computed tomography (CT) inspection system from Creative Electron to its engineering and analysis services. The system allows TTCI to examine the internal structure of electronic assemblies with high-resolution imaging, supporting more detailed failure analysis and process investigation for its customers.

The Prime TruVision platform combines imaging software with a mechanically stable inspection platform designed for precision motion and repeatable results. The system supports 2D X-ray imaging, laminographic analysis, and full 3D CT scanning, allowing engineers to view internal structures such as solder joints, plated through holes, vias, and component connections without destructive cross-sectioning.

Using the system’s imaging and reconstruction tools, TTCI engineers can evaluate voiding levels, inspect BGAs and QFNs, detect barrel cracks in plated through holes, and investigate structural defects that may affect long-term reliability. These capabilities allow engineers to analyze internal features of assemblies and identify manufacturing issues during failure analysis.

“At The Test Connection, Inc., we continuously invest in technologies that strengthen the value we bring to our customers,” said Bert Horner, President of The Test Connection, Inc. “The Prime TruVision system from Creative Electron combines powerful imaging software with exceptionally stable hardware, allowing our team to deliver advanced X-ray and CT inspection services that complement our electrical test capabilities. This investment supports our mission to help manufacturers improve quality, reliability, and root-cause analysis across their products.”

The X-ray and CT capability complements TTCI’s electrical test engineering services, which include flying probe test, in-circuit test (ICT), boundary scan, and functional test development. Combining electrical validation with internal structural inspection allows TTCI engineers to investigate both electrical and physical causes of product issues within a single engineering workflow.

“TTCI’s investment in our TruView Prime X-ray system strengthens their ability to perform deeper and faster failure analysis on complex electronic assemblies,” said Bill Cardoso. “With higher resolution and rapid inspection capability, their engineers can pinpoint root causes more quickly and deliver more reliable insights to their customers.”

“Creative Electron’s Prime TruVision platform brings together powerful imaging software and robust hardware stability, giving our team a highly capable tool for advanced X-ray and CT inspection,” Horner added. “By integrating this technology into our services, The Test Connection is expanding beyond traditional electrical test into deeper structural analysis of electronic assemblies. We see a strong growth pathway both within the CCA and PCB industries and in emerging sectors where non-destructive inspection plays a critical role in reliability and quality.”

The system will be used across a range of applications including failure analysis, process validation, counterfeit component investigation, and reliability studies for high-performance electronics. Industries supported by TTCI include aerospace, defense, medical devices, and other high-reliability sectors where internal inspection is often required.

The Test Connection, Inc. will highlight its expanded inspection and test services at IPC APEX EXPO 2026, booth #3522.

To learn more about TTCI’s test services, visit www.ttci.com.

Plymouth, WI — February 2026 — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.

This strategic integration unites Kurtz Ersa’s established reflow soldering expertise with ATV’s advanced vacuum and specialty thermal processing technologies, creating a complete solution portfolio for microelectronics, semiconductor packaging, and power electronics manufacturing.

Advanced Thermal Solutions for Semiconductor Applications

At the core of the expanded lineup is the SRO i-Line reflow platform, engineered for high-precision semiconductor and substrate processing. The system delivers exceptional temperature uniformity, tightly controlled heating zones, optimized cooling performance, and vacuum in combination with Formic Acid and Nitrogen, making it well suited for DCB/AMB substrate soldering, power module assembly, and other thermally demanding applications. Its stable heating technology ensures repeatable results across both development and production environments.

The portfolio also supports sintering, curing, and additional specialty thermal processes required for next-generation semiconductor devices. With programmable process control, data logging, and controlled atmosphere capabilities, the systems are built to meet strict quality, traceability, and performance standards.

A Dedicated Semiconductor Focus

The formation of Kurtz Ersa Semicon GmbH reflects the company’s long-term investment in microelectronics and semiconductor technology. By combining inline reflow platforms with batch vacuum systems, Kurtz Ersa now offers customers a coordinated path from R&D and pilot production to scalable manufacturing—while maintaining precise thermal control and documented process repeatability.

“Semiconductor manufacturers are facing tighter process windows and increasing reliability requirements,” said Ernie Grice, Vice President Sales at Kurtz Ersa, Inc. “With Kurtz Ersa Semicon GmbH, we are bringing together complementary technologies and focused expertise to deliver advanced thermal solutions tailored specifically for microelectronics and power electronics production.”

With decades of experience in thermal processing and a growing global presence, Kurtz Ersa continues to expand its capabilities to support the evolving needs of semiconductor manufacturers worldwide.

For more information about Kurtz Ersa and its semiconductor solutions, visit www.ersa.com.

ATLANTA, GA – The average index score reported by the ECIA’s February Industry Pulse survey shows sales optimism continuing to soar at lofty heights. Average sales sentiment inched up to 139.7 from 138.0 in January.

“This marks the ninth straight month of strong positive sentiment overall and in each of the major component categories,” observed ECIA Chief Analyst Dale Ford. “This is also the fifth consecutive month where every subcategory has registered robust positive results. The outlook for March points to expectations for continued robust strength with a projected overall score of 141.1. Results from the Q1 quarterly survey extend this expectation for a healthy sales climate all the way through the first half of 2026,” he continued. “The overall average share of survey respondents reporting positive sales growth was 71% in Q1 and 72% in Q2.

For the complete summary report, click here.

ECIA’s Industry Pulse: Electronic Component Trends and Sentiment provides highly valuable and detailed visibility on industry expectations in the near-term through the monthly and quarterly surveys. This “immediate” perspective is helpful to participants up and down the electronics components supply chain.

The complete ECIA Industry Pulse: Electronic Component Trends and Sentiment Report is delivered to all ECIA members as well as others who participate in the survey. All participants in the electronics component supply chain are invited and encouraged to participate in the report so they can see the highly valuable insights provided by the Industry Pulse: Electronic Component Trends and Sentiment report. The return on a small investment of time is enormous! Members can log in here to see the full report.

The monthly and quarterly Industry Pulse: Electronic Component Trends and Sentiment reports present data in detailed tables and figures with multiple perspectives and cover current sales expectations, sales outlook, product cancellations, product decommits and product lead times. The data is presented at a detailed level for six major electronic component categories, six semiconductor subcategories and eight end markets. Also, survey results are segmented by aggregated responses from manufacturers, distributors, and manufacturer representatives.

Non-members can now purchase the report at https://www.ecianow.org/purchase-stats-reports.

Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced ambitious sustainability targets through 2030 that focus the next five years on clean energy, labor rights, supply chain ESG and global initiatives for the world’s largest electronics manufacturer and leading technological solutions provider.

Stepping up sustainability as the Group’s core driver of long-term competitiveness and operational resilience, the 2026–2030 Long-Term Sustainability Goals, benchmarked against 2025 levels, comprise of 34 concrete actions across 21 strategic categories. The updated roadmap responds to evolving global ESG expectations and offers a broader value chain impact.

“This roadmap marks Foxconn’s transition into a new phase defined by data transparency, institutionalized targets, and collaborative partnerships,” said James Wu, Foxconn Spokesperson and a lead for the Group’s Sustainability Committee. “With hundreds of campuses around the world and tens of thousands of suppliers, we are taking steady, measurable steps to bring up our ecosystem to be being cleaner, greener and smarter.”

By 2030, the entire group aims to achieve multiple environment targets, including a 30% greywater recycling rate; a 75% share of renewable energy use; self-invested green electricity accounting for more than 30% of the group's renewable energy usage; and a 10% reduction in energy intensity.

Foxconn, for the most part, reached its previous set of 32 long-term ESG goals issued in 2022 ahead of schedule, putting it on track to achieve its 2050 net zero emission target, while fulfulling social and governance commitments, including enhancing workplace wellness, improving sustainable supply chains and strengthening cybersecurity and board accountability.

Looking ahead, AI will be embedded in sustainable technology innovation goals, such as doubling the number of Foxconn’s Lighthouse-standard factories and exponentially discovering IP-worthy applications to share with the industry.

For the first time, the Group will coordinate its corporate policies and supplier standards with 15 major international frameworks, including TCFD, SASB, and IFRS S1/S2. The company is committed to maintaining a top 10% ranking across five leading ESG rating agencies, including MSCI and Sustainalytics.

In bringing up the supply chain, the new goals include initiating a 100% sustainability audit of Foxconn’s Tier-1 suppliers and promoting "short-chain, low-carbon manufacturing," aiming for over 80% local sourcing of institutional materials to strengthen operational resilience in global regional economies.

The health and safety of employees is a top priority for Foxconn. In this key area, goals require 100% coverage of human rights risk assessments at global production sites by 2030. For high-risk issues identified during assessments, remedial and mitigation measures will be implemented immediately. The company will continuously strengthen internal management and labor dispatch practices, and systematically promote annual audits to ensure compliance with the Group's Code of Conduct and accountability standards. Global high-risk contractors will all need to meet ISO 45001 Occupational Health and Safety Management System certification.

In another first, Foxconn is incorporating Nature-based Solutions (NbS) in its sustainability initiatives. With partners, the Group will organize environmental and ecological restoration actions annually in our major production regions through 2030, reaching a global yearly total of 80,000 cumulative volunteer hours.