DAYTON, OH ― January 2026 ― Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is pleased to announce the appointment of Greg Rowell as Global Director of Continuous Improvement.

In this role, Greg will lead continuous improvement initiatives across Libra Industries’ global operations, with a focus on strengthening operating systems, improving productivity, and driving execution consistency in support of quality and customer value. His work will center on embedding disciplined, data-driven improvement practices into day-to-day operations.

Greg brings extensive experience in operational strategy and continuous improvement within complex manufacturing environments. His background in Lean, Six Sigma, and practical problem-solving methodologies positions him well to support Libra’s commitment to operational excellence and scalable growth.

“We are pleased to welcome Greg to Libra Industries,” said Andrew Williams, CEO of Libra Industries. “His expertise in continuous improvement will help further strengthen our manufacturing platform and support our customers’ increasingly complex requirements.”

Libra Industries’ competitive advantage is built on more than 85 years of precision machining and design/assembly expertise, over 35 years of PCBA manufacturing, and the Tier 1 EMS foundation of its Guaymas, Mexico facility.

Greg will operate in a hybrid capacity from Libra Industries’ site in Dallas, Texas, working closely with all manufacturing, engineering, quality, and operations teams.

GRAFENBERG, GERMANY – Optical Gaging Products (OGP®, www.ogpnet.com), a division of Quality Vision International Inc (QVI®), a world-leading manufacturer of optical and precision multisensor metrology systems for industrial quality control, has appointed Panos T. Angelopoulos as President, Global Sales, succeeding R. Stephen Flynn, who is retiring after 31 years with the company.

Panos brings to OGP over three decades of experience in executive leadership roles within industrial and commercial manufacturing environments. Throughout his career, he has held sales and marketing positions that have continually contributed to market expansion and revenue growth.

Panos joins OGP from RAMPF Group, Inc., headquartered in Grafenberg, Germany, where he served as Business Unit Manager. Before that, Panos was President, CEO, and owner of Cleveland Polymer Technologies, which joined the RAMPF Group in 2017. He holds a BS in Mechanical Engineering and an MBA in Management & Finance, both from the New York Institute of Technology in New York, NY.

Keith E. Polidor, the company’s 3rd generation President and Chief Executive Officer, remarked, “Having Panos join as OGP President, Global Sales, ensures that we will continue to grow and innovate optical and multisensor solutions to meet the world's precision measurement needs, and to be our customers’ first choice to solve their challenging dimensional metrology requirements. Under Panos’ leadership, OGP will remain steadfast in delivering leading innovation and unparalleled service, driven by the dedication of our employees and the support of our partners.”

Panos begins his tenure with OGP at a pivotal time in the company’s 80-year history, as OGP’s tradition of technological advancements continues with the next evolution of SmartScope – SmartScope M-Series – featuring the patented IntelliCentric-M optical system, delivering unparalleled accuracy and repeatability to the world’s leading manufacturers.

OSAKI, JAPAN – Rohde & Schwarz has opened a new larger office in Osaki, Japan, with increased capabilities, to deliver an innovation advantage for the Japanese automotive community.

The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events.

Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”

EMC measurements under dynamic driving conditions with AIP Automotive

The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.

Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices

Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.

The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem.

IPG Automotive and Rohde & Schwarz enhance autonomous driving radar testing capabilities

IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.

This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.

MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan

The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.

Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.

The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.

The new location, which replaces the original one in Shinjuku, has significantly enhanced facilities for service, repair, calibration and engineering support of test equipment as well as increased space for hosting customer events.

Munich/Osaki, - At the new office Rohde & Schwarz hosts demonstrations developed in collaboration with leading automotive industry partners. Noashi Saito, General Manager of Rohde & Schwarz Japan commented, “We are very proud of our new facility in Osaki, and we invite the Japanese automotive community to make the most of this resource and the talented staff who work here.”

EMC measurements under dynamic driving conditions with AIP Automotive
The electromagnetic emissions of vehicles, particularly EVs, change significantly depending on their operational state. Therefore, to get a true understanding of the EMC performance of an electric vehicle, it is essential to test it under dynamic driving conditions. A test system that combines EMC receivers and automation software from Rohde & Schwarz with the AIP EMC Chassis Dynamometer enables vehicle manufacturers and Tier 1s to obtain an evaluation of the EMC performance of their designs under realistic operational conditions. AIP has enhanced this system with R&S radar target simulators to also provide vehicle-in-the-loop testing of radars in a controlled environment. The new R&S office in Osaki has a dedicated space for calibration of EMC equipment and is near AIP’s new office, enabling fast servicing and support turnaround time for AIP.

Rohde & Schwarz strengthens in vehicle network compliance testing in Japan with GRL and Analog Devices
Rohde & Schwarz is further expanding its collaboration with Granite River Labs (GRL) and Analog Devices, Inc. (ADI) to support in-vehicle network compliance testing in Japan. GRL, a provider of compliance test and certification services for standards like multigigabit Ethernet and Automotive SerDes Alliance (ASA), has a history of utilizing Rohde & Schwarz test equipment. ADI, a global semiconductor leader, is working closely with Rohde & Schwarz globally to advance the adoption of the emerging OpenGMSL™ standard via the OpenGMSL Association.

The collaboration is supported by Rohde & Schwarz Japan's new expanded facilities and the availability of leading-edge oscilloscopes and vector network analyzers, designed to ensure fast and reliable standards-compliant testing, including solutions specifically tailored for the Japanese market. This will accelerate testing processes and facilitate the building and delivery of OpenGMSL-based solutions. The availability of local expertise and instruments is considered critical in supporting the global automotive ecosystem.
IPG Automotive and Rohde & Schwarz enhance autonomous driving radar testing capabilities

IPG Automotive, a leader in virtual test driving, partners with Rohde & Schwarz to integrate Automotive Radar Hardware-in-the-Loop (HIL) testing from the proving ground into the development lab. The collaboration combines IPG Automotive’s CarMaker simulation software with Rohde & Schwarz’s scalable AREG800A radar target simulator, the R&S QAT100 advanced antenna array, and the compact R&S RadEsT target simulator.

This combination provides vehicle manufacturers and Tier 1 suppliers with the ability to simulate ADAS/AD scenarios, including those defined in Euro NCAP, in a controlled, safe, time-efficient, and cost-reducing environment. In the expanded office facilities in Osaki both companies jointly set up and demonstrate HIL systems alongside the development of local traffic scenario simulations specific to Japan.

MediaTek and Rohde & Schwarz expand automotive NTN testing to Japan
The automotive industry is actively exploring non-terrestrial networks (NTNs) to provide ubiquitous wireless connectivity for always-connected vehicles. The capabilities of pioneering chipset developer MediaTek’s latest NR-NTN device have been demonstrated using the Rohde & Schwarz CMX500 radiocommunication tester, a versatile solution for testing various NTN technologies including NR-NTN, NB-NTN, and Direct-To-Cell (D2C, DTC). The CMX500 offers multiband and multi-orbit support, along with a dedicated NTN workspace for visualizing deployed networks and their parameters.

Rohde & Schwarz leverages its wireless and automotive expertise to help navigate the challenges associated with NTN, identify key vehicle components, and explain the role of testing in creating NTN-enabled vehicles. A global collaboration between MediaTek and Rohde & Schwarz, spanning Europe, North America, and China, is now expanding to Japan.

The office in Osaki will facilitate a greater number of projects for Japanese automotive partners, including faster support for local NTN projects with MediaTek. The R&S CMX500 empowers customers in Japan to test and optimize the entire NTN integration chain — from chipsets and modules to antennas, TCUs, and vehicles and validates NTN vehicle connectivity tailored to the Japanese market.

MULINO, OR – ASC Sunstone Circuits, a leading provider of high-quality, quick-turn printed circuit boards (PCBs), is pleased to announce a significant enhancement to its Oregon manufacturing facility. As part of a strategic initiative to align capabilities across the organization, a high-precision via fill machine has been transitioned from parent company American Standard Circuits (ASC) to the ASC Sunstone facility in Mulino.
This equipment transfer represents a deepening of the synergy between both facilities, providing customers with faster access to advanced fabrication techniques previously unavailable on site.

Streamlining Complex PCB Fabrication

The addition of dedicated via fill equipment allows ASC Sunstone to manage complex design requirements - such as conductive and non-conductive via fill - entirely in-house. This move is designed to:

• Reduced Lead Times: By integrating in-house via fill capabilities at the Oregon facility, ASC eliminates the need to transfer boards between plants or outsource specific processes. This localized control ensures that complex commercial designs stay on the fast track, maintaining industry-leading quick-turn delivery schedules.
• Enhanced Reliability: Bringing the via fill process in-house at the Oregon plant ensures total quality control over boards requiring flat surfaces for component mounting (via-in-pad). This provides customers with superior structural integrity and optimized assembly surfaces without the logistics of multi-site handling.
• Support for Advanced Commercial Designs: This equipment enables the Oregon plant to support tighter pitch designs and improved thermal management locally. By streamlining the production of sophisticated boards, ASC provides a faster, more efficient path for domestic prototyping and production.

A Unified Manufacturing Strategy

"Since joining forces with American Standard Circuits, our goal has been to provide the best of both worlds: ASC’s vast technical resources and Sunstone’s legendary speed and ease of use," said Mathew Stevenson, VP & General Manager at ASC Sunstone Circuits. "Moving this via fill capability to Oregon is a perfect example of that synergy. We are literally putting the tools for complex engineering directly into the hands of our quick-turn customers."

About ASC

ASC is a premier PCB solutions provider formed by the integration of American Standard Circuits and Sunstone Circuits, bringing together over 50 years of collective industry expertise. By unifying high-tech fabrication capabilities with industry-leading quick-turn agility, the company provides a comprehensive "design-to-production" workflow across its domestic manufacturing facilities. ASC delivers a robust technology portfolio—including Ultra HDI, RF/microwave, metal-clad, flex, and rigid-flex solutions—supported by world-class certifications and a legendary commitment to customer service. From rapid prototyping to large-scale production, ASC leverages its combined multi-site capacity to meet the technical precision and scalability demands of the global electronics industry.

For more information, please visit www.ascsunstone.com.