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NEW YORK, NY – RENEX, a European leader in advanced electronics manufacturing solutions, is pleased to announce its exclusive distribution agreement with Technica USA, a leading distributor in the United States. Under this partnership, Technica USA will distribute the REECO brand of ESD and cleanroom products in key territories, including California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, with nonexclusive coverage in Washington and Utah.

Technica USA, established in 1985, is recognized for its expertise in providing advanced equipment and materials to the PCB Fab, Substrate, PCB Assembly, and MEMS markets. Known for delivering comprehensive solutions, Technica USA specializes in sales, installation, service, and inventory management, making it a trusted partner for manufacturers across North America.

Frank Medina, President/CEO of Technica USA, expressed his enthusiasm about the partnership: “We are honored to be chosen as the first distribution partner for RENEX in the United States, representing and supporting the REECO brand of ESD and cleanroom products. These products meet the highest quality standards, and their design reflects a deep understanding of the needs of end-users. The addition of the REECO brand complements our portfolio of best-in-class solutions for our customers.”

“This milestone is the result of over a year of hard work in the North American market. Having Technica USA as our official distributor is not just a partnership – it is a testament to the strength and potential of our business outside the EU,” added Robert Beber, Export Director at RENEX. “Technica’s trust in RENEX and the REECO brand confirms the quality of our products. We are thrilled to join forces at the APEX show to showcase REECO to the North American audience and look forward to expanding our distribution network in other U.S. regions."

Predrag Topić, owner of RENEX, also commented on the significance of the partnership: “This agreement with Technica USA is an important step in strengthening the presence of the REECO brand in the United States. Technica’s professionalism, market expertise, and dedication to customer satisfaction make them an ideal partner. Together, we aim to ensure that the REECO product line exceeds the expectations of industry professionals, delivering reliable solutions tailored to their needs.”

RENEX and Technica USA invite attendees to visit their booths at the upcoming IPC APEX EXPO, taking place March 18-20 in Anaheim, CA. REECO products will be showcased at booth #1629, while Technica USA will be at booth #4110. This collaboration marks a significant step in bringing world-class ESD and cleanroom solutions to U.S. industries.

For more information or for a copy of their product brochure, visit www.renex.pl 

BILLINGSTAD, NORWAY – Kitron has entered into a significant long-term contract for the production and services of advanced optical assemblies tailored for the Unmanned Aerial Vehicle (UAV) and drone market.

The contract is expected to generate revenues exceeding EUR 30 million in 2025.

Production will be carried out at Kitron’s facility in the Czech Republic, leveraging the company’s extensive experience in building complex assemblies.

“We are proud to embark on this long-term collaboration, which strengthens our position in supporting technological advancements in unmanned systems,” says Peter Nilsson, President and CEO of Kitron.

The new contract solidifies Kitron’s role as a key supplier of advanced box-build assemblies that meet stringent size, weight, and power requirements without compromising performance. These assemblies are essential for applications such as security, surveillance and inspection, where high-quality imaging is critical.

DAYTON, OH – Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is pleased to announce significant enhancements to its machining capabilities at its corporate headquarters in Dayton, Ohio. These investments further cement Libra Industries' reputation for delivering advanced solutions in semi-cap, aerospace, defense, and medical manufacturing.

The Dayton facility now boasts cutting-edge equipment, including:

  • Kitamura Medcenter 5AX 5-Axis Vertical Machining Center: This high-performance system enables exceptional machining precision and repeatability, producing complex geometries with superior surface finishes. With its high-speed spindle and multi-axis capabilities, the 5AX eliminates secondary operations and reduces production cycle times, ensuring optimal efficiency and quality.
  • Mitsubishi MV1200-S Wire EDM Machines (x2): These machines excel in achieving tight tolerances for intricate features such as thin-wall flexures. The advanced linear shaft motor drive system and next-gen wire threading allow for lights-out operations, faster cutting speeds, and immaculate surface finishes.

“By investing in these state-of-the-art systems, we’re reinforcing our commitment to delivering unmatched precision and reliability to our customers,” said Joe Egbert, VP/General Manager of Libra Industries Dayton facility. “The enhanced machining capabilities at our Dayton facility position us to meet the growing demands of complex, high-precision projects while maintaining the highest quality standards.”

With 45 CNC machines and a robust team of engineering, supply chain, and quality professionals, Libra Industries’ Dayton facility specializes in complex systems integration and advanced robotics assembly. Additionally, its ISO Class 7 cleanroom facilities ensure precision manufacturing for sensitive applications.

For more information about Libra Industries and its expanded capabilities, visit www.libraindustries.com.

DALLAS, TX – StenTech Inc., the leading multinational SMT printing solutions company, is pleased to announce the appointment of Jordan Owens, MBA, CPA, as its new Chief Financial Officer. Jordan commenced his duties at StenTech’s headquarters in Dallas, Texas, and brings with him a wealth of expertise in financial leadership and strategic growth.

Jordan comes to StenTech with extensive experience serving organizations as a strategic finance leader in the areas of Finance, Accounting, Strategic and Tactical Planning, and Commercial and Product. He has a passion for leading growth and transformation focused on financial strategy and execution that delivers results that align and connect teams on driving financial results that support the business strategy. He has led the implementation, development, and improvement of business processes and systems as well as the formation and establishment of new teams and business disciplines. Jordan’s proven track record in these areas will strongly support StenTech’s growth.

"We are thrilled to welcome Jordan to the StenTech team," said StenTech CEO Kevin Keene, "His impressive background and leadership experience make him an excellent fit for our organization as we continue to expand and innovate. Jordan's expertise will be instrumental in achieving financial excellence and advancing our mission of empowering customer by delivering quality products and innovative solutions to leading electronic manufacturers.”

Commenting on his appointment, Jordan said: "I’m grateful to join the StenTech team and help them navigate through growth as it builds upon its continued success as a leader in SMT printing solutions. StenTech’s commitment to quality, innovation, customer success, and problem solving capabilities excite me and complements well with strengths and desires to serve.”

Jordan also holds a MBA from UNC Kenan Flagler and a CPA designation, further underscoring his qualifications to lead StenTech’s financial strategy and operations through its exciting growth and transformation.

CLINTON, NY – Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium Corporation will showcase the following products:

  • AuLTRA® Precision Die-Attach Preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
    • Highly accurate thickness control
    • Precise edge quality
    • Optimized cleanliness
    • Default waffle pack method
    • Available for gold-based alloys
  • AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA® 75 product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
  • AuLTRA® ThInFORMS are 0.00035"-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS help combat common issues such as shorting and poor thermal transfer.
  • AuLTRA® Fine Ribbon is the company’s Indalloy®182 fine-grade precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
  • AuLTRA® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA® 3.2 delivers superb wetting and low voiding.
  • AuLTRA®5.1 is a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures required by Au-based alloys. Ideal for high-power LED module array assemblies, this formulation provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.
  • Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #4923 at the show.

 

January 2025 ― Cranston, Rhode Island USA – AIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the promotion of Kelly Cardone to Vice President, Customer Experience. This promotion highlights AIM’s commitment to offering superior support and customer experience.

Since joining AIM Solder over 18 years ago, Kelly has demonstrated exceptional leadership, a deep understanding of customers’ needs, and an unwavering commitment to delivering exceptional support both internally and externally. In her previous role as Director of Marketing & Customer Experience, Kelly led efforts to establish a positive brand image, instilling trust in customers and ensuring outstanding experiences that have encouraged long-term loyalty.

In her new role as Vice President, Customer Experience, Kelly will continue to champion AIM’s customer-first philosophy, ensuring that every aspect of the customer journey is seamless, efficient, and deeply responsive to their needs. She will drive the strategy for elevating AIM’s customer service, forging stronger relationships with clients, and ensuring that AIM remains at the forefront of providing innovative solutions and personalized support.

“Kelly’s promotion reflects not only her contributions and leadership within the company but also our confidence in her ability to further drive our customer-centric culture as we continue to grow,” said David Suraski, Executive Vice President, Assembly Materials Division.

AIM’s commitment to customer experience goes beyond just providing best in class products—it is about fostering meaningful, lasting partnerships and delivering tailored solutions that help customers succeed. Under Kelly’s leadership, AIM will continue to set the standard for excellence in customer service, ensuring that customers have the resources and support they need to thrive in an ever-evolving industry.

Kelly Cardone can be reached at kcardone@aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

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