Press Releases

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce that we will be partnering with our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV, to bring to you our Mexico Technology Day 2023. The event will occur on 6 th October 2023, from 9.30 AM to 7.30 PM, at APODACA 1 ballroom, Crowne Plaza Aeropuerto Hotel, Monterrey, Mexico.

Our Mexico Technology Day 2023 is the premier event for original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) providers who are looking to stay ahead of the curve in today's fast-paced business landscape. This event will serve as a platform for us to engage with interested individuals who would like to learn more about ViTrox’s latest SMT PCBA inspection solutions., ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. We will have designated stations that will feature each solution. We also aim to share with you all how you can achieve production efficiency and excellence with our latest artificial intelligence (A.I.) technologies.

To kickstart the event, we will be hosting an open-day session, from 9.30 AM to 2.30 PM, where you can receive a FREE AOI test report using your own sample boards! From this open-day session, you can experience the efficiency and effectiveness of our V510i Advanced 3D Optical Inspection (AOI) Solution’s A.I. technologies, which are our A.I. Smart Programming and also under how AI can assist operators on the defect review through A.I. Assisted Defect Review (A.I. VVTS). However, slots for this event are limited, so do reserve your slots today by reaching out to our team: ViTrox Mexico Business Development Director, Mr Carlos Ponce, or SMTo’s ViTrox Account Manager, Mr Juan Carlos Santoyo.

We will also be conducting informative sharing sessions on how ViTrox’s A.I. technologies and Smart Industry 4.0 solutions assist your production for better efficiency and also support engineers and operators for a better work-life with all the interesting features from our platform, as well as our value proposition that is guaranteed to give you an advantage in the OEM and EMS industry! Among the benefits you will reap from our solutions are:

  • V310i 3D SPI: Machine-to-machine (M2M) communication with printers, and high-speed inspection programming setup with Ultra Smart A.I. Programming
  • V510i 3D AOI: A wide coverage of up to 90% SMT component coverage with A.I. Smart Programming, and up to 60% labour reduction with A.I. VVTS.
  • V810i 3D AXI: Effortless programming and process optimisation with AXI A.I. Solutions (A.I. Programming, A.I. Classification and A.I. VVTS) for challenging joint inspections (IGBT, HiP, etc.)
  • V9i ARV: Reliable, consistent and traceable inspection with 2-in-1 inspection capabilities (covering conformal coating and final assembly inspections).
  • V-ONE: Monitor production status and experience real-time data traceability, process optimisation and quality assurance.

Dive into ViTrox's latest innovations and join our exciting lucky draw at Mexico Technology Day 2023! Don't miss this chance to connect with us. Register now to secure your seat for this transformative event by registering here. For more information, feel free to reach out to ViTrox Mexico Business Development Director, Mr Carlos Ponce (, ViTrox Mexico Sales & Business Development Lead, Mr Ken Soon (, or SMTo’s ViTrox Account Manager, Mr Juan Carlos Santoyo (

SAN JOSE, CA – Naprotek, LLC., a leading provider of high- reliability, quick-turn electronics manufacturing, today announced the strategic addition of Seica's Pilot V8 Next Flying Probe to their state-of-the-art manufacturing facility.

The acquisition of the Seica Pilot V8 Next Flying Probe is a testament to Naprotek's commitment to innovation and excellence in electronics manufacturing. This cutting-edge technology is set to revolutionize the testing and quality control processes, ensuring that Naprotek continues to meet and exceed the stringent demands of its diverse customer base.

Larry Morrissey, Senior Vice President and General Manager of Naprotek, highlighted the significance of this addition: "The addition of the flying probe represents a substantial leap forward in our testing capabilities. It enhances our agility in identifying and rectifying issues, ultimately resulting in quicker turnaround times and even higher quality standards."

The Seica Pilot V8 Next Flying Probe boasts a vertical architecture that enables probing of both sides of the Unit Under Test (UUT) simultaneously. This breakthrough design enhances test throughput and flexibility while ensuring fast, precise, reliable, and repeatable probing. With capabilities ranging from In-Circuit tests to LED tests, this flying probe system empowers Naprotek to maintain the highest quality standards across its product offerings.

This strategic move further solidifies Naprotek as a provider of cutting-edge electronics technology solutions tailored to high-reliability applications, ensuring that their customers receive unmatched expertise and tailored solutions to meet their specific requirements.

For more information visit

IRVINE, CA – Terran Orbital (NYSE:LLAP) has announced the official opening of a new 60,000-square-foot satellite manufacturing space, adding to existing manufacturing capability at its Irvine, California facility.

The company said the addition, which expands the total size of the manufacturing complex in Irvine to approximately 98,000 square feet, will enable it to boost satellite production from an estimated 10 satellites per month to more than 20.

The expansion includes two advanced Printed Circuit Board Assembly (PCBA) lines, a state-of-the-art testing facility equipped with a large shaker table and a Thermal Vacuum (TVAC) chamber, a wire harness facility, and new automated module testing facilities.

“This new factory addition will significantly improve both the efficiency and capacity of our entire production system,” commented Terran Orbital co-founder, chairman and CEO Marc Bell.

Currently, the company is manufacturing 42 satellite buses on behalf of Lockheed Martin (NYSE:LMT) for the US Space Development Agency’s Tranche 1 Transport Layer Program, a mesh network in low Earth orbit that will support America’s military operations and other satellites and constellations.

Terran Orbital is a leading manufacturer of satellite products primarily serving the aerospace and defense industries. The company provides end-to-end satellite solutions by combining satellite design, production, launch planning, mission operations, and on-orbit support to meet the needs of the most demanding military, civil, and commercial customers.

DALLAS, TX – StenTech® Inc., the leading multinational SMT Printing Solutions company, is pleased to announce the installation of a brand-new, state-of-the-art laser system at its facility in Guadalajara, Mexico. This investment in the latest iteration of the StencilLaser G6080, manufactured by Germany-based LPKF Laser & Electronics, marks a significant milestone for the SMT industry in Mexico and underscores StenTech's commitment to its valued local customer base in Jalisco.

The StencilLaser G6080 is a flagship laser system, renowned for its best-in-class technology, serving the most demanding stencil users in the SMT industry. The system features a custom carbon fiber architecture, ensuring superior positioning accuracy and sidewall quality while maximizing productivity. Capable of cutting both stainless steel and nickel stencils with material thicknesses ranging from 20 um to 1 mm (0.8 to 40 mil), this cutting-edge laser technology empowers StenTech to deliver exceptional stencil solutions that meet the highest industry standards.

"We are excited to introduce the latest LPKF StencilLaser to our Mexico operations," said Brent Nolan, CEO of StenTech. "This cutting-edge laser system represents the newest and most advanced technology deployed in the country, reaffirming our dedication to providing our valued customers in Jalisco with the best solutions available in the market." LPKF's North American President, Stephan Schmidt, expressed his enthusiasm for the global partnership with StenTech, stating, "We truly value the collaboration with StenTech and its commitment to elevating quality standards in the SMT industry. The StencilLaser G6080 is a testament to the continuous pursuit of excellence shared by both companies."

In addition to its latest investment in industry leading technology, StenTech's Guadalajara facility also offers an array of cutting-edge capabilities, including Advanced Nano Coating, tooling solutions, and unparalleled customer service. The combination of these advanced offerings positions StenTech as a trusted partner for the most demanding stencil projects, meeting the unique needs of its customers across various industries.

StenTech's continued commitment to deploying LPKF technology ensures that its customers benefit from the most innovative and reliable stencil solutions in the market. The investment in the StencilLaser G6080 further strengthens StenTech's position as the leader in the stencil industry, dedicated to delivering superior quality and customer satisfaction.

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CAMBRIDGE, UK – Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities? Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that aims to resolve both of these questions. By combining aspects of printed and conventional electronics, specifically conductive inks patterned on a flexible substrate with mounted components such as integrated circuits (ICs), it represents a compelling 'best of both worlds' solution.

Matching Value Propositions to Applications

At its core, FHE is an alternative approach to circuit manufacturing. As such, FHE circuits can, in principle, be used wherever comparatively simple PCBs are needed (i.e., not complex multilayer circuits). Of course, replacing an established incumbent technology requires a compelling advantage that is typically application-dependent - do not expect FHE circuits to displace the PCB in most consumer electronics anytime soon.

Relative to existing flexible PCBs, FHE offers 3 distinct value propositions: Additive digital manufacturing, conformality/stretchability, and compatibility with roll-to-roll (R2R) manufacturing. The key to successful commercialization is finding a product-market fit where one or more of these value propositions either justifies switching or to facilitate a new application that would not otherwise be possible.

Additive Digital Manufacturing

Since conductive ink can be printed using digital methods such as inkjet or the emerging laser-induced forward transfer (LIFT), FHE enables additive digital manufacturing. FHE is thus well suited to prototyping and very high-mix low-volume (HMLV) manufacturing - it could also potentially be deployed to facilitate versioning and even 'mass customization', the latter of which is difficult to envisage without digital manufacturing.

Additive manufacturing is less wasteful than more established subtractive approaches and is thus especially advantageous when components and, hence, conductive traces are widely spaced. One such example is mounting LEDs on sheets for large area lighting, which can also be produced by R2R manufacturing.


Conformality/stretchability is a key value proposition of FHE. Whereas flexible PCBs often employ rigid islands for mounting packaged ICs and other rigid SMD components, FHE circuits can be more flexible since many components (e.g., sensors) can be printed. Furthermore, conductive inks that are either stretchable or can withstand bending enables a shorter bending radius and even stretchability.

The flexible (and potentially stretchable) form factor makes FHE ideally suited to wearable technology, including electronic skin patches and e-textiles since it improves wearer comfort relative to the current rigid boxes that contain conventional electronics. Challenges include washability and sustainability concerns relative to reusable rigid electronics mounted within a removable box.

R2R Manufacturing

For large-volume manufacturing, conductive traces can be printed using rotary analog methods such as flexography, gravure, and rotary screen printing. This enables very rapid deposition via R2R manufacturing, reducing costs. Cost benefits are especially significant if traces can be printed onto existing surfaces (such as packaging labels), eliminating the need for a dedicated structure.

Given the large volumes required and relatively low value-add per item, minimizing costs is essential for electronics to be adopted for smart packaging/RFID. While most RFID tags currently use stamped aluminum foil for antennas, printing with copper inks will reduce costs and improve sustainability. R2R FHE production is forecast to expand to more sophisticated smart packaging circuits with greater functionality, such as sensing.

Comprehensive Insight

IDTechEx's report "Flexible Hybrid Electronics 2024-2034" evaluates the status and prospects of FHE circuits, which we forecast to reach a market size of around US$1.8 billion by 2034 - more if the associated infrastructure, software, and services are included. Drawing on years of following the printed electronics industry and 40 interview-based company profiles, the report outlines trends and innovations in the materials, components, and manufacturing methods required. It explores the application sectors where FHE is most likely to be adopted, drawing on current activity and in-depth discussions with contract manufacturers and potential adopters. Granular market forecasts break down the opportunities for FHE circuits across 5 application sectors (automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial) into 39 specific opportunities, such as skin temperature sensors and printed RFID tags.

To find out more about this IDTechEx report, including downloadable sample pages, please visit

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce its participation in the upcoming Surface Mount Technology Association (SMTA) International Conference and Exhibition, scheduled to take place from October 9th-12th, 2023. The event, held at the Minneapolis Convention Center in Minneapolis, Minnesota, will provide an ideal platform for ZESTRON to showcase its cutting-edge cleaning technologies to a diverse audience of industry professionals.

Attendees visiting ZESTRON's booth can learn about the company's comprehensive range of cleaning solutions and analytical services that cater to various stages of the electronics manufacturing process. Whether implementing a new cleaning process, optimizing an existing one, or adhering to new regulations, ZESTRON partners with their customers to provide long-term reliability for critical applications.

ZESTRON's commitment to sustainability will also be a highlight at the exhibition. ZESTRON places a strong emphasis on developing environmentally friendly cleaning solutions that not only optimize performance but also adhere to the highest standards of eco-friendliness.

Visit ZESTRON at booth #1401 during SMTA International to learn more about their advanced cleaning solutions and engage with their expert team.

For more information about ZESTRON and their participation in SMTA International 2023, please visit our website or contact us here.

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