WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and TSMC. The incentives, which are part of the CHIPS and Science Act, will support TSMC’s new advanced manufacturing operations in Arizona. The Commerce Department previously announced incentives for Intel, GlobalFoundries, Microchip Technology, and BAE Systems.

“Today’s TSMC announcement is a big win for America’s economy, supply chain resilience, and the advanced chip manufacturing ecosystem. The new TSMC facilities—sparked by the CHIPS and Science Act—will spur job creation and economic growth in Arizona while also broadening the state’s already substantial semiconductor footprint. We commend TSMC for its ambitious investments in the U.S. and applaud the Commerce Department for continuing to make progress in implementing the CHIPS Act’s landmark manufacturing incentives and R&D investments. CHIPS remains on track for great success, and we look forward to continuing to work with leaders in government and industry to ensure it delivers maximum benefits to America’s economic and technological leadership.”

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 45,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is excited to showcase its proficiency in robotics for industrial automation at the highly anticipated Automate Show. The event is scheduled to take place May 6-9, 2024 in Chicago and serves as a premier platform for industry professionals to explore the latest advancements in robotics, machine vision, AI and motion control.

With a focus on industrial automation, Green Circuits will use the Automate Show as an opportunity to highlight its capabilities in integrating electronics into robotic systems. The company specializes in offering a comprehensive suite of services tailored specifically to meet the demands of robotic applications, ranging from PCB assembly to testing and integration.

Green Circuits is dedicated to ensuring that its electronic components adhere to the highest standards of quality and reliability, which are crucial for the seamless operation of robotic systems in diverse manufacturing environments. Some of the company's recent work in robotics applications includes the development of a delivery robot and contributions to advancements in self-driving vehicles.

“We are excited to be part of the Automate Show and to demonstrate our expertise in robotics for industrial automation,” said Adam Szychowski, Vice President of Sales at Green Circuits. “As a trusted partner in electronic manufacturing services, we are committed to delivering top-notch solutions that align with the evolving needs of our clients in the automation sector.”

Attendees of the Automate Show are invited to visit Green Circuits at Booth 3686 to learn more about the company's robotics capabilities and how it can support various automation projects.

Green Circuits, Inc. provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. The company is the 2023 CIRCUITS ASSEMBLY EMS Company of the Year and Global SMT & Packaging 2023 Global Technology Award winner for Contract Manufacturers $50-100 million.

For more information, visit www.greencircuits.com 

MALDEN, MA – actnano Inc., a trailblazer in cutting-edge surface protective technologies for automotive, consumer and industrial electronics, is proud to share its latest accolade: being named among The Americas’ Fastest Growing Companies 2024 by the Financial Times and Statista. This prestigious ranking celebrates companies that have demonstrated exceptional revenue growth between 2019-2022, solidifying actnano’s role as a dynamic force driving economic prosperity across the Americas. Additionally, actnano earned the #1 position in the Electrical Manufacturing industry.

“This recognition is a testament to the hard work and dedication of our incredible team,” said Taymur Ahmad, CEO of actnano. “We are honored to be ranked among such esteemed companies and remain committed to delivering innovative solutions that exceed our customers’ expectations.”

The Americas’ Fastest Growing Companies 2024 ranking is the result of a rigorous four-step process that involves an initial pool of over 30,000 eligible companies from which only those meeting specific criteria are invited to move forward. A detailed examination by Statista of revenue data from over 1,000 publicly listed companies in the Americas, supplemented by high-profile companies ensured only those with significant minimum revenue, independence, and organic growth proceeded. The compound annual growth rate (CAGR) was calculated based on verified revenue figures submitted by the companies. The top 500 companies meeting the criteria were awarded the distinction.

actnano’s inclusion in The Americas’ Fastest Growing Companies 2024 demonstrates its exceptional performance and significant contribution to economic growth throughout the region.

As a global leader in PFAS-free nanocoatings, actnano specializes in providing advanced protection for a range of materials against water damage and harsh environmental conditions. The company’s thin-film coatings, known as Advanced nanoGUARD, deliver superior performance and durability, making them ideal for applications in automotive and consumer electronics industries.

actnano’s coatings can be seamlessly integrated into existing manufacturing lines due to the expertise of the company’s regional engineering teams. With a focus on innovation and sustainability, actnano continues to lead the way in providing cutting-edge solutions that meet the evolving needs of industries worldwide.

To view the list of The Americas’ Fastest Growing Companies 2024, visit https://www.ft.com/content/d4a20767-ea0f-4f8e-972d-84a513345784. For more information about actnano, visit www.actnano.com.

HANAU, GERMANY – Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1 st instance judgment confirmed Senju’s infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

The legal dispute culminated in a victory for Heraeus, Alpha Assembly Solutions, and Henkel, with the court granting motions for declaration of liability for damages, injunction, and the recall of infringing products, namely Senju's M794 solder material from its industrial customers in Germany. The ruling, which can be appealed by Senju, reinforces the significance of intellectual property protection in the electronics assembly industry and upholds the commitment of the plaintiffs to defend their innovative materials.

In response to Senju's attempts to invalidate the patent-in-suit through a patent nullity suit, the German Federal Patent Court upheld the patent with some amendments, in first instance on August 31, 2023. This decision confirms the validity of the amended form of the patent EP 1 617 968 B1, covering innovative solder alloy formulations. Senju’s appeal to the Federal Court of Justice is pending.

The patentees sell solder alloy formulation, marketed under the brand names Innolot® (MacDermid Alpha Electronics Solutions and Heraeus) and Multicore 90ISC (Harima Chemicals Group, formerly Loctite 90ISC Henkel), representing a breakthrough in lead-free solder technology. Developed through a cooperative project, these materials offer improved reliability performance, particularly in harsh environment electronics applications. They are designed to withstand high temperatures while remaining solderable at standard lead-free process temperatures, making them ideal for automotive applications and other demanding environments.