Press Releases
Kista, Sweden – INSPECTIS AB announces the appointment of Johan Stormlund to the position of Marketing and Sales Manager, Industrial. In his new role, Johan will have overall responsibility for the sales of the company’s industrial products and will work with Marketing Manager Alistair Gooch, who will focus on the Healthcare industry.
“I see great potential for INSPECTIS to strengthen its market presence by taking a more proactive approach to sales,” says Johan Stormlund. “Historically, the company has been strong in responding to customer requests. My goal is to complement that strength by reaching out more actively to new markets and customers, creating fresh opportunities for growth.”
He will also be responsible for INSPECTIS’ international distributors and provide support to customers and distributors alike. Johan’s background includes that of Chemical engineer, working with sales in different roles (Key Account Manager, Sales Manager, Channel Manager, Business Development), and for the last 15+ years he has worked in the advanced sensor business, mainly within the Healthcare and Logistics industries.
Altus Group, a leading distributor of electronics production equipment in the UK and Ireland, is highlighting Heller Industries’ innovative Short-Cycle Vacuum Reflow Oven (SCVR) as interest in high volume vacuum soldering grows across the region.
Vacuum reflow soldering helps to eliminate voids in solder joints, dramatically improving reliability in demanding applications, but traditional systems have been too slow for high-volume production. Heller's SCVR introduces a patented multi-stage conveyor system that reduces board transfer time in and out of the vacuum chamber, directly addressing the primary limitation in vacuum cycle times. This innovation enables manufacturers to increase units per hour (UPH) by up to 100% while maintaining the superior solder joint reliability that vacuum reflow delivers.
Joe Booth, CEO of Altus Group said: “Electronics manufacturers are increasingly looking to vacuum reflow to improve reliability in complex assemblies, but adoption has been limited by cycle time bottlenecks. The SCVR’s design makes high-volume, high-reliability production more practical than ever before, giving engineers confidence that they can meet demanding process requirements without sacrificing throughput or quality.”
The SCVR features three infrared heating panels within the vacuum chamber that optimise heating profiles for solder paste. Real-time temperature control delivers ±0.5°C accuracy at the PCB level, ensuring consistent results across production runs. The system includes Heller's HELLER365 platform for process monitoring and Industry 4.0 integration, enabling real-time tracking of temperature curves, vacuum pressure values, and board-level data.
The system's modular, open-architecture design simplifies upgrades, maintenance, and cleaning which is critical for maintaining uptime in high-reliability production environments. The SCVR is designed for applications where void-free solder joints are critical, including automotive power modules (IGBT/SiC packaging), RF components for telecommunications, Mini/Micro LED assembly, and high-density interconnect (HDI) soldering.
By bringing Heller’s SCVR to the UK and Ireland, Altus Group continues to support electronics manufacturers with advanced assembly solutions that address both reliability and productivity demands in an increasingly competitive market. http://www.altusgroup.co.uk/
Austin, Texas, November 4th 2025 – High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
“I’m excited for the opportunity to participate to the HDP User Group and its comprehensive research activities,” said Stan Heltzel, Materials Engineer and PCB expert at ESA. “International collaboration across market segments is instrumental to address the technical challenges, combining complexity and functionality with reliability. I’m convinced that ESA can contribute with technological expertise and a wide stakeholder network to the HDP projects, and vice versa.”
“I am pleased to welcome the European Space Agency to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of the complex PCBs required for outer space, the harshest use environment. They will contribute significantly to guiding our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
“ASKPCB and Sundell are thrilled to join the HDP User Group,” said Fred Hickman, VP of North America Sales. “As part of our continuous drive toward innovation and collaboration, HDP provides an ideal platform to work alongside global leaders in the Technology field. With our new smart-factory operations in Sundell (Thailand facility), we look forward to contributing to HDP initiatives that advance next-generation PCB design, materials and manufacturing processes – while strengthening partnerships across the electronics supply chain.”
I am pleased to welcome ASKPCB to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of complex PCB fabrication for high-performance applications will support many HDP projects. They will contribute significantly to our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
SEOUL, KOREA – Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business. In this role, he will oversee Global Sales, Product Planning, Technical Support, and the company’s worldwide branch offices, ensuring a comprehensive structure aligned with Koh Young’s strategic goals while balancing technology innovation and customer-focused growth.
Mr. Lee has been with Koh Young since 2002, contributing to the company’s evolution across multiple dimensions of technology and business. With leadership experience across R&D, product planning, and international sales, he brings a unique perspective that bridges customer needs with market dynamics. Over the years, he has helped advance Koh Young’s optical inspection technologies, guided product strategies to address increasingly complex manufacturing challenges, and strengthened customer relationships through global expansion. This dual emphasis on innovation and sales effectiveness positions him to maximize customer satisfaction and enhance Koh Young’s market presence.
“In this role, I will focus on accelerating innovation while ensuring our solutions deliver clear value to customers,” said Mr. Lee. “By enhancing collaboration across our global teams and listening closely to customer needs, we will strengthen partnerships, drive greater satisfaction, and continue advancing Koh Young’s vision of enabling smart manufacturing and zero-defect production.”
Jeff Lee’s assignment underscores Koh Young’s long-term commitment to innovation and customer partnership. By combining its industry-leading inspection and metrology expertise with a globally integrated organization, Koh Young is equipping manufacturers with the tools and support they need to thrive in an era defined by digital transformation and advanced packaging.
As he steps into this role, Mr. Lee will also work closely with Koh Young’s global branch offices to ensure consistent support and alignment across regions. By reinforcing collaboration between headquarters and local teams, his leadership will ensure faster response times, tailored solutions, and stronger customer engagement worldwide.
HILLSBORO, OR – OCTOBER 30, 2025 – The NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Hosted at the Wingspan Event and Conference Center on October 22, the expo welcomed hundreds of attendees from across Oregon and Washington, including engineers, purchasing teams, and business leaders representing a wide variety of local manufacturers—not only in electronics, but also in materials, equipment, and related industries. The show floor featured over 50 exhibitors, with manufacturers demonstrating capabilities that spanned the full ecosystem of design, production, advanced materials, assembly, testing, and integrated solutions.
Adding to the energy of the event were special participants from education and research: the Portland State University Rocket Team, the Beaverton School District Robotics Program, and Oregon Museum of Science and Industry (OMSI). Their presence highlighted NEDME’s commitment to connecting industry with education and inspiring the next generation of innovators.
“For more than two decades, NEDME has served as a cornerstone event for our region,” said Mike Foresee, NEDME Steering Committee member. “It’s not just about technology—it’s about creating a space where manufacturers, innovators, educators, and students can come together to share knowledge, build partnerships, and strengthen the Northwest ecosystem.”
The technical program featured sessions on topics ranging from advanced PCB design practices to supply chain resilience and AI-driven engineering tools. Speakers emphasized practical takeaways for companies of all sizes, while exhibitors highlighted innovations tailored to the unique needs of Northwest manufacturers.
Exhibitors and attendees alike praised the show for its approachable format and community focus:
“The seminars were not only helpful, but what stood out was the balance of topics—they didn’t just focus on manufacturing, but also included valuable management insights. That broader perspective made them especially worthwhile, and I look forward to seeing more of this approach in the future.” Tom Hauge, President, Fusion EMS.
Special Thanks to Our Sponsors
The success of NEDME 2025 would not have been possible without the support of its sponsors: ASC Sunstone, Screaming Circuits, Citizens Bank, Polar Instruments, QTexAI, Westco Group, MCX, Inc., EPB&B Insurance, Stoel Rives LLP, and Opsahl Dawson. sponsors. Lunch was generously provided by the Electronics Representatives Association (ERA).
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