Clemsa, a manufacturer based in Spain and part of the Italy-headquartered FAAC Technology Group, has transformed its electronics production capabilities through the installation of a new Europlacer SMT placement line. Facing the challenge of producing a wide variety of access control products in a competitive and fast-changing market, Clemsa sought a solution that would increase flexibility, reduce production and inventory costs, and improve overall quality.

“We needed to expand our production capacity in terms of product diversity, not volume,” said Miguel Angel Lopez, CEO of Clemsa. “With Europlacer, we can produce exactly what we need at any time, without delays or extensive reconfiguration. That has helped us dramatically reduce both production and inventory costs while staying highly competitive.”

Clemsa manufactures electronics for access systems, including automatic doors, remote control units, RFID cards, and control boards. With 20 to 30 distinct products in active production, frequent changeovers and fast response times are critical. The Europlacer platform delivers exceptional component feeder capacity, allowing all components to remain loaded and ready. Changeovers take just 10 minutes, compared to 30–40 minutes with other brands – up to a 75% improvement.

“We simply switch programs and adjust the conveyor width — the line is instantly ready,” explained Luis Miguel, Production Manager at Clemsa. “This level of agility helps us maintain efficiency despite a complex product mix.”

One key advantage has been Europlacer’s integration of a bulk feeder for battery contactors, a component used across multiple Clemsa products. During the selection process, Clemsa requested as a prerequisite that the machine be capable of positioning battery clips, served in bulk in large bags. This component needed to be fed from a hopper that, by means of vibration, would advance to the picking area, allowing the pick and place machine to position it from there. Unlike other systems that require separate handling or third-party solutions, Europlacer integrated this functionality directly into the machine, increasing accuracy and reliability during assembly, and was the only provider that Clemsa engaged with that could meet this requirement.

The hopper was sent to the Europlacer factory where it was revised and its feeding system improved. Crucially, it was converted into an intelligent hopper with connection to Europlacer’s RC software, thereby optimising the feeding process, efficiency, and reliability. Similar bespoke solutions have been developed by Europlacer for other customers, such as automatic feeding of LED lenses.

Clemsa also praised Europlacer’s support and training services. “Their engineers have been knowledgeable and always available,” added Luis. “From installation to training, the experience has been outstanding.”

When evaluating solutions, Clemsa compared multiple SMT equipment providers. Ultimately, Europlacer stood out for its flexibility, ease of use, and commitment to automation — all of which aligned perfectly with Clemsa’s manufacturing goals.

“If another manufacturer were considering their options, I’d simply invite them to visit us,” said Miguel. “They will see the speed, flexibility, and most importantly, the consistent quality we achieve with Europlacer. In my opinion, it is an easy decision.”

Minneapolis, Minnesota – Nordson Test & Inspection today announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in Taipei at booth #12326 from September 10-12, 2025. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems and unveil the new Auto Centering Sensor (ACS). Additionally, across technology platforms, the advanced Nordson Intelligence AI Ecosystem will be featured. Nordson Test & Inspection is a platinum sponsor.

Front-End Semiconductor Solutions

Nordson will be unveiling for the first time, the Auto Centering System™ (ACS), which is an extension of the wireless, WaferSense® sensor portfolio designed for capturing and analyzing real-time data for effective semiconductor tool set-up and maintenance. The wafer-shaped ACS “sees” inside equipment to capture dimensional offset data (x,y and z) to quickly center wafer transfer positions.
The recently launched next-generation Auto Gapping Sensor™ (AGS2) will also be featured. The AGS2 speeds non-contact gap measurements and parallelism adjustments under vacuum, improving uniformity, tool availability and repeatability in a thinner and lighter form factor.

Mid-End Semiconductor Solutions

The SpinSAM™ Acoustic Micro Imaging Inspection (AMI) system sets a new benchmark in the industry with its high throughput and superior sensitivity, enabling precise defect detection for Wafer-Level and Advanced Packaging applications including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers. Using an innovative spin-scanning method, the system scans up to four 300mm wafers simultaneously, achieving an impressive speed of 41 wafers per hour. This breakthrough scanning capability, combined with best-in-class defect capture and image quality, enhances both productivity and accuracy in semiconductor inspection. It is Designed for 100% inspection, as well as edge scanning that targets defect prone areas, optimizing data acquisition where it is needed most.

The XM8000™ Automated X-Ray Metrology (AXM) system is powered by the QuadraNT tube and detector capable of 2D, 2.5D and 3D measurements of micron scale features with superior resolution. The system is designed for high-throughput metrology and defect review for optically hidden features, including voiding, fill levels, overlay and critical dimensions in Wafer-Level, Panel-Level and Advanced Packaging applications such as CoWoS, TSVs, 2.5 and 3D IC packaging and wafer bumps.

The 4800 INTEGRA Plus is the next generation automated bond test solution designed to meet the dynamic wafer-level packing environment. With its new motion, vision, and wafer handling system complemented by the high-throughput Paragon software, the system offers best-in-class micro bump and trace bond testing on chip-on-wafer, stacked wafer, and molded wafer applications. The system demonstrates unmatched precision, hands-free, and fully traceable bond testing capability for both 200 and 300mm wafers enabled by a smart load port and wafer chuck, and Matrix Map software.

Back-End Semiconductor Solutions

The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, socket metrology, and memory among other high-end applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions common with shiny and specular surfaces. The SQ7000+ inspects for defects, and measures critical parameters in seconds with a comprehensive coordinate measurement software suite.

The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications including wire bonds, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities.

Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for our Automated X-Ray Inspection (AXI) systems that reveals incredible details, superior data quality, and clear layer separation, powered by a new 3D reconstruction algorithm. Dynamic Planar CT is ideal for any 3D electronics inspection application, but excels in the semiconductor market for inspection of flip chip micro bumps. Dynamic Planar CT will be demonstrated on Nordson’s XS-3 AXI system. The performance is significantly advanced providing a larger field of view and up to 2× faster image acquisition than classical Planar CT. These speed enhancements yield faster cycle times and greater throughput, while also crucially reducing sample radiation dose.

Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revalution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.

Advanced ML, DL and AI

Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.

Visitors to the Nordson Test & Inspection booth at SEMICON Taiwan can discover the latest best-in-class inspection and metrology solutions that improve semiconductor yields, processes and productivity.

For more information, visit www.nordson.com/testinspect.