CHIRYU, AICHI – Fuji Corporation is pleased to announce that it has achieved the world’s first placement of 016008 mm (0.16 x 0.08 mm or 006 x 003 inches) size components on printed circuit boards (PCBs) with its SMT pick and place machine, NXTR, following the successful development of machine technology designed to handle next-generation ultra-small electronic components. This achievement was showcased at the 40th NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo exhibition on January 21, 2026 at Tokyo Big Sight. Note: Based on Fuji's research (as of January 15, 2026).

There is currently an accelerating shift toward edge AI, where AI processing is performed on the device itself. An era is also emerging in which a wide range of everyday devices, including smartphones, wearable devices, and even medical and healthcare equipment, are autonomously analyze information. Amid these trends toward greater functionality in electronic devices, the number of mounted electronic components is increasing significantly. As a result, further miniaturization and higher-density integration of electronic components have become critical and unavoidable technological challenges.

Even the 0201 mm (0.25 x 0.125 mm, 008004 inches) size component, which has long been considered the smallest standard among currently commercialized electronic components, will eventually reach its limits in the pursuit of higher density to integrate more electronic functions into limited board space. A next-generation component size, 016008 mm (006003"), is being developed in response. 016008 mm (006003") size components require approximately half of the placement area compared to 0201 mm size components, allowing for higher-density circuit designs.

Four key control technologies enabling the world's first 016008 mm (006003") size component placement

Fuji has been providing high-speed, high-accuracy pick and place machines capable of reliably handling very small components. Advancements in the following four key control technologies have made the world's first placement of 016008 mm (006003") size components on PCBs possible.

1. Stance recognition during handling: The orientation and stance of very small components are checked in real time to ensure optimal part handling.
2. Highly-accurate part pickup control: Deviations in pickup position and the effects of static electricity are addressed for stable part pickup.
3. Super-fine control of placement pressure: Pressure is precisely controlled to ensure that very small components are not damaged during placement.
4. Ultra-high precision placement positioning control: With nano-level position compensation, the highest level of placement accuracy in the industry is achieved.

Aiming to build a comprehensive solution for next-generation very small component placement

To place components 016008 mm (006003") or smaller, it is essential to optimize not only the placement process but also all processes related to placement, including panel design, solder paste materials, stencils, reflow, and inspection, at a high level.

Fuji is developing machine technology for placement robots while deepening cooperation with partners to build a total process solution, including production materials and related materials, taking the race for the miniaturization of electronic components to a new stage as the edge AI era gets fully underway.

HARRISBURG, PA ― February 2026 ― Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is starting the new year by reinforcing its role as a full-service partner for electronics manufacturers, offering production supplies, inventory programs, and value-added services designed to simplify operations and keep production moving.

At the center of CE3S’s offering is its Production Supply Store, an online platform featuring more than 20,000 products used across electronics manufacturing environments. The catalog includes ESD protection products, soldering and rework tools, inspection and visualization equipment, chemicals and cleaners, wire and cable, and everyday production supplies that support assembly, testing, and packaging operations.

Beyond product access, CE3S provides Vendor Managed Inventory (VMI) programs that help manufacturers reduce excess stock, improve material availability, and lower administrative overhead. By managing replenishment, forecasting, and point-of-use inventory, CE3S allows customers to focus on production rather than purchasing and stock control.

CE3S also supports customers with a range of value-added services, including kitting, custom labeling and packaging, cable assemblies, laser cutting, and third-party logistics. These services are designed to reduce internal labor requirements while improving consistency and turnaround time on the production floor.

Additional offerings include ECOclaim recycling solutions to help manufacturers responsibly manage waste streams, as well as strategic account and government procurement support tailored to regulated and high-reliability industries.

“Manufacturers are under constant pressure to do more with less — less space, less labor, and less time,” said Jeremy Wagner, President and CEO at CE3S. “Our goal is to make the supply side easier, whether that means having the right tools on hand, simplifying inventory, or taking work off our customers’ plates so they can stay focused on production.”

As manufacturers look ahead to the year, CE3S continues to expand its solutions to meet changing production and supply chain demands, positioning itself as a single source for the tools, services, and support needed to operate efficiently and reliably.

For more information about CE3S, please visit www.ce3s.com or contact sales@ce3s.com

NAMPA, ID — February 2026 — Silicon Mountain Contract Services, a U.S.-based provider of electronics manufacturing services, today announced a name transition to SMCS, effective early 2026. The updated name reflects the company’s continued growth and its focus on scalable, process-driven manufacturing built in the United States.

The transition to SMCS is a name-only change. Ownership, leadership, employees, facilities, capabilities, and customer commitments remain unchanged. All existing agreements, open orders, and customer points of contact will continue without interruption.

“The transition to SMCS better represents who we are today and how our customers engage with us,” said Eddie Garcia, Operations Manager. “Our customers rely on us for disciplined processes, consistent execution, and the ability to scale—from early builds through sustained production. The SMCS name reflects that role more clearly.”

SMCS is a domestic electronics manufacturing partner delivering Made-in-the-USA solutions supported by documented processes, traceability, and repeatable execution. Operating from its Pacific Northwest facility, SMCS serves customers across a wide range of industries, supporting both emerging programs and high-volume, complex production.

The company’s operating model emphasizes process control, supply-chain reliability, and predictable outcomes, enabling customers to move efficiently from development to production while reducing risk. SMCS supports low-to-high volume builds and provides Design for Manufacturability (DFM) input to improve product performance, quality, and manufacturability.

With experienced personnel, modern equipment, and flexible capacity, SMCS helps customers maintain quality, control costs, and meet demanding production schedules—while keeping manufacturing domestic.

For more information about SMCS capabilities and services, visit www.siliconmtn.net.

Michael Brinkley, Axiom Electronics’ manufacturing engineer and configuration management manager, will be answering that question in his Webinar: “Radiation-Induced Component Failure in X-Ray Solder Joint Inspection.” SMTA’s Capital Chapter in Washington, D.C. will be hosting the webinar on Feb. 26th.

The presentation examines how increased reliance on manual and automated X-ray inspection for hidden solder joints can unintentionally damage radiation-sensitive microelectronic components. It analyzes observed failure modes, quantifies absorbed radiation dose from design of experiment outputs, and outlines practical manufacturing controls to prevent X-ray-induced performance and reliability problems both in WIP and in the field.

Participants can register for the event at: https://smta.org/events/EventDetails.aspx?id=2026259&group=225180.