Press Releases

August 4, 2022 - Haverhill, MA USA - Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement concerns. The ideal method to facilitate the removal of gold plating from SMT and through-hole components is to use a robotic hot solder dipping (RHSD) process. This new technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.

See the full paper at:

Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

Tokyo, Japan – August 3, 2022 – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is delighted to announce two new Sales & Business Development leadership promotions. From August 1st, Mr. Eddie Ichiyama, former Senior General Manager Asia, is heading up all overseas sales operations as Chief Sales Manager for Overseas. Mr. Ken Katsumi, former Senior Sales Manager Japan, has taken over the role of Chief Sales Manager. Effective August 1st, a new Overseas Sales Headquarters was incorporated into the worldwide sales structure. The sales organization is now composed of two divisions: the Overseas Sales Headquarter, which looks after all overseas markets outside of Japan, and the Sales Headquarter, which is largely responsible for customer relations in Japan and the sales promotion functions of the head office.

Saki is now strengthening its global sales operations with the promotion of Mr. Eddie Ichiyama and Mr. Ken Katsumi. In their new roles as Chief Sales Managers, they will play a key role in driving forward the unique inspection capability of Saki’s advanced range of high-quality automated inspection systems for 3D Solder Paste Inspection (SPI), 2D/3D Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) to customers worldwide - all supported by a reliable and efficient global delivery, technical support and service promise.

Norihiro Koike, President and CEO of Saki Corporation said: "Eddie has established a business foundation in China as the head of our subsidiary in Shanghai, China, followed by his outstanding contribution to business expansion in the European region as General Manager at Saki Europe. He then shifted his focus to Asia to expand a pan-Asian sales infrastructure within a larger framework. Ken has steadily built up a record of sales results in Japan, including Tier 1 customers in the automotive industry. The promotion of Eddie and Ken to Chief Sales Managers for their respective areas further reflects our commitment to continuously strengthen our skilled team to help meet the growing global demand for Saki products & solutions."

For further information about Saki, visit

Indium Corporation is pleased to announce that its Director of Global Supply Chain and International Trade Compliance, Donna Vareha-Walsh, has been elected to the American Tin Trade Association Board of Directors.

The American Tin Trade Association (ATTA) was formed in 1928 and, since that time, has grown into a well-respected institution. Meeting twice a year, ATTA's primary purpose is to "…promote the best interests of those persons engaged in the production, distribution, transportation, consumption, purchase, and sale of pig tin." The association also serves as an active forum through which pertinent issues of the tin trade are discussed.

“I am honored to join the ATTA Board of Directors,” said Vareha-Walsh. “I am looking forward to bringing my experience as Chairwoman of the Minor Metals Trade Association to benefit and support the growth of the ATTA.”

In her role at Indium Corporation, Vareha-Walsh oversees the company’s global supply chain and trade compliance functions which includes all inventory, quality, sourcing, logistics and supply chain strategies. She leads a global team to ensure Indium Corporation’s global business has a secure supply chain with quality partner suppliers.

Vareha-Walsh has more than 20 years of metals market experience from numerous roles and responsibilities, including Director of Global Procurement for a global premium alloy company and Director of Metallurgical Operations and Procurement for a global tungsten-based business. She earned a bachelor’s degree in finance from Duquesne University and an MBA from the University of Pittsburgh. She is a certified public accountant (CPA) and holds certificates in leadership development and manufacturing excellence. She also serves as chair of the board of directors for the MMTA, a global minor metals trade association.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.


Universal Instruments is now a member of the recently formed American Semiconductor Innovation Coalition (ASIC). Comprised of more than 90 businesses, startups, universities, national labs, and nonprofits, ASIC’s mission is to deliver focused research and development to The National Semiconductor Technology Center (NSTC) and The National Advanced Packaging Manufacturing Program (NAPMP). The 2021 National Defense Authorization Act (NDAA or CHIPS Act) called for the creation of the NSTC and NAPMP to establish a pathway for investment to accelerate the U.S. transformation into a secure semiconductor powerhouse.

“Semiconductors have become a fundamental part of our everyday lives and the recent pandemic and geopolitical uncertainty have shown them to be a critical element of our supply chain that must be protected and nurtured by applying the latest innovations and technology,” said Universal Instruments Vice President of Marketing, Glenn Farris. “Joining ASIC will help us to advance this goal.”

As the only semiconductor equipment packaging company member manufacturing high-precision, high-volume production systems, Universal brings a unique perspective to ASIC. “We look forward to sharing our knowledge of the manufacturing technologies required for efficient, cost-effective semiconductor packaging with the other member companies, as well as learning from these companies to collectively drive towards our goals,” stated Farris.

Earlier this year, ASIC announced its formal intent to advocate with one voice for the NSTC and NAPMP, following the Coalition’s response to the Department of Commerce Request for Information (RFI) 2022-01305. The key principles in the response outline critical aspects to bolster a robust domestic semiconductor supply chain that is achievable, scalable, and sustainable.

“Decades of disinvestment in our domestic semiconductor industry have made us more reliant than ever on supply from other countries to meet our nation’s chip demand. There is no more time to waste — for the U.S. to remain competitive on the global stage, we must make bold investments in chip R&D, packaging, and manufacturing,” said Dr. Douglas Grose, ASIC spokesperson and past president of NY CREATES, the organization that operates the Albany Nanotech Complex, the most advanced semiconductor R&D facility in the U.S., and where the headquarters for the NSTC and NAPMP could be located. Dr. Grose added, “ASIC is a well-rounded coalition with members that are leading drivers of chip innovation and ready to hit the ground running to fuel America’s semiconductor resurgence.”

Farris sees the New York-based facility as a powerful local asset. “Having the NSTC hub right here in our backyard in New York and being able to build a foundation for growth that can be expanded nationally would be a great opportunity and privilege,” said Farris. “The focus of the NSTC and NAPMP will be to help better move technologies from the lab to operational systems in the US, bridging the prototyping and scaling gap that currently exists and strengthening the entire domestic ecosystem.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit (See attached file: Universal Joins ASIC, Effort to Fuel America’s Semicon

MADISON, AL — August 2022 — STI Electronics, Inc., a full-service organization including engineering, contract manufacturing and training services, today announced that it will sponsor the upcoming J-STD-001H Objective Evidence for Reliability Workshop, scheduled to take place Thursday, Aug. 25, 2022 at STI’s facility in Madison. The workshop will be conducted by Magnalytix and Restronics Southeast.

IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. The standard is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of X-ray to inspect through-hole solder conditions that are not visible by any other means.

Save the date for the one-day event that will include a panel of interesting discussions concerning Objective Evidence, including a presentation and hands-on demo of the OE-300 SIR Testing System and other Magnalytix Services.

To learn more or register for the event, visit

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been a full-service organization providing electronics contract manufacturing, electro mechanical box build, microelectronics lab (clean room), rework & repair services, material failure analysis, analytical lab services, circuit design, testing, prototype manufacturing services, training services, training materials, online training, and custom courses. For more information, visit

 PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the CHIPS and Science Act of 2022 by the United States House of Representatives. The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“Enactment of the investment tax credit and funding for CHIPS Act programs was made possible by the steadfast support of President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction,” said Ajit Manocha, SEMI president and CEO. “We thank them for their leadership and support and look forward to working to ensure these policies and programs are implemented quickly and consistently with the objective of strengthening the semiconductor supply chain in the United States.”

“The investment tax credit and funding for CHIPS Act programs will be instrumental in bolstering semiconductor manufacturing and R&D along with a wide range of technology-reliant U.S. supply chains, create thousands of high-skill jobs, and keep pace with incentive programs around the world,” said Manocha. “With semiconductor manufacturing fabs heavily reliant on a complex mix of equipment and materials providers, the inclusion of these critical contributors in the incentives will help to ensure the competitiveness and resiliency of the U.S. semiconductor ecosystem.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center.

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