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Press Releases

ICZOOM Group Inc., a leading B2B electronic component e-commerce platform, has announced the introduction of its integrated printed circuit board (PCB) manufacturing and surface mount technology (SMT) assembly services at the IIC Shenzhen 2025. This announcement was made during the International Integrated Circuit & Component Exhibition and Conference held from August 26-28, 2025, at the Shenzhen Convention & Exhibition Center.

This strategic move signals ICZOOM's expansion beyond electronic component distribution, creating a more comprehensive profit model and service offering. The company's new services include a full-process suite—ranging from electronic component procurement, customs declaration, and smart warehousing to PCB manufacturing and SMT assembly, specifically designed to support small and medium-sized enterprises (SMEs).

By partnering with high-quality manufacturers, ICZOOM aims to leverage its industry relationships to execute a capital-efficient expansion without significant upfront investments. This allows the company to enhance its existing one-stop order fulfillment services, strengthening its supply chain solutions for SME customers who often face challenges managing fragmented supply chains and multiple vendor relationships.

The launch at the high-profile IIC Shenzhen 2025 positions ICZOOM to capture additional revenue streams beyond its traditional component sales, potentially increasing its service offerings to include design, manufacturing management, and assembly services.

Founded in Shenzhen, China, ICZOOM Group Inc. continues to cater to the needs of SMEs in the consumer electronics, Internet of Things (IoT), automotive electronics, and industry control segments, with a focus on providing transparent and efficient e-commerce solutions for electronic component products.

TROY, MI ― Amtech Electrocircuits, a leading provider of manufacturing solutions, today announced the introduction of its proprietary automation model designed specifically for high-mix, low-volume (HMLV) production environments. This breakthrough approach integrates modular robotics, intelligent process design, and in-house software platforms to deliver the flexibility and speed that traditional automation systems lack.

Unlike rigid, high-volume automation lines, Amtech’s model is purpose-built for customers who demand rapid new product introductions, complex assemblies, and consistent quality across diverse product types. The system leverages scalable robotic cells, real-time data feedback, and dynamic factory layouts that can be reconfigured to meet changing requirements.

“Traditional automation wasn’t built with HMLV in mind,” said Jay Patel, President of Amtech Electrocircuits. “We developed this model to solve that challenge—giving our customers the agility to bring products to market faster while maintaining world-class precision and reliability.”

The automation framework has already been implemented within Amtech’s operations, where it has demonstrated measurable improvements in throughput, quality consistency, and cost efficiency. By combining robotics with proprietary control software, the model creates a smart, adaptive environment that balances efficiency with customization.

Amtech is an innovator in electronics manufacturing, providing customers with a solution that bridges the gap between flexibility and automation in today’s market.

For more information about Amtech Electrocircuits and their agile electronics manufacturing solutions, please visit www.buildamtech.com.

Seoul, Korea – Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the grand opening of its new branch office, Koh Young Taiwan (KYTW), in Zhubei City, Hsinchu County. This strategic expansion reflects Koh Young’s commitment to serving the growing community of advanced packaging and semiconductor manufacturers in Taiwan, as well as its strong ecosystem of global electronics companies headquartered in the region.

The new office, located at 2F.-5, No.6, Taiyuan 2nd St., Zhubei City, places Koh Young at the heart of Taiwan’s technology corridor. With Taiwan serving as a key hub for semiconductor innovation and electronics manufacturing, this facility enables Koh Young to provide local access to its award-winning inspection and metrology solutions, along with direct engineering, applications, and service support.

The grand opening event will welcome executives and distinguished guests from the semiconductor and SMT industries. Activities will include an introduction to Koh Young’s latest product portfolio and live demonstrations of its advanced inspection tools, followed by a ceremonial ribbon-cutting to officially open the new facility. The celebration will conclude with an open discussion session and a networking lunch, fostering deeper collaboration with key partners and customers.

“Taiwan is one of the world’s most critical centers for advanced semiconductor and electronics manufacturing,” said George Hsu, Managing Director of Koh Young Taiwan.

“Establishing a local presence allows us to collaborate more closely with our customers, understand their evolving challenges, and deliver timely solutions that enhance quality, throughput, and yield in these demanding applications.”

The Koh Young Taiwan office will feature a dedicated demo center to showcase the company’s portfolio of industry-leading solutions for both semiconductor and SMT applications, including systems purpose-built for wafer-level inspection, system-in-package (SiP) assembly, and advanced packaging processes. The facility will also serve as a hub for training, technical support, and joint process development with customers and partners.

By opening this new office, Koh Young strengthens its ability to support manufacturers in Taiwan and around the globe as they push the boundaries of innovation in high-reliability electronics and next-generation semiconductors.

SAN JOSE, CA – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, today announced the appointment of Mark Crebs to Products and Platform Director of Business Development. Mark brings over 25 years of experience in sales and business development, including roles in National and Regional Sales management and in roles with major electronic components distributors across North America.

In his new role, Mark will drive Naprotek’s top-line growth by leveraging the company’s unique offering of RF products and the complete Naprotek platform offering. He will work closely with the executive leadership team to formulate and execute growth strategies that promote its RF Center of Excellence in RF components, micro-e assembly, and fabrication services, including wafer dicing, lithography, and thin film circuits, along with the PCBA and Box Build Center of Excellence in high-mix, high-complexity PCB assembly, integration, and testing.

Mark recently served as the Western Region Sales Director for Richardson Electronics and prior to that, he served as the Western Region Sales Manager for Richardson RFPD, an ARROW company. Prior to Richardson Electronics, Mark worked for RF OEM, MACOM, selling products and running distribution for the West.

“We are excited to welcome Mark to Naprotek,” said Freddie Chavez, Vice President of Business Development. “His deep experience in RF technology, strategic customer interface, and leadership in business development will be crucial in advancing our growth across the enterprise. We look forward to the innovative strategies and leadership he will bring to our organization.”

“I’m excited to join Naprotek and help shape the next phase of its growth,” said Mark. “Working alongside such a skilled team, I look forward to advancing our product and platform strategy while ensuring we deliver exceptional value to our customers and partners.”

For more information, visit www.naprotek.com.

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.

The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and 2, will focus on the role of metal-based TIMs in addressing key challenges across TIM1, TIM1.5, and TIM2 interfaces, including the need to reduce thermal resistance, minimize voiding, and enhance mechanical reliability under thermal cycling. Metal TIMs provide high thermal conductivity, excellent structural stability, and reliable performance across a range of interface conditions, including warped or non-planar surfaces.

“As AI and HPC systems continue to advance, thermal management has become essential to support increasing power densities and packaging complexity,” said Foo. “By highlighting application insights and recent advancements, this presentation will provide a practical perspective on how metal TIMs are enabling next-generation AI and HPC packaging through more reliable, efficient thermal solutions.”

As assistant product manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.

Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.

The presentation will take place on Thursday, September 18, at 10:50 a.m.

To learn more about Indium Corporation’s solder solutions, visit https://www.indium.com/.

SAN DIEGO, CA – PARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Prosperar Solutions, led by Henrique Dantas, Commercial Director, as its new representative in Brazil.

Based in Campinas, São Paulo, Prosperar Solutions is recognized as a key partner to the electronics industry, providing solutions for PCB assembly, semiconductor manufacturing, 3D inspection, optoelectronic measuring systems, industrial automation, BGA rework, X-ray inspection, and smart component storage. With its strong presence in Brazil’s “Silicon Valley,” Prosperar is ideally positioned to support PARMI’s growth and customer service in the region.

Henrique Dantas brings more than two decades of industry expertise, including leadership roles in sales, account management, and manufacturing engineering across the SMT, THT, and EMS sectors.

His career highlights include founding and managing an EMS company, building strong partnerships in the SMT market, and delivering significant sales growth through customer-focused strategies.

"We are very excited to welcome Prosperar Solutions and Henrique Dantas to the PARMI network," said Juan Arango, Head of Sales and Business Development, PARMI USA, Inc. "Brazil is a vital market for electronics manufacturing, and Henrique’s expertise and strong relationships will allow us to better serve customers while expanding our footprint in the region."

Prosperar Solutions will represent PARMI’s full portfolio of 3D inspection systems, providing Brazilian customers with local technical expertise, responsive support, and access to world-class inspection technology.

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