CYPRESS, CA – Hanwha Techwin Automation Americas is excited to announce that Jonny Nichols, Vice President of Marketing, is set to share his profound insights on enhancing overall operational efficiency (OOE) during a highly anticipated panel discussion at IPC APEX EXPO 2024. Titled "How to Maximize Overall Operational Efficiency," this engaging panel will be hosted by Global SMT & Packaging, a leading voice in the industry, and broadcast live from the show floor studio at APEX on Tuesday, April 9th at 11:30 a.m.

In an era where the electronics manufacturing sector (EMS) is evolving rapidly, moving from full line manufacturing solutions to a 'best-in-class' equipment approach and now into digitization and transformation, Nichols, alongside esteemed industry experts, will delve into whether this trend is set to continue or reverse. The panel features Jeff Timms of ASMPT, Clemens Jargon of MYCRONIC, and Shawn Robinson of Panasonic, offering a rare glimpse into the future of electronics manufacturing from the leaders who are shaping it.

IPC APEX EXPO 2024, North America's premier electronics manufacturing event, is the perfect backdrop for such a forward-thinking discussion. Scheduled from April 6-11, 2024, in Anaheim, California, the expo is the stage for the Electronic Circuits World Convention 16 (ECWC16), promising attendees access to the latest in technical content, professional development, and unparalleled networking opportunities.

Hanwha Techwin Automation Americas will also exhibit at the event, showcasing its revolutionary manufacturing solutions designed to maximize productivity with minimal resources. Known for its commitment to innovation, Hanwha Techwin's lineup, including the XM520, HM520W, and the cutting-edge Decan S1, promises to redefine efficiency, accuracy, and productivity in PCB assembly.

Attendees are invited to visit Hanwha Techwin at Booth 4020 for an up-close look at how the company's technologies are setting new standards in the manufacturing world. This is an unparalleled opportunity to learn, network, and discover the innovations poised to drive the electronics manufacturing industry forward.

ANN ARBOR, MI – Technology innovators seeking to learn more about the Department of Defense’s (DOD’s) maintenance and sustainment needs should register for the upcoming Commercial Technologies for Maintenance Activities (CTMA) Partners Meeting. The National Center for Manufacturing Sciences (NCMS) is hosting the event, which is scheduled for May 7-9, 2024, at the Graduate Providence in Providence RI.

The CTMA Partners Meeting is designed to promote an exchange of best practices and technology solutions among maintenance and sustainment leaders in government, industry, and academia. This event is the only DOD-wide forum dedicated to advancing maintenance and sustainment (M&S) capabilities, where the primary focus is on innovations and ideas that drive the evolution of M&S strategies.

For those unfamiliar with the CTMA Program, the event will offer an opportunity to learn how to use this unique contracting vehicle for industry, academia, and the DOD sustainment community to work collaboratively on initiatives to adapt new and innovative technologies to fulfill DOD requirements.

The CTMA Partners Meeting will feature keynote addresses and panel discussions focused on this year’s theme: “Bringing Rapid Sustainment Solutions to the Warfighter.” In addition to stimulating education and multiple opportunities for networking, a Technology Workshop has been planned to encourage attendees to engage in collaborative problem-solving of real-world challenges.

What’s more, an NCMS Tabletop Reception will provide opportunities for up to 30 exhibitors to display their next-generation technology solutions to reach a broad cross-section of decision-makers throughout the DOD. Those interested in showcasing their organizations’ capabilities at the reception will need to act fast, as exhibitor registrations must be completed by Friday, April 5.

Standard registration for attendees is available through Friday, April 19. To register and for more information, visit: https://www.ncms.org/ctma-partners-meeting 

CAMBRIDGE, UK – The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency. Bandwidth is one of the critical factors defining the amount of data transmitted between dies on a package. Bandwidth, crucial for communication speed and efficiency, is impacted by factors such as IO/mm and Datarate/IO, which are, in turn, influenced by the dielectric materials selected for 2.5D and 3D packaging. This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, "Materials and Processing for Advanced Semiconductor Packaging 2024-2034".

2.5D packaging:

For 2.5D packaging, achieving high bandwidth relies on the redistribution layer (RDL) within the package, where features like Line/Space (L/S), via, and pad dimensions are important. However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique. This hinders high-speed communication and presents costly challenges. Consequently, researchers are exploring organic alternatives with lower dielectric constants to enhance performance and reduce costs.

Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages. However, selecting suitable organic dielectrics demands careful consideration of key parameters. IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report identifies five critical parameters crucial for organic dielectrics, including Dk (dielectric constant) and Df (loss tangent), CTE (Coefficient of Thermal Expansion), Elongation, Young’s modulus, and Moisture absorption. Ideally, one would expect to have materials that exhibit low Dk and Df, compatible CTE with Si and Cu, high elongation value, and a moderate Young’s modulus to provide stability to the package. However, material selection entails trade-offs; for example, low Dk polymers may exhibit higher coefficients of thermal expansion (CTE), impacting device reliability and packaging architectures. Thus, achieving a balance among these parameters is critical for successful material selection in semiconductor packaging.

3D packaging:

Reducing the pitches between solder bumps has been a continuous advancement in the evolution of 3D packaging. However, such an approach presents challenges in establishing reliable electrical connections due to reduced bump height and surface area, necessitating precise manufacturing processes. Thermocompression Bonding (TCB) addresses this by enabling fine-pitch bonding as small as 10μm, although issues such as Intermetallic Compound (IMC) formation and solder ball bridging persist. To overcome these challenges, Cu-Cu Hybrid Bonding technology embeds metal contacts between dielectric materials and employs heat treatment for copper atom diffusion, eliminating soldering-related bridging problems and enhancing reliability in high-performance component packaging. It is considered a promising solution for the semiconductor industry, pushing the boundaries of miniaturization and performance in electronic devices.

Currently, hybrid bonding relies on inorganic dielectric materials like SiO2 or SiCN for insulation, which struggle with achieving fine-scale topography patterns and demand front-end manufacturing techniques. Alternatively, organic dielectrics, akin to the benefit it brings to 2.5D packaging, offer benefits such as low-k properties, reducing RC delay and insertion loss, resisting Cu migration, and tolerating defects and warpage better. However, using organic dielectrics for 3D hybrid bonding is still in the R&D phase due to challenges like elevated bonding temperatures (memory applications limit the bonding temperature to be below 250°C and in certain applications (such as displays) that contain sensitive materials embedded in the deck that cannot sustain high temperatures, the bonding temperature requirement must be reduced to 150°C. Furthermore, CMP compatibility with polymers remains a critical issue. Half-cured polymer's characteristics, including low modulus, viscoelastic behavior, and adhesion, pose challenges for ensuring Cu surface reliability during CMP. Modulus differences between Cu and polymer further complicate Cu protrusion formation.

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report suggests that if their properties are enhanced, organic dielectrics may become viable for hybrid bonding. If successful, integrating organic materials into mass production processes could prompt OSAT companies to adopt hybrid bonding more widely. This shift could broaden the technology's availability beyond a few foundries, as organic dielectrics offer the potential to ease stringent manufacturing and cleanroom standards associated with inorganic materials.

The report offers a structured overview of advanced semiconductor packaging in four main sections. The first part covers technology, trends, applications, and the ecosystem. The second part delves into 2.5D packaging processes, exploring dielectric materials, RDL fabrication, and material selection. Detailed analyses, player evaluations, and future trends are provided. Moving beyond 2.5D, the third part focuses on Cu-Cu hybrid bonding for 3D die stacking, offering insights into manufacturing processes, material selection, and case studies. Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.

ATLANTA – Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated alongside KSMART in Koh Young booth 2112 during IPC APEX Expo. Cogiscan has built the new fully customizable factory data platform for the unique needs of circuit board assembly and complex manufacturing ecosystems. Leveraging over 25 years of data expertise with an open architecture design to standardize, analyze, and transform manufacturing data into strategic action.

A customizable factory data platform designed for circuit board assembly and complex manufacturing is crucial for electronics manufacturers. It optimizes efficiency, enables real-time monitoring, facilitates data-driven decision-making, ensures scalability and adaptability, supports quality assurance and compliance, and provides visibility into the supply chain. Overall, it empowers manufacturers to streamline operations, improve productivity, and stay competitive in a rapidly evolving industry.

For Koh Young users specifically, Factory Insights allows them to easily collect, calculate, and visualize analytics data for other brands of machines in use on their floor. Additionally, the new software platform easily integrates with the KSMART software suite to help enrich production data across the entire operation. From site-level OEE (Overall Equipment Effectiveness) to machine drill downs, manufacturers can easily find trends and analyze consolidated real-time and historical data to improve operations. Specifically for Koh Young, Factory Insights allows customers to gather and visualize analytics data from various equipment suppliers on the production line. With its fully customizable design, manufacturers have the flexibility to build specific KPI calculations, create unique dashboards, and seamlessly share calculated metrics with other machine platforms.

If you are attending the IPC APEX Expo show in California from April 9-11, 2024, at the Anaheim Convention Center, visit the Koh Young booth 2112 or Cogiscan booth 1445 for a live demonstration of Factory Insights.