MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs." The webinar will take place on July 18, 2024, at 2:00 PM EDT.

Join us for an insightful session led by Sr. Applications Engineer Ravi Parthasarathy as he delves into the advancements in heterogeneous integration in semiconductor technology. This webinar will explore the transition from chip-on-substrate (CoS) to chip-on-wafer (CoW) technology, highlighting the integration of chips onto an interposer with wafer-level molding and flip chip (FC) substrate connection.

Ravi will share his extensive research originally presented at the IMAPS Device Packaging Conference, focusing on ultra-fine pitch CoW devices with bump pitches under 25μm and over 150K bump counts. Attendees will gain valuable insights into the efficacy of low-concentration alkaline cleaning agents compared to de-ionized water inline systems. Additionally, the webinar will cover the impact of wash temperatures and conveyor belt speed on cleaning effectiveness, utilizing visual inspection, FTIR analysis, and SEM/EDX testing.

This webinar is a must-attend for professionals seeking to enhance their understanding of heterogeneous integration and advanced cleaning techniques in semiconductor technology. Don’t miss this opportunity to learn from an industry expert and stay ahead of the curve in high-density advanced packaging.

For more information and to register for the webinar, please visit the Webinar Registration Page.

SUN PRAIRIE, WI – Pro-Active Engineering, a leader in PCB engineering and manufacturing solutions, is pleased to announce the appointment of Robert Graumann as its Chief Executive Officer.

“I am thrilled to join the talented team at Pro-Active Engineering,” Robert said. “Together, we will accelerate our mission to deliver top-tier engineering solutions, while driving strategic initiatives to ensure long-term growth and customer satisfaction. We will leverage the strengths of our existing team to continue providing exceptional service to our customers.”

With a career in manufacturing spanning over two decades, Robert brings a wealth of experience driving transformative growth and operational excellence across several industries. He began his career in management consulting with Ernst & Young and Booz Allen Hamilton prior to taking on leadership roles at Johnson Controls, Rexnord and Charter Manufacturing. Robert’s leadership experience also includes Group President and COO of Manchester Tank and President of WorkSpace+. Most recently, he served as CEO of TRIARC Corporation, where he led significant operational improvements and strategic realignment. Under his guidance, TRIARC successfully navigated complex market challenges, achieving notable growth in profitability and operational efficiency.

“Robert's extensive experience and proven leadership abilities make him the ideal choice to lead Pro-Active Engineering forward,” said Mark Papp, President of Tide Rock Yieldco. “His strategic vision and commitment to excellence are aligned with Pro-Active’s core values, and will be invaluable as the company continues to grow and innovate.”

Robert holds a Master of Business Administration from Northwestern University's Kellogg School of Management, and a Master of Engineering Management from the McCormick School of Engineering. He also earned a Bachelor of Science in Mechanical Engineering from the University of Wisconsin-Madison, graduating with distinction.

Robert’s extensive leadership experience and ability to effectively integrate strategy with operations will be invaluable as Pro-Active continues to expand its market presence and enhance technological capabilities. Under Robert's leadership, Pro-Active Engineering is poised for a new phase of innovation and growth, with a continued commitment to delivering superior solutions that meet the evolving needs of its customers.

SAN JOSE, CA ― SHENMAO America, Inc. is pleased to announce that its various solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) certification for Recycled Content Standard, which now includes auditing of social responsibility procedures.

Under the vision of becoming a resource-saving and environmentally- friendly global solder enterprise, SHENMAO has declared that the production of various solder products and the development of green energy industries by recycling tin alloy will be primary development strategies to enhance the company's competitiveness. At the same time, the company aims to reduce its carbon footprint and deepen its commitment to ESG (Environmental, Social, and Governance) initiatives. SHENMAO is steadfast in its commitment to resource recycling and sustainable development. In addition to aligning with national policies to implement waste recycling, the company encourages group companies to carry out effective waste treatment to reduce overall environmental pollution risks. Through internal system integration, SHENMAO can fully utilize most resources among its groups, thereby reducing the environmental load.

SHENMAO has achieved recycled content validations from UL for several solder materials, including Solder Paste PF606R-PW215, PF606R-P, PF606R-P217, PF606R-P245, PF606R-P26, and PF529R- P26; Solder Bar PF629R-B, PF606R-B, and PF611R-B; Solder Wire PF606R-R and PF643R-F4; Solid Solder Wire PF643R-H and PF644R-H; and BGA Solder Ball PF682R-S. These products contain a minimum of 80 percent recycled content, consisting of 100 percent recycled tin alloy.

For all of these recycled materials, every step in the recycling process is audited to ensure transparency and reliability. SHENMAO has successfully overcome technical challenges, ensuring the quality and performance of these recycled solder materials are on par with those made from virgin materials. By controlling the impurity levels of recycled tin alloy, the performance of these recycled solder materials shows no significant difference compared to those using virgin materials. As the use of recycled tin increases, market acceptance continues to grow.

For more information about SHENMAO and its certified recycled solder materials, please visit www.SHENMAO.com 

HELSINKI – Incap UK has upgraded its first SMT (surface-mount technology) production line with the installation of the first fully automated high-precision solder screen printer of this model in the UK. This was followed by two advanced SMT placement modules. This upgrade marks the first phase of a EUR 1.5 million innovation investment, enhancing the efficiency, flexibility, quality, and capacity of manufacturing operations. As a result, an initial 33% increase in SMT production capacity has been achieved for the first line.

According to Jamie Maughan, the Managing Director of Incap UK, this upgrade is not only preparing the production lines for future demands but also integrating advanced software and machine capabilities that will drive efficiency improvement within the manufacturing cycle. "This investment also improves our SMT operational efficiency, production quality, and site technology. Additionally, it allows for energy savings through real-time intelligent machine monitoring, helping us better serve our current and future customers”, Maughan explained.

The current phase focuses on upgrading the first line and will be followed by the second line over the course of the year, using identical advanced machinery and software. This strategic update is designed to ensure each stage is optimized before continuing expansions.

The enhancements will enable improved data acquisition capabilities, combining cutting-edge Industry 4.0 architecture for advanced interfacing with future ERP systems. The use of intelligent technologies is instrumental in achieving these improvements and opens several other opportunities. Incap’s continued collaboration with Panasonic to upgrade technology to new levels of operational excellence reinforces Incap’s strong position in the electronic manufacturing industry.

"This investment marks an important milestone in our strategic technology roadmap”, Maughan added. "It reflects our commitment to reducing environmental impact and improving operational efficiency, while continuing to provide high-quality, flexible, and agile services to meet the growing demands of our customers."

Incap’s factory in UK, based in Newcastle-under-Lyme, provides full turn-key product supply including PCBAs, electro-mechanical assembly, cable and wire harness assembly alongside a dedicated standalone rapid prototyping facility (Fast Track) and maintenance, repair and overhaul services (MRO). The factory has 4,400 square meters of total floor space and has experience in manufacturing since 1974, including over 20 years of experience in the defence, security and aerospace markets.