DALLAS, TX ― ROCKA Solutions is excited to announce its participation in the upcoming Del Mar Electronics & Manufacturing Show, scheduled to take place on April 24-25, 2024 at the Del Mar Fairgrounds in San Diego, CA. ROCKA Solutions will be exhibiting in Booth 650, where attendees can learn more about the company's commitment to enhancing supply chains and supporting various manufacturing sectors.

While traditionally known for its expertise in the electronics manufacturing industry, ROCKA Solutions is dedicated to providing value-added services across a wide range of manufacturing industries. With a focus on global reach, competitive pricing, inventory management, on-time deliveries, and technical support, ROCKA Solutions offers tailored solutions to meet the unique needs of its customers.

Key highlights of ROCKA Solutions' services include:

Global Reach: With a network of partners and suppliers worldwide, ROCKA Solutions provides global sourcing capabilities to ensure access to quality materials and components at competitive prices.

Competitive Pricing: ROCKA Solutions leverages its industry expertise and strategic partnerships to offer cost-effective solutions without compromising on quality.

Inventory Management: ROCKA Solutions assists clients in optimizing inventory levels, reducing carrying costs, and improving supply chain efficiency.

On-Time Deliveries: Through meticulous planning and execution, ROCKA Solutions ensures timely delivery of products and components to meet project deadlines and customer requirements. Technical Support: ROCKA Solutions' team of experts provides comprehensive technical support and guidance to help clients navigate complex manufacturing challenges and achieve their goals.

Visit Booth 650 at the Del Mar Electronics & Manufacturing Show to learn more about how ROCKA Solutions can enhance your manufacturing operations and supply chain efficiency.

CLINTON, NY – Indium Corporation’s Principal Engineer – Advanced Materials Andy C. Mackie, Ph.D., MSc, is scheduled to present on day one of the 2024 Critical Materials Council (CMC) Conference taking place April 10-11 in Chandler, AZ, U.S. The two-day event provides actionable information, on materials and supply-chains, for current and future semiconductor manufacturing.

Dr. Mackie’s presentation, titled From SiP to SiC: Advanced Metal Alloys Meet Evolving Reliability Challenges, will examine the continuing importance of metals in advanced digital and power packaging for both electrical and thermal electronics assembly.

“Engineered alloys for assembly materials, along with novel and emerging assembly processes, are enabling the future of electronics assembly and packaging,” said Dr. Mackie. “I look forward to exploring this timely topic with my industry colleagues at CMC.”

Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.

HAVERHILL, MA – Seica, Inc. is pleased to announce its participation in the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. Visitors are invited to explore Seica's latest innovations in booth 3514, where the company will exhibit its state-of-the-art test platforms and automation solutions.

With a commitment to accelerating innovation, Seica's booth at the IPC APEX EXPO will feature an array of cutting-edge test solutions designed to meet the evolving needs of the electronics industry. Among the highlights will be the revolutionary PILOT VX NEXT test platform, setting a new standard in flying probe speed and performance. Equipped with advanced measurement hardware and software tools, the PILOT VX boasts unparalleled test performance, reduced test times, and enhanced capabilities for prototype validation and production testing. The Pilot VX has many automation configurations from inline integration to independent manufacturing workcell strategies. The Pilot VX is the best method to deploy for prototype runs to even high-volume production runs when the cost of fixtures and time-to-market are business concerns.

Visitors to Seica's booth will also have the opportunity to explore the fully automated COMPACT SL NEXT, a versatile test solution that maximizes configurability and customization while delivering exceptional throughput and reliability. With features such as onboard programming (OBP) and LED test capability, the COMPACT SL NEXT offers a comprehensive solution for in- circuit and functional testing requirements.

Additionally, Seica will discuss its MINI Line, a cost-effective platform for developing customized test solutions tailored to specific manufacturing needs. With integrated instruments, switching matrices, and user power supplies, the MINI Line provides flexibility and scalability for various test applications, supported by Seica's VIVA Integrated Platform (VIP™) for seamless integration and programming.

Innovative optical inspection solutions will also be on display, including the desktop version of the DRAGONFLY Next series for THT component inspection and conformal coating inspection, and with unique features to measure conformal coat thickness and validate the presence of process application of conformal coat masking. These advanced systems redefine performance in terms of flexibility, throughput, reliability and process traceability, offering unmatched capabilities for manufacturing quality and efficiency.

The COMPACT LR Next is Seica’s newest answer to legacy replacement systems, boasting a state-of-the-art-bed of nails in-circuit and functional test system with various receiver interfaces, allowing customers the ability to migrate old fixtures to a new Seica platform. This year the company will exhibit the Compact LR with its Teradyne interface. Seica has also deployed other LR options for both the GenRad and Aeroflex/Marconi systems.

The Firefly Next is a technologically advanced automated selective soldering solution, with its perfect integration on a single axis of a high-efficiency LASER source, fully-programmable donut spot, vision system and temperature sensor. The Firefly redefines the levels of performance achievable in the selective soldering process in terms of flexibility, throughput, reliability, applicability and process traceability. Stop by our booth for a discussion with our team on how the Firefly can help in your selective soldering process.

All of Seica's solutions showcased at IPC APEX EXPO will feature the company's VIVA NEXT software platform, enabling intelligent integration with manufacturing processes, data collection, traceability, and interaction with MES systems. Additionally, Seica's Next series systems are equipped with Canavisia's Industrial Monitoring solution for remote monitoring and predictive maintenance, ensuring compatibility with Industry 4.0 standards.

Come visit us at Booth 3514 to see how our innovation can help accelerate yours!

SANTA CLARA, CA – To streamline and facilitate a back-end manufacturing ecosystem for PICs, OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a strategic partnership with Jabil, a global manufacturing solutions provider. With this collaboration, OpenLight customers can fast-track the manufacturing and delivery of integrated PICs across a wide variety of applications and markets, including datacom transceivers, automotive LiDAR, AI/ML, HPC, and healthcare.

As PICs become increasingly critical to address the growing demand for faster data processing, supply chain complexities hinder seamless transitions from silicon wafers to packaged heterogeneous integrated systems. This partnership offers one-stop "Silicon to Solutions" services to accelerate end-to-end production and optimize manufacturing efficiencies – from assembly and packaging to burn-in and testing.

"We are very pleased to work with such a prominent global leader in high-volume manufacturing and together, we look forward to enabling a holistic path for our customers to take our PASIC wafers to packaged solutions for the markets and applications we serve," said Dr. Adam Carter, CEO of OpenLight. "This will simplify the management of our customers' supply chain, paving the way for scalability as their business grows."

"As we continue to invest and grow our existing capabilities for manufacturing optical solutions for our customers, we are excited to partner with OpenLight and leverage its unique business model to produce PASIC solutions. Combining their expertise with Jabil's high-volume experience in optical packaged solutions, we're poised to deliver exceptional value to our customers," said Matt Crowley, SVP Cloud and Enterprise Infrastructure of Jabil. "At Jabil, we also have the ability to take these PICs and build them into a wide variety of packaged solutions per our customer's requirements."

The unique collaboration puts both companies at the forefront of revolutionizing the silicon photonics manufacturing landscape, eliminating associated supply chain challenges and meeting the volume demands of high-bandwidth components for the broad markets both companies serve.