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Datalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.

The partnership sees Altus providing comprehensive support for the installation of the Inertec Cube 460 selective soldering system at Datalink Electronics, a respected contract electronics manufacturer with over 40 years of industry experience serving customers ranging from multinationals to high-growth start-ups.

Recognising the challenges facing UK CEMs, including rising labour costs and skilled operator shortages, Altus leveraged its technical expertise and comprehensive support network to guide Datalink through a thorough evaluation process. After assessing various selective soldering platforms and robotic options, Datalink selected Altus as their trusted partner, citing the company's strong technical capabilities and reliable support infrastructure.

Under the leadership of Aran, Business Development Director at Datalink, Datalink Electronics is focused on driving automation and process improvements to meet increasing demand while maintaining quality and service standards. Altus's solution directly supports these objectives through the deployment of the Inertec Cube 460 system - a compact, modular batch selective soldering platform designed for high-mix, low-to-medium volume production.

The system automates complex soldering tasks traditionally performed by skilled operators, featuring programmable soldering angles, quick-change nozzles, precise microdrop fluxing, advanced quartz pre-heating, and RT-Console software for offline programming, traceability, and real-time warpage correction. The Cube 460 supports both leaded and lead-free soldering processes, ensuring flexibility across industries.

Shane Nooney, Production Engineer at Datalink Electronics, said: “What a good result! The support from both Altus and Inertec throughout this project has been excellent, and we can't fault the quality of the technical validation or the effort involved. Ultimately, the machine and its performance spoke for itself, but knowing we had a strong partner in place for after-installation support was a major factor in our decision.”

Joe Booth, CEO of Altus Group, said: "I'm really pleased with this project and delighted for the team at Datalink. We've been building a trusted relationship for some time and waiting for the right opportunity, and I'm very happy with how the process went, and of course, the end result. It's great to see another Inertec 460 out in the field; we're clearly building some real momentum.”

The collaboration is expected to further enhance Datalink’s process control and throughput, supporting their wider growth strategy, while reinforcing Altus's reputation as the go-to partner for advanced manufacturing solutions in the UK and Ireland electronics sector.

Seoul, Korea – Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei Cit. This exclusive, invitation-only event requires advance registration and offer attendees with an opportunity to meet the Koh Young team, explore the new facility, and experience the company’s cutting-edge inspection and metrology solutions in action.

Building on the momentum of its successful grand opening, this Technical Review Meeting reinforces Koh Young’s commitment to driving process innovation and helping manufacturers achieve the highest levels of quality, yield, and productivity. Taiwan is a critical hub for advanced packaging and high-reliability electronics, and Koh Young’s local presence ensures manufacturers have direct access to expertise, applications support, and smart solutions that accelerate performance in both semiconductor and SMT production.

The full-day program combines live demonstrations, expert discussions, and networking opportunities:

  • Morning Session (9:00 AM – 12:00 PM): Semiconductor-focused demos featuring three real-world applications for wafer-level inspection, advanced packaging, and system-in-package (SiP) metrology.
  • Afternoon Session (2:30 PM – 5:30 PM): SMT-focused demos showcasing Koh Young’s industry-leading True 3D inspection portfolio and Smart Factory solutions including KAP, KPO, KSMART, and Smart Review for data-driven process optimization.
  • Networking Lunch and Dinner: Direct engagement with Koh Young engineers and industry peers to discuss practical strategies for improving process performance and yield.

“Our Technical Review Meeting is more than a demonstration—it’s a knowledge-sharing experience,” said George Hsu, Managing Director of Koh Young Taiwan. “By bringing customers into our new facility, we can show them firsthand how Koh Young’s inspection and metrology solutions empower manufacturers to meet the challenges of advanced packaging, Smart Factory integration, and next-generation electronics production.”

With nearly 25,000 systems installed worldwide, Koh Young continues to partner with the world’s top electronics and semiconductor manufacturers to drive innovation and process optimization. This Technical Review Meeting represents the next step in supporting Taiwan’s leadership in global high-tech manufacturing while helping customers worldwide achieve smarter, more reliable, and higher-performing production lines.

San Diego, CA — KIC, a leading provider of thermal process solutions for electronics manufacturing, has announced the expansion of its service capabilities in Mexico.

KIC has served customers in Mexico for decades and has maintained a local presence since 2012. KIC Mexico’s main office for sales and support was established in Guadalajara 5 years ago. The company has also supported the region with two field service engineers dedicated to technical support, installations, and training.

Now, in response to strong customer demand, KIC is strengthening its commitment by adding a third field service engineer and establishing two additional calibration and repair centers. These new centers will be located in Juarez and Cuautla (Mexico City region), alongside the existing Guadalajara facility.

The expansion provides customers across Mexico with faster, more localized, and cost-effective access to calibration and repair services, reducing downtime and helping manufacturers maximize the performance of their KIC solutions.

“We know the Mexico market very well and have always invested in customer service as a key part of our solutions,” said Gerardo Gallegos, KIC Service Manager. “This expansion ensures our customers will benefit from the best localized service and support available.”

KIC’s expanded footprint underscores its role as a trusted partner for electronics manufacturers in Mexico, combining world-class technology with responsive, local service.

To learn more, explore KIC’s solutions at www.kicthermal.com.

 

Atlanta – ECIA’s 2025 Executive Conference Committee is pleased to announce an expanded session on cybersecurity presented by CrowdStrike’s Senior Director of Field Engineering Thuy Nguyen.

“eCrime actors have streamlined their go-to-market strategies by specializing and standardizing their playbooks for tactics, techniques and procedures (TTPs). They have become a faster, nimbler and more flexible adversary,” Thuy Nguyen explained. “In this session, we will review a brief history of the evolving eCrime economy and discuss how growing trends like AI adoption lower the barrier to entry for even less skilled threat actors to execute highly sophisticated targeted campaigns.”

“At last year’s conference, CrowdStrike’s breakfast session was widely attended, so we knew we wanted to invite these experts back,” added Stephanie Tierney, ECIA Director of Communications and Member Engagement. “With this topic gaining even more attention this year, we are anticipating this session to be very helpful to attendees.”

Sponsorships are filling fast! This Conference offers personal access to industry experts, ample time to discuss important issues and critical networking opportunities. Spotlight your company by becoming a sponsor. Several sponsorship levels are available as well as the opportunity to support a particular event or session.

The theme for this year’s conference is ‘Amped UP, the Power of Tomorrow.” The 2025 Executive Conference takes place October 19-21, 2025 at a NEW LOCATION, the Westin O’Hare Hotel.

ICZOOM Group Inc., a leading B2B electronic component e-commerce platform, has announced the introduction of its integrated printed circuit board (PCB) manufacturing and surface mount technology (SMT) assembly services at the IIC Shenzhen 2025. This announcement was made during the International Integrated Circuit & Component Exhibition and Conference held from August 26-28, 2025, at the Shenzhen Convention & Exhibition Center.

This strategic move signals ICZOOM's expansion beyond electronic component distribution, creating a more comprehensive profit model and service offering. The company's new services include a full-process suite—ranging from electronic component procurement, customs declaration, and smart warehousing to PCB manufacturing and SMT assembly, specifically designed to support small and medium-sized enterprises (SMEs).

By partnering with high-quality manufacturers, ICZOOM aims to leverage its industry relationships to execute a capital-efficient expansion without significant upfront investments. This allows the company to enhance its existing one-stop order fulfillment services, strengthening its supply chain solutions for SME customers who often face challenges managing fragmented supply chains and multiple vendor relationships.

The launch at the high-profile IIC Shenzhen 2025 positions ICZOOM to capture additional revenue streams beyond its traditional component sales, potentially increasing its service offerings to include design, manufacturing management, and assembly services.

Founded in Shenzhen, China, ICZOOM Group Inc. continues to cater to the needs of SMEs in the consumer electronics, Internet of Things (IoT), automotive electronics, and industry control segments, with a focus on providing transparent and efficient e-commerce solutions for electronic component products.

TROY, MI ― Amtech Electrocircuits, a leading provider of manufacturing solutions, today announced the introduction of its proprietary automation model designed specifically for high-mix, low-volume (HMLV) production environments. This breakthrough approach integrates modular robotics, intelligent process design, and in-house software platforms to deliver the flexibility and speed that traditional automation systems lack.

Unlike rigid, high-volume automation lines, Amtech’s model is purpose-built for customers who demand rapid new product introductions, complex assemblies, and consistent quality across diverse product types. The system leverages scalable robotic cells, real-time data feedback, and dynamic factory layouts that can be reconfigured to meet changing requirements.

“Traditional automation wasn’t built with HMLV in mind,” said Jay Patel, President of Amtech Electrocircuits. “We developed this model to solve that challenge—giving our customers the agility to bring products to market faster while maintaining world-class precision and reliability.”

The automation framework has already been implemented within Amtech’s operations, where it has demonstrated measurable improvements in throughput, quality consistency, and cost efficiency. By combining robotics with proprietary control software, the model creates a smart, adaptive environment that balances efficiency with customization.

Amtech is an innovator in electronics manufacturing, providing customers with a solution that bridges the gap between flexibility and automation in today’s market.

For more information about Amtech Electrocircuits and their agile electronics manufacturing solutions, please visit www.buildamtech.com.

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