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MANASSAS, VA – ZESTRON, the global leader in high- precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its upcoming webinar, "Electrifying Reliability: Advanced Cleaning and Coating Solutions for Enhanced Performance in E-Mobility," which will take place on October 17, 2024, at 2:00 PM EDT.

As the future of transportation moves toward electrification, ensuring the reliability of electronic components in the rapidly growing E-Mobility sector is more critical than ever. This webinar will bring together industry experts Jeff Kennedy from ZESTRON Academy and Brent Frizzell from Specialty Coating Systems to discuss the latest cleaning and coating technology advancements that enhance performance and reliability.

The session will give attendees an in-depth look at cleaning and coating solutions to mitigate common failure causes in E-Mobility applications such as electrochemical migration (ECM) and creep corrosion. As electric vehicles (EVs) and other e-mobility innovations push the boundaries of performance, maintaining the integrity of electronic components is essential to ensuring their long-term success. This is a must-attend event for engineers, manufacturers, and industry professionals who want to stay at the forefront of E-Mobility innovations and ensure the long-term reliability of their electronic systems.

Don't miss this opportunity to learn from the experts and stay ahead in the electrified future of transportation.

Register For The Webinar: https://pages.zestron.com/2024-electrifying-reliability-advanced-cleaning-and-coating-solutions-for-enhanced-performance-in-e-mobility  

SANTA CLARA, CA – Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence (AI) industry. As AI continues to transform various sectors, Absolute EMS is positioned today to meet the increasing demand for high-reliability manufacturing by offering specialized PCB assembly capabilities, including large BGA assembly (up to 5,300 ball), fine pitch BGA assembly (down to 0.25mm pitch) and very small capacitor & resistor placement capabilities (down to 008004 passives).

Certified to ISO13485, AS9100 and ISO 9001, Absolute EMS manufactures to the highest industry quality standards, ensuring that the PCB assembly process for AI applications exceeds all rigorous quality and industry requirements. The company specializes in fully automated, touchless contract manufacturing, which includes advanced nitrogen reflow systems to optimize soldering processes for components, like large 4,096+ ball BGAs to as small as Imperial code 008004—some of the smallest in the world—ensuring optimal reliability for complex AI systems. Absolute EMS also offers box build services for final AI products and sub-systems. Box builds range from simple additions of heat sinks and cold plates, to complex system box builds like full rack servers. Expediting AI OEMs time-to-market.

“AI technology demands precision and reliability, and our Silicon Valley-based facility is fully equipped to deliver that,” said Doug Dow, COO at Absolute EMS. “With our Class 3 IPC-A-610 and J-STD-001 certifications, alongside UL registration, we ensure that AI PCB assemblies meet the highest standards, particularly for medical manufacturing, military manufacturing and other high-reliability applications.”

Absolute EMS is also a trusted EMS provider for advanced, AI driven, satellite manufacturing and other mission-critical aerospace programs. Absolute EMS’s capabilities, which include PCB assembly for complex AI hardware, position them as an ideal partner for companies seeking a high-reliability, AS-9100 certified, manufacturing solutions supplier in Silicon Valley and beyond.

With AI continuing to revolutionize industries such as healthcare, autonomous vehicles, and consumer electronics, Absolute EMS is committed to providing the highest levels of precision manufacturing, quality, and innovation to meet the complex demands of AI-driven hardware.

For more information about Absolute EMS and its manufacturing solutions for the AI industry, visit www.absolute-ems.com 

CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.

Indium Corporation will showcase the following among its featured products:

  • Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
  • Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.

Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry's drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse® and Indalloy®, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.

To learn more about Indium Corporation’s solutions, visit our experts at the Detroit Battery Show in hall A-C, booth #733.

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at FABTECH 2024, scheduled to take place October 15-17, 2024 at the Orange County Convention Center in Orlando, FL. The KYZEN Clean Team will exhibit at Booth W2810, offering cleaning insights and solutions for a wide range of industrial metal cleaning challenges.

KYZEN offers a full line of products to meet the challenges faced today by metal industry manufacturers. KYZEN provides chemistries to address cleaning challenges ranging from cleaning and protecting parts from corrosion with a single chemistry, improving a remanufacturing process or vacuum degreasing process, or replacing solvents that may soon be hard to get or completely banned.

Award-winning KYZEN chemistries are designed to effectively remove a variety of oils, coolants, smut, oxides and more from many substrates in precision metal cleaning applications. For example, KYZEN offers products that clean and brighten brass, clean and protect aluminum, remove carbon smut from deep drawn steel or provide general metal degreasing. KYZEN’s Clean Team even assists in making cleaning processes “future-proof” from bans and restrictions with solvent replacements, in light of recent EPA restrictions and the current phasedown in production of materials containing PFAS and HFCs.

Whether the cleaning process and challenge calls for aqueous cleaning agents, vacuum degreasing solvent cleaners, or solvent replacements, KYZEN’s cleaning experts will work to find the chemistry that fits your cleaning need and process.

Regardless of process, challenge, or the cleaning objective, KYZEN is prepared to offer chemistries and provide solutions. Make plans to stop by Booth W2810 at FABTECH and speak with the company’s cleaning experts!

To learn more, visit www.kyzen.com 

FARNBOROUGH, UK – GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, has entered into a strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability. 

This collaboration aims to elevate the standards of reliability and support for UK electronics manufacturing. GEN3 will offer a comprehensive range of Zestron’s products & analytical services alongside GEN3’s own test services to UK manufacturers, encompassing a full test and reliability service.

By combining Zestron's reliability, surfaces products and services with GEN3's deep understanding of UK electronics manufacturing, both companies aim to create a synergistic approach to addressing reliability challenges. This alliance aligns perfectly with both companies' core values. 

Zestron's focus on reliability complements GEN3's Objective Evidence approach, which helps validate the reliability and robustness of electronic assemblies. UK electronics manufacturers will now have a single, comprehensive source for addressing reliability issues and finding solutions to complex challenges.

This strategic collaboration marks a significant step forward in enhancing the quality and reliability of UK-manufactured electronic assemblies, offering UK manufacturers a unified resource for tackling reliability issues and optimising their production processes.

For more information about GEN3 and its partnership with Zestron, please visit www.gen3systems.com/zestron-partnership 

CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.

Indium Corporation will showcase the following among its featured products:

  • SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
  • PicoShot® NC-6M is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot® NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot® NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
  • NC-809 is Indium Corporation’s first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications. NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.
  • WS-446HF, is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.
  • Heat-Spring® solutions, ideal for TIM1.5/TIM2/TIM3 applications, are a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
  • GalliTHERM®, a portfolio of gallium-based liquid metal solutions, draws on Indium Corporation's more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for TIM1.5, TIM1, and TIM2 applications. Liquid metal TIMs offer high thermal conductivity for end-product longevity and reliability, low interfacial resistance against most surfaces, ensuring rapid heat dissipation, and extraordinary wetting ability for both metallic and non-metallic surfaces

To learn more about Indium Corporation’s products, visit our experts at IMAPS Boston at booth #321.

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