ZION, IL – Stannol, a leader in soldering technology, is excited to announce its participation in SMTA Guadalajara 2024, taking place from Sept. 11-12, 2024 at the Expo Guadalajara, Jalisco (Mexico). Stannol will showcase its cutting-edge products at Booth 502, in collaboration with its distributor, Quiptech Mexico.

Highlighting Stannol's Advanced Products:

New Water-Based Cleaning Line
Stannol is proud to introduce its new water-based cleaning line, designed to meet the rigorous demands of modern manufacturing while prioritizing environmental compatibility. The new Flux-Ex series includes broadband and specialty cleaners that are perfectly tailored to their respective areas of application – e.g. for cleaning before the soldering process or for removing residues after soldering. All cleaners are delivered as a ready-to-use-mix.

Solder Wire: Kristall 600-Series, Flowtin, and Fairtin
Stannol’s Kristall 600-Series and Flowtin and Fairtin solder wires represent significant advancements in soldering technology. The Flowtin series leverages innovative micro-additives to extend solder tip life by up to 30%, enhancing the quality and durability of solder joints. The Kristall 600-Series, including the Fairtin product line, combines synthetic resins and modern activators to ensure fast, safe wetting with minimal, transparent residues.

Solder Paste: SP6000
The SP6000 solder paste, developed for use with TSC305 (Sn96.5Ag3Cu0.5) T4 and TSC105 (Sn98.5Ag1Cu0.5) T4 alloys, is a testament to Stannol’s commitment to technical excellence and environmental responsibility. This innovative paste boasts an impressive reduction of CO2 emissions by over 85% compared to traditional solder pastes, achieved through the use of recycled solder, sustainable packaging materials, and climate-neutral transport. The SP6000 not only delivers superior performance but also aligns with Stannol’s sustainability goals.

Stannol invites all attendees to visit them at Quiptech Mexico's booth (502) to learn more about these cutting-edge products. Live demonstrations and technical discussions will provide insight into how Stannol’s solutions can enhance manufacturing processes and contribute to a more sustainable future.

For more information, visit www.stannol.com 

CAMBRIDGE, UK – Photonic Integrated Circuits (PICs) are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor.

PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries. IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, explores key market players, emerging materials like TFLN and BTO, and new applications such as AI to forecast the future growth of the PIC market.

PICs offer substantial advantages over electronic ICs due to their fundamental properties. Light, which travels approximately three times faster than electricity, can transmit data with significantly higher efficiency. In materials such as Silicon Nitride or Indium Phosphide, specific frequencies of light (like 1550nm) experience much lower propagation losses compared to electrical signals. These attributes allow photonic waveguides to achieve up to ten times better data transfer efficiency, one hundred times higher bandwidth, and much shorter latency (0.3 times) when compared to their electronic counterparts. Furthermore, Silicon Photonics—a subset of PIC technology—is essential for reducing energy consumption during data transmission, as noted by C.C. Wei, president of TSMC. Additionally, PICs can be integrated into modern CMOS processes and are relatively easy to combine with existing electronic systems, enhancing their versatility and effectiveness in advancing data communication technology.

Given their benefits, PICs find applications in a diverse range of fields. In telecommunications, they enable high-speed data transfer, supporting the burgeoning demands of the internet and communication networks. Environmental sensing is another area where PICs shine, with applications such as artificial noses that detect various compounds and molecules in the air, while the healthcare sector benefits from PIC technology through enhanced diagnostic tools and medical devices. IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, highlights that photonic transceivers for AI are poised to become the largest demand source for PICs. The increasing need for high-speed, efficient data processing in AI applications fuels this growth. Additionally, emerging technologies such as programmable photonics, photonic quantum computers, and co-packaged optics are set to redefine the capabilities and applications of PICs, unlocking new potentials in computing, communication, and sensing technologies.

Despite these advantages, the PIC market faces several challenges. Cost management also poses a critical issue, as designing and manufacturing PICs involves substantial initial investments. Large demand volumes are necessary to offset these expenses, and production lead times can extend over several months, complicating market responsiveness.

Material limitations further complicate the development and performance of PICs. While silicon and silica are common in current PICs, they are not the most efficient materials for light sources or photodetectors. This necessitates the combination of silicon with III-V materials; however, this brings another challenge to the table – integration complexity. Combining different materials and components into a single PIC requires intricate engineering and manufacturing processes, ensuring compatibility and consistent performance across the various materials.

Addressing material challenges is crucial for advancing PIC technology and expanding its use across different applications. Therefore, the future of PICs depends on exploring and adopting new materials to overcome these limitations. While silicon remains dominant, several emerging materials are gaining traction. Thin Film Lithium Niobate (TFLN) offers moderate Pockels effect and low material loss, making it ideal for high-performance modulation applications, including quantum systems and future high-performance transceivers. Monolithic Indium Phosphide (InP) continues to be significant due to its ability to detect and emit light, though it faces challenges related to high losses and costs. Barium Titanite (BTO), known for its superior modulation performance, is anticipated to find applications in quantum photonic systems where modulation efficiency is paramount. Silicon Nitride (SiN) provides lower losses compared to other materials but comes with higher costs and larger device sizes due to its low refractive index, limiting its current widespread adoption. According to IDTechEx’s analysis, silicon is expected to remain the dominant material in the PICs market. However, in the long run, monolithic Indium Phosphide (InP) and Thin-Film Lithium Niobate (TFLN) are projected to gain a growing market share.

In conclusion, PICs are driving significant advancements across various domains. Despite challenges related to integration complexity, cost management, production lead times, and material limitations, the ongoing exploration of new materials and emerging technologies promises a bright future for PICs.

IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, examines key market players, emerging materials like TFLN and BTO, and new applications such as AI to project the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market. The report also explores emerging technologies, including Programmable Photonics, Photonic Quantum Computers, and Co-Packaged Optics.