CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech's commitment to continuous process enhancement and operational excellence.

The wire bond pull test is a critical method used to assess the quality and integrity of wire bonds in microelectronics. Leveraging extensive historical data and its exceptional process yield rate, NEOTech’s manufacturing engineers developed a robust random sampling methodology that ensures testing efficiency without compromising quality. The new sampling plan has dramatically reduced average testing time from 2.5 hours per assembly to approximately 1 hour per assembly.

This innovative process is fully compliant with the stringent requirements of MIL-PRF-38534 and MIL- STD-883, ensuring that NEOTech meets the highest quality and reliability standards. The process has been implemented on mission-critical, high- frequency RF assemblies — products recognized in the industry as highly complex and challenging to manufacture. NEOTech’s success in achieving these advancements demonstrates its expertise in addressing the rigorous demands of such sophisticated microelectronics applications.

“Achieving greater than 99.99% production yields is a remarkable milestone,” said Daniel De Haro, General Manager of the NEOTech Chatsworth site. “But our team didn’t stop there. They went above and beyond to implement innovative sampling techniques and streamline testing processes to significantly improve production cycle times. I’m incredibly proud of our engineers, technicians, and manufacturing teams for their dedication to excellence and their commitment to setting new benchmarks in microelectronics manufacturing.”

The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures. These efforts ensured that the NEOTech team could maintain its exceptional yield rates while increasing throughput and efficiency for its customers’ microelectronics circuit assemblies. At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics 

PLANO, TX – Siemens Digital Industries Software announced today that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.

Founded in 1990, Sat Nusapersada is the first high-tech EMS listed on the Indonesia stock exchange and provides trusted services for large enterprise customers, including Asus, Xiaomi, Murata and Epson. Driven by customer demand and business growth, Sat Nusapersada has expanded its surface mount technology (SMT) lines to 24. With the increase of production capacity and RFQ per month, Nusapersada needed to reduce manual work, particularly during New Product Introduction (NPI).

Following an extensive evaluation, Sat Nusapersada implemented the Process Preparation software from Siemens, which enables customers to keep assembly, test and inspection data up to date in a single environment for all stages of the surface mount technology (SMT) manufacturing process – dramatically reducing the need for manual, error-prone updates, which can cause consistency and reliability issues.

“We have achieved significant increases to our production capacity with the introduction of Siemens’ Process Preparation which, when combined with decreases in manual rework, we’re able to better serve our customers and bring them their critical electronics in the timescales that today’s industry demand,” said Stanly Rocky, Asst General Manager of Public Relations, Sat Nusapersada.

After implementation, Sat Nusapersada has benefited from a decrease in time to gather all the incoming data for projects by 70 percent and has improved line efficiency by 23 percent. Use of Siemens Process Preparation has also helped Sat Nusapersada to reduce SMT programming task time by 21 percent (line configuration setup, common feeder, data output/transfer, move existing product between lines of different equipment brands). The design time for solder stencils was reduced by 30%, by leveraging the learning libraries that automatically set the correct aperture shape and size to new footprints.

“it’s great to see the benefits that Sat Nusapersada have gained from implementation of Siemens’ Process Preparation and how it is benefitting from improved efficiency in its SMT production lines,” said Alex Teo, managing director and vice president, South East Asia, Siemens Digital Industries Software. “Our success is the region is centered on enabling our customers to not only innovate their own products, but to scale up the production lines for an increased global demand for electronics.”

To learn more about Siemens’ Process Preparation and how it is helping customers to optimize electronics manufacturing by enabling a full digital flow from product design, through process engineering, to the manufacturing shop floor, visit: https://plm.sw.siemens.com/en-US/valor/process-preparation/ 

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries. The incentives, which are part of the CHIPS and Science Act, will support GlobalFoundries manufacturing projects in New York and Vermont.

“We commend the Commerce Department and GlobalFoundries for finalizing CHIPS Act incentives that will strengthen America’s economy, national security, and global competitiveness. The new investments will advance essential semiconductor production for automotive, communications, and defense applications. We urge leaders in Washington to get more CHIPS agreements finalized expeditiously to help keep America on top in chip technology for many years to come.”

The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032. The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.

NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Silicon Valley Expo & Tech Forum on Thursday, December 5, 2024 at the Fremont Marriott Silicon Valley in Fremont, CA. KYZEN will showcase stencil cleaner KYZEN E5631, aqueous flux cleaner AQUANOX A4618 and the KYZEN Process Control System (PCS) during the event.

KYZEN provides effective cleaning solutions to meet challenges in every phase of manufacturing PCBs and other electronic assemblies.

KYZEN E5631 is a stencil cleaner designed for use at low concentrations and ambient temperature for cleaning all types of raw solder paste in spray-in-air, understencil and ultrasonic systems. It is compatible with a variety of materials including stencil foil, epoxy adhesives, frames, and mesh in addition to being compliant with RoHS and REACH requirements.

AQUANOX A4618 is an aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues, including no-clean and Pb-free residues, while achieving mirrored solder finishes. A4618 has a low cost of ownership, an adjusted stabilizer, and cleans successfully at low concentrations and temperatures.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations, allowing users to maximize high-quality output from inline cleaning systems. KYZEN has continuously improved and advanced the capabilities of the KYZEN PCS from its introduction more than 20 years ago, and it remains the only complete concentration monitoring and control system available in the world.

From cleaning stencil apertures to removing flux residue from completed boards, KYZEN provides chemistries to meet unique cleaning needs and even provide real-time monitoring of chemical concentrations with the KYZEN PCS. For more information, visit www.kyzen.com