MILPITAS, Calif. — May 27, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). The Glass Core Substrate Market and Development Trends Report examines the emerging market for glass core substrates, a potential next-generation packaging technology attracting increased attention as AI and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.

“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, Senior Director of Market Intelligence, SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials. This new report helps industry stakeholders understand where glass core substrates may fit in the next phase of packaging technology and what challenges must be addressed to achieve broader adoption.”

The report highlights increasing industry activity and investment around glass core substrates as companies prepare for the next phase of advanced packaging—providing an independent view of the technology’s market potential, development status, key players, and remaining barriers to commercialization. Under the report’s market-development scenarios, initial production could begin around 2028 in selected high-performance applications, with adoption expanding over time across larger and more complex package architectures. Based on the average of its Positive, Base, and Negative scenarios, the report projects a compound annual growth rate (CAGR) of 67.2% from 2028 to 2040. It also maps an increasingly active global development ecosystem, with companies and research organizations across Asia, North America and Europe advancing glass core substrate technologies.

Key topics covered in the report include:

• Market outlook and adoption scenarios for glass core substrates
• Technology drivers and barriers to commercialization
• Expected applications in AI, HPC, advanced processors, co-packaged optics, and image sensors
• Company activities across substrates, glass materials, equipment, processing, inspection, and related supply-chain segments
• Development hubs, consortia, and supply-chain structure
• Forecast scenarios through 2040

The Glass Core Substrate Market and Development Trends report is available in English and Japanese editions through SEMI Market Intelligence. Download the report.

For more information, please visit the Glass Core Substrate Market and Development Trends page or contact the SEMI Market Intelligence Team at mktstats@semi.org.

Taipei, Taiwan – May 27, 2026] Test Research, Inc. (TRI) (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its selection by Wiwynn as a trusted equipment vendor for server board inspection. TRI congratulates Wiwynn on its recent business success and the major expansion of its Tainan manufacturing facility to meet growing global demands.

The collaboration focuses on high-throughput server board manufacturing, a sector requiring the highest levels of quality and defect detection. TRI's advanced inspection solutions ensure high precision and stability for complex server printed circuit board assemblies (PCBAs), optimizing production line yields and minimizing downtime.

Equipped with cutting-edge software and robust mechanical platforms, TRI's smart factory solutions deliver comprehensive inspection coverage tailored for the demanding telecommunication and server industries. This partnership reinforces TRI's commitment to supporting industry leaders with world-class test and inspection technology.

For more information about Wiwynn’s plant expansion, please visit source.

Landmark partnership signals an industry-wide consolidation aimed at building the world's most agile one-stop EMS provider. PCBSync, a fast-growing player in the global printed circuit board (PCB) and electronics manufacturing services (EMS) industry, today announced a strategic partnership with Capital Group to launch a sweeping acquisition campaign targeting premier PCB manufacturing and PCBA assembly companies. The move marks one of the most ambitious consolidation initiatives in the EMS sector to date and is designed to create a vertically integrated, one-stop manufacturing platform for the world's most demanding hardware customers.

Under the partnership, PCBSync and its capital partner will pursue a series of acquisitions across key regions. The newly combined entity will deliver end-to-end services - from rapid-turn PCB fabrication and component sourcing to high-mix, high-complexity PCBA assembly and full system-level integration - all under a single accountable supplier.

"The next generation of AI hardware, humanoid robotics, and intelligent medical devices demands a fundamentally different kind of manufacturing partner - one that can deliver speed, quality, and complexity simultaneously, at scale," said the Chief Executive Officer of PCBSync. "By partnering with Capital Group and bringing premier PCB and PCBA companies into the PCBSync family, we are building exactly that. Our customers will no longer need to coordinate across multiple vendors. They will work with one team, one quality system, and one supply chain."

The acquisition campaign will prioritize PCB manufacturers and PCBA assembly providers with proven capabilities in high-density interconnect (HDI), high-layer-count, and high-reliability boards - the specific technologies required by emerging applications such as edge AI, humanoid robotics, and surgical and diagnostic medical equipment.

A representative from Capital Group added: "PCBSync's vision aligns precisely with where the global hardware market is heading. We see significant long-term value in backing a consolidator that can solve the fragmentation problem in PCB and PCBA supply, particularly for advanced applications where reliability and traceability are non-negotiable."

The partnership reflects a broader industry trend. As AI, robotics, and smart medical devices scale from prototype to mass production, OEMs are increasingly seeking integrated EMS partners that can shorten development cycles, guarantee quality, and provide supply chain resilience. PCBSync's one-stop EMS model is designed to meet this need head-on.

Additional acquisition announcements are expected in the coming weeks.

Prestwick, UK. Etek Europe has been appointed as the official UK representative for SMT Thermal Discoveries, a globally respected German manufacturer of advanced reflow soldering systems with over 35 years of expertise in thermal process technology. The agreement gives Etek Europe’s customers direct access to SMT Thermal Discoveries’ comprehensive range of reflow and vacuum reflow soldering systems, including both standard convection ovens and the company’s industry-leading vacuum platforms, which are widely recognised for delivering void-free solder joints and exceptional process reliability.

The partnership represents a significant addition to Etek Europe‘s growing portfolio of capital equipment for the electronics manufacturing industry, reinforcing the company’s position as a trusted single-source partner for manufacturers seeking best-in-class process solutions across the full SMT line. SMT Thermal Discoveries systems are deployed by manufacturers worldwide and are particularly valued for their energy efficiency, high throughput and advanced process control capabilities, making them well suited to the demands of modern electronics production.

We have been looking for a reflow soldering partner that genuinely raises the bar in terms of process performance, energy efficiency and innovation, and SMT Thermal Discoveries is exactly that. Their systems have a well-earned reputation for precision and reliability, and the addition of their vacuum reflow technology to our portfolio gives our customers access to one of the most capable soldering platforms available today. We are delighted to represent them in the UK and look forward to introducing their technology to our customers,"
 said Bruce Seaton, business development director, Etek Europe.

Featured Systems include the:

SMT R-Series | Convection Reflow Soldering Systems - The SMT R-Series delivers maximum efficiency and high product throughput with consistent soldering quality. An innovative 3:1 heating zone concept enables a process-optimised thermal profile adaptable to a wide range of products without changing temperature settings. Integrated KAT process gas cleaning operates directly within the process area with no additional energy consumption, reducing maintenance requirements and extending service intervals. Intelligent nitrogen control via integrated lambda sensor technology minimises nitrogen consumption while providing real-time residual oxygen measurement for full process traceability.