Press Releases
AUSTIN, TX – In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
TechSearch International examines the growth in advanced packaging for high-performance computing (HPC) and analyzes assembly revenue. AI inferencing and training hardware, including high bandwidth memory (HBM), accounts for the majority of the assembly value. The HPC advanced packaging assembly market is defined as assembly of AI training and inferencing, server, and high-end network switch packages. Assembly revenue for HBM is included. OSAT financials are also highlighted in the report.
A special section of the report analyzes the fan-out panel market by dividing it into standard-density and high-density panels. Applications are presented and market forecasts are provided for both. Company activities are highlighted.
The report includes a section on RF front-end packaging developments in mobile devices with highlights from our teardowns.
The latest Advanced Packaging Update is a 67-page report with full references and an accompanying set of 77 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com
MILWAUKIE, OR – ECD announced today that it has increased production capacity by 100% to accommodate significant order growth for its SmartDRY™ Intelligent Dry Storage portfolio. Over the last four years, the product line has experienced sustained, double-digit year-over-year growth.
Introduced to the market in 2015, SmartDRY quickly became the go-to solution for humidity-controlled storage of moisture-sensitive devices (MSDs) used in electronics assembly. Excessive moisture exposure reduces component floor life and can cause damage during processing if not tightly managed. SmartDRY revolutionized the market with an intuitive platform that delivers J-STD-033 standard-compliant parts access at intervals competitive systems cannot match. The user-friendliness, simple visual status indicators, and effectiveness of SmartDRY earned it several industry awards and propelled it to market-leading status.
ECD Electronics Division Manager Mark Waterman notes the impressive trajectory of SmartDRY, which has enjoyed an excellent reputation in the electronics manufacturing sector and adjacent markets like medical devices and 3D printing. “In its nearly 10-year history, SmartDRY has experienced consistent year-over-year unit shipment growth,” Waterman says. “Based on current volumes and near-term sales projections, investment in dedicated manufacturing space was necessary. The new production area has facilitated improved manufacturing flow and enables us to provide production-critical dry storage technology within relatively short lead times. This expansion will ensure we uphold our customer commitments and continue to proudly make our high-quality systems in the USA.”
The SmartDRY portfolio comprises six models in 10, 30, and 48 cubic-foot capacities. SmartDRY SD-10 is also available in a SmartBAKE version to enable component storage and bake-out in a single unit. For more information, visit SmartDRY - ECD.
WOOSTER, OH – RBB is pleased to announce that we have entered a strategic partnership with LogiSync, LLC. This will help us to expand our existing in-house design capabilities and further strengthen our position in the field of electronics. This deal increases the services we offer our clients. We will use the latest design tools and technology from LogiSync to produce leading-edge, quality designs.
Since 1973, RBB has established a reputation for quality service in the manufacturing industry. A new partnership empowers our design and engineering capabilities to leverage technology expertise and bring innovative design solutions to our clients. LogiSync, established in 1993, is a company that has experience and uses the finest design tools and technologies to contribute to this partnership. Both companies were established in Northeast Ohio and will continue from RBB’s Wooster, Ohio headquarters to serve the region and beyond.
Through this alliance, we offer in-house design, which carries out the design process to improve efficiency and ensure timely delivery with exceptional client results. This also creates closer collaboration with our clients to understand their needs better and efficiently deliver customized design solutions.
The partnership with LogiSync strongly reflects our expanded design development capability. Embracing 31 years of LogiSync technical experience positions us to provide world-class design solutions that set new industry creativity and innovation benchmarks. That is our commitment to excellence and dedication to giving our clients new and sustained product development engineering support.
The alliance is also a win-win for LogiSync and its clients. With RBB’s production and prototype facilities, LogiSync’s engineering has access to more innovative and efficient manufacturing techniques. This contract stands for excellence, strengthening our well-established leadership in this industry while raising new benchmarks for creativity and innovation.
CLINTON, NY – Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
Indium Corporation will showcase the following among its featured products:
- AuLTRA® Fine Wire: AuSn wire for soldering optics in catheter delivery systems, coronary stents and endoscopy applications. This premium, high-quality wire goes through rigorous medical-grade standards and is spooled in a variety of sizes.
- AuLTRA® Preforms: AuSn Preforms for hermetic sealing applications used in catheter, endoscopy, and robotic surgery. These materials offer the highest level of quality needed to deliver the best performance in critical, high-reliability applications.
- AuLTRA® Fine Ribbon: AuSn Ribbon for soldering optics in catheter, endoscopy, and robotic surgery applications. The precision and quality of the ribbon and spooling, combined with long, continuous lengths, are essential for minimizing production downtime and enabling a high-throughput process, resulting in a high-quality end product with a low cost of ownership.
To learn more about Indium Corporation’s precision Au-based preforms, visit askindium.com/aultra-medipro and visit our experts at booth #1138 at the show.
TOKYO – Using silicon photonics technology for semiconductor optical circuits, OKI (TOKYO: 6703) has successfully developed an ultracompact photonic integrated circuit chip with a broad range of potential applications, including optical fiber sensors, laser vibrometers, and optical biosensors. This makes it possible to achieve ultra-miniaturization and low power consumption similar to LSI, as well as dramatically lower costs through mass production of optical sensor modules. Optical sensors are a technology that uses optical fibers and optical waveguides with low light loss to detect, process, and transmit physical phenomena such as vibration, strain, and temperature in the form of light, and are themselves a green technology that realizes sensing while saving energy. Silicon photonics technology is a technology that can broaden the scope of applications for optical sensors previously limited to localized use, and is expected to make a significant contribution to the advancement of GX.
To address various issues faced by modern society, such as aging social infrastructure, labor shortages, environmental problems, and extending healthy lifespans, high-precision sensor technology and network technology capable of seamlessly collecting vast amounts of sensor data are required. While high-precision optical sensors that take advantage of the property of light, i.e., low energy loss, are one effective technology to realize the above, their large size and high cost have limited their applications to a few areas such as research and large-scale infrastructures.
OKI has engaged in research and development on silicon photonics technology over many years, centered on optical transceivers, with the scope of this research still currently expanding to include various optical sensors. Silicon photonics technology is a technology that integrates complex optical circuits—previously realized by wiring individual optical components with optical fibers—on a silicon substrate using semiconductor microfabrication technology. It makes use of the same manufacturing methods as LSI, which is vital for computers, enabling miniaturization, energy saving, and cost reduction through mass production. Devices that were previously large, heavy, and cumbersome can now be downsized to dimensions comparable to a smartphone or tablet, greatly expanding the scope of optical sensor applications.
In November 2023, OKI announced its technology strategy through to 2031, which is aimed at bringing the Edge Platform to reality. The Edge Platform is a technology concept to expand the value provided through edge advancement and data connection and linkage based on OKI’s core competence of “robustness,” which has supported social infrastructures. The technology strategy includes bolstering optical sensing technology across a wide range of areas, from social infrastructure monitoring to the medical field. The development of this photonic integrated circuit chip is based on this technology strategy and is the result of fully capitalizing on silicon photonics technology.
“Based on silicon photonics technology, OKI will continue to scale up photonic integrated circuits incorporating semiconductor materials other than silicon as light sources and promote photonics-electronics convergence to expand into ever more diverse fields,” commented Executive Officer Kurato Maeno, who also serves as Chief Technology Officer and Head of Technology Division. “Ultimately, OKI aims to realize a universal integrated circuit chip that enables the programmable implementation of various functions on a single chip and make the most of this as the core of its green technology.”
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Silicon Valley Expo & Tech Forum on December 5th, or visit www.aimsolder.com
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum