WASHINGTON D.C. — August 9, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the signing of the CHIPS and Science Act of 2022 by U.S. President Joe Biden. The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to chip manufacturers as well as semiconductor equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“The CHIPS and Science Act secures landmark investments to bolster semiconductor manufacturing and R&D infrastructure as well as a wide range of ancillary industries in the United States,” said Ajit Manocha, SEMI president and CEO, who attended the signing ceremony. “We thank President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction for their support in enacting the investment tax credit and funding for CHIPS Act programs.”

“SEMI looks forward to continuing collaboration with the U.S. government and our member companies to ensure timely implementation of these programs to strengthen the U.S. semiconductor supply chain,” said Manocha. “The CHIPS and Science Act funding will also be instrumental in buttressing the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program and related programs in order to drive chip industry innovations that will better the lives of people around the world.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Irvine, CA and Nijmegen, the Netherlands – Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s thermal high-performance packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner for innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride and silicon carbide power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

For more information, visit www.henkel-adhesives.com/electronics and www.citc.org.

Cohoes, NY – August 2022 – PVA, a global supplier of automated dispensing and coating equipment, today announced plans to exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Wednesday, Aug. 24, 2022 at the Best Western Plus Strongsville in Ohio. The company will discuss its Valve Tool Changer and 5th Axis Tilt feature.

Regional Sales Manager, Chris Donham will be available to answer questions about coating and dispensing, as well as other application solutions in the PVA line-up such as coating inspection, optical bonding and curing ovens.

PVA’s new Valve Tool Changer feature increases the number of applications each machine can satisfy without sacrificing valuable work area. The Tool Changer can accommodate four additional valves in the machine that can be automatically picked up and used at any time.

The 5th Axis Tilt feature is a motorized programmable tilt that can be configured to adjust to any angle between -50 degrees to 50 degrees. This flexibility allows greater part accessibility for more accurate dispense and spray processes.

PVA is a world-class innovator of high quality, repeatable dispensing and conformal coating systems. The company manufactures turnkey solutions that help customers improve their competitiveness, such as coating inspection, optical bonding and curing ovens.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

New Paris, Indiana -- KMC Controls, a specialist in building automation and controls, has invested in a new Ersa Versaflow 335 selective soldering machine.

"The new selective solder machine will increase the accuracy of making solder connections while reducing the amount of time, energy and materials it takes to produce high-quality circuit boards," said Mitch Kehler, CEO of KMC Controls. "That translates into an improved capacity to fulfill orders and keep our commitments to customers.

"In the short term, the new soldering system will help us fill existing orders delayed by global supply chain issues, Kehler continued. In the long term, the SSM will help us return to the Just-in-Time manufacturing KMC Controls is known for."

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com