PEORIA, AZ – HyRel Technologies , a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.

This year’s intern class includes Lily Neal, Kaylee Browning, and Veronica Macke—each bringing unique strengths, ambition, and creativity to the HyRel team. From SolidWorks design and 3D printing to accounting and machine component innovation, these interns represent the future of engineering and tech talent.

“What we’re seeing is the result of creating the right environment,” said Brian Watson, Founder, HyRel Technologies. “We’re incredibly proud of our interns—this program is not just about introducing them to careers; it’s about watching them grow into young professionals who already rival early-career engineers.”

Lily Neal began her internship in October 2024, focusing on accounting. What started as a learning opportunity quickly turned into a permanent role at HyRel, where she now balances bookkeeping responsibilities and hands-on work with taping parts. Lily credits HyRel’s supportive culture and flexible scheduling for helping her manage the demands of her senior year while gaining valuable experience.

She plans to pursue a degree in accounting at Arizona State University and continue working with the team that helped launch her career. Kaylee Browning has proven herself as a rising engineering talent. She’s led the design of the base platform for HyRel’s upcoming VersaCell system, producing work that closely aligned with the company’s mechanical engineering team. She’s tackled complex SolidWorks projects, including designing a custom machine cover for a fluxer using unfamiliar components like gas struts and quarter-turn fasteners—skills she mastered through independent research and problem-solving.

Veronica Macke, an aspiring mechanical engineer, has hit the ground running. She’s already gained hands-on experience in 3D printing and manufacturing tray design for HyRel’s assembly process. Veronica values HyRel’s strong mentorship culture and plans to study Mechanical Engineering at Northern Arizona University, where she will also participate in the Air Force ROTC program. “HyRel is my first stepping stone to a great career,” she shared. “I will be forever grateful for the experience.”

What makes this year’s class even more special is the organic connection to HyRel’s extended family: some of the interns are friends of former HyRel high school interns now pursuing engineering degrees at ASU—proof that the program is building not only skills but a powerful pipeline of young talent.

Adding to this momentum, HyRel recently secured a paid engineering internship through ASU’s Blackstone LaunchPad program, further expanding opportunities for college students and reinforcing the company’s dedication to real-world learning. HyRel is dedicated to not only advancing its business but also to fostering the growth and potential of individuals who will shape the future of the semiconductor industry. For more information about HyRel’s innovative internship program and its dedication to community engagement, visit www.HyRel.tech .

About HyRel Technologies

HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HyRel provides robotic hot solder component tinning, component solder ball removal and replacement, component tape and reel packaging services and component bake and dry pack services to customers worldwide. HyRel is also developing proprietary micorobotic innovations to elevate the speed, reliability, and safety of standard semiconductor processes. For more information about HyRel Technologies, please visit www.HyRel.tech .

ROLLING MEADOWS, IL – BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

BEST’s EZReball™ is a reballing preform that consists of an array of solder spheres positioned with a high-temperature polyimide stencil and an adhesive-backed carrier to hold the solder balls in their precise location. These preforms can be made quickly without tooling charges in almost any possible array pattern, including various solder alloys, lead pitches, and ball diameters.

Our EZReball™ preforms are simple and easy-to-use for reballing BGAs. BEST’s EZReball preforms are manufactured from a specialty high temperature-rated film which aligns the balls with the corresponding array. The preforms are cut using a precision laser to meet exacting device requirements. Solder balls are captured and retained by the preform and are aligned to the prepped BGA device and reflowed. After reflowing the preform is simply peeled away. EZReball™ performs can be used on the smallest pitch CSPs and BGAs with pitches down to 0.35mm and ball sizes down to 6 mils.

A significant benefit of the EZReball™ process is that the reballing preforms will accurately place a new array of solder balls relying on simple physical properties rather than requiring operator dexterity or skill. With other reballing methods that use loose solder spheres you can typically process only one component at a time.

Using the EZReball™ preforms, you can process several parts at the same time with only a few minutes of labor. Based on time studies of reballing 10 or more devices, EZReball™ method has shown to be 30% faster than other reballing methods using metal stencils. EZReball™ is in full compliance with the IPC 7711/21 Procedure 5.7.6. for BGA rework processes as one of the methods for reballing a BGA and allows for better yields and faster reballing times.

About BEST Inc.

BEST Inc. is an ISO 9001:2015 and ITAR certified provider of BGA reballing, PCB and component rework services, focusing on quality, reliability, and sustainability. With a commitment to innovation, and customer satisfaction, we leverage advanced technologies to deliver comprehensive solutions for the electronics industry.

ATLANTA – In response to ECIA members and industry stakeholders, the Association’s Global Industry Practices Committee (GIPC) has established a working group to facilitate information sharing and impact mitigation strategies around tariff operations. This group will address process and strategic concerns including:

• Methods and strategies for handling tariff charges.
• Understanding different government regulatory frameworks, e.g. Section 301a and IEEPA.
• Details about Free Trade Zones (FTZ) and the benefits of creating one
• Improving the duty drawback process.
• Effectively communicating tariff charges.
• Addressing unique tariff challenges presented on supplier returns.

“We have spent the past few weeks collecting and digesting the input from our members about the most impactful areas where we can help member companies prepare for and adjust to new tariff realities,” commented Christine Wolnik, ECIA’s Vice President of Industry Practices. “At a breakout session during the ECIA Joint Council and GIPC meetings in Phoenix

and then at a subsequent all member webinar, we listened and took notes and then began recruiting experts to address this industry challenge.”

The Tariff Working Group will publish guidance documents, conduct webinars, and meet with commerce department officials as needed to confront the challenges as they arise while the administration’s trade policy changes are implemented.

Companies tentatively committed to these efforts include Arrow Electronics, Avnet, Digikey Electronics, Hirose Electric, Marsh Electronics, Master Electronics, Microchip, Molex, Onsemi, PUI Audio, Taiwan Semiconductor, TE Connectivity, TTI, Vishay, Waldom Electronics, World Micro and WPG Americas.

For more information about the GIPC and ECIA membership, visit www.ecianow.org.

About ECIA

The Electronic Components Industry Association (ECIA) is made up of the leading electronic component manufacturers, their independent manufacturer representatives and authorized distributors. ECIA members share a common goal of promoting and improving the business environment for the authorized sale of electronic components. Comprised of a broad array of leaders and professionals representing all phases of the electronics components supply chain, ECIA is where business optimization, product authentication and industry advocacy come together. ECIA members develop industry guidelines and technical standards, as well as generate critical business intelligence. For more information, visit www.ecianow.org or call 678-393-9990.

HUTTO, TX – ViTrox Americas Inc. is proud to announce a significant update to its ViTrox Demo Center (VDC) in Hutto, Texas. The upgraded VDC now features the latest ViTrox inspection technologies, software solutions, and advanced automation tools to support real-world testing, application engineering, and hands-on customer experiences.

The enhanced Demo Center now showcases ViTrox’s newest Smart Inspection Solutions, including the VisionXpert XS/XC Series. The XC Series delivers state-of-the-art smart camera inspection capabilities, while the XS Series offers high-speed smart code reading and barcode scanning (1D/2D), enabling rapid, reliable traceability in demanding manufacturing environments.

A major highlight of the update is the addition of ViTrox’s new generation 3D AOI solutions. The V510i 3D SEMI AOI, with 8μm resolution, supports mirrored and reflective surface inspection as well as 0201mm/008004 micro component inspection. Also added is the V510i 3D MicroAOI, offering ultra-high 2.25μm resolution for wire bond and die inspection applications. These systems provide unmatched accuracy for microelectronics and semiconductor-level assemblies.

To support top and bottom side inspection requirements, the V510i DST delivers comprehensive dual- side 3D AOI capability. Meanwhile, the V510R integrates inline robotics for 3D side imaging, high-volume conformal coating inspection, and thickness measurement, extending ViTrox’s automated visual inspection leadership.

On the ARV (Advanced Robotic Vision) front, ViTrox introduces the V9i XL, a large-format platform (840mm x 620mm) ideal for post-selective/wave solder inspection, conformal coating inspection, and final/box build assembly verification. Complementing this is the V97i, which features an integrated flipper conveyor for efficient double-sided PCB inspection after soldering and during final assembly stages.

These additions build on a strong existing foundation that includes the V310i 3D SPI, V510i 3D SMT AOI, V810i S2 EX AXI, and V9i ARV for final and coating inspection. Together, they form a comprehensive line-up supporting end-to-end quality assurance across SMT, semiconductor, and box build applications.

In addition to hardware, the VDC has also upgraded its software solutions at the demo center to provide users with powerful analytics and offline programming capabilities. The new lineup includes the VVTS Online Review Solution, V One SPC &Utilization Software, V-Library Program & Recipe Solution, and V-OLP Offline Programming Solution, enhancing traceability, yield optimization, and process efficiency.

“With this expansion, the ViTrox Demo Center now represents one of the most advanced inspection technology hubs in the region,” said Sy Creed, Business Development Director, ViTrox Americas. “It gives customers firsthand access to our newest solutions, expert application support, and real-time demonstrations designed to address their unique production challenges.”

Customers, partners, and industry professionals are encouraged to schedule visits or virtual tours to experience the expanded capabilities of the VDC and explore how ViTrox’s intelligent inspection systems can elevate their operations.

For more information about, visit www.vitrox.com.