MUNICH – March 2025 – Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is pleased to announce plans to exhibit at the 2025 IPC APEX EXPO, taking place March 18-20 at the Anaheim Convention Center in Anaheim, CA. Luminovo will introduce their AI-powered software platform designed for the electronics supply chain in Booth #4515. Their platform automates workflows, enhances decision-making, and streamlines quoting and procurement, setting a new benchmark for efficiency in electronics manufacturing.

With a full focus on the U.S. electronics industry, Luminovo is bringing its innovative collaborative supply chain platform to manufacturers, EMS providers, and distributors across North America. By eliminating inefficiencies, automating critical processes, and bridging data silos, Luminovo empowers companies to make faster, smarter decisions in procurement and production.

“We are excited to return to the 2025 IPC APEX EXPO and bring our AI-driven supply chain solutions to the U.S. market,” said Matthew Rosenberg Joins Luminovo, Sales Lead – North America at Luminovo. “With our AI-powered software platform, we are taking a bold step toward the future of electronics manufacturing, enabling companies to operate more efficiently and competitively.”

Visitors can stop by Booth #4515 to experience live demos, gain insights from Luminovo’s experts, and explore how AI-powered solutions can redefine supply chain management.

For more information about Luminovo and its solutions, visit www.luminovo.com.

About Luminovo

Luminovo is a leading SaaS company building the platform for the electronics supply chain. Designed to streamline monitoring, quoting, and procurement processes, Luminovo’s software enables supply chain collaboration by connecting EMS providers, distributors, suppliers, PCB manufacturers, and ERP systems. By breaking down data silos and automating critical workflows, Luminovo helps electronics companies reduce costs, improve efficiency, and accelerate time-to-market.

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.

Indium Corporation will showcase among its featured products:

Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.

Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.

Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications. CW-818 is a halide-free, no-clean cored wire with spatter control technology that provides fast wetting speeds to minimize cycle times in manual and robotic soldering processes.

To learn more about Indium Corporation’s high-reliability solder technology, visit www.indium.com or visit our experts at IPC APEX EXPO booth #1416.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. 

Akrometrix LLC – Atlanta, Ga - The global leader in Thermal Warpage Metrology, announces financial results for the full year 2024. "We are pleased to report outstanding performance in both Engineering Development and Global Sales for the full year, again resulting in all-time record Revenue," said Neil Hubble, President of Akrometrix. "We are well positioned to continue our growth trajectory in 2025, which is reflected in our financial guidance for double digit revenue growth. Our team's unwavering customer-first mindset continues to flourish as we grow our portfolio of products to meet our customers' needs.”

For more information about Akrometrix, email equipmentsales@akrometrix.com or go to www.akrometrix.com.

Minneapolis, Minnesota — February 2025 – Nordson Test & Inspection today announced plans to unveil advanced technology at IPC APEX Expo, scheduled to take place March 18-20th in Anaheim at booth #3200. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems, plus the advanced Nordson Intelligence ecosystem.

Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.

The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, advanced SMT, socket metrology, memory, mini/microLED, 008004/0201 solder paste and other next-generation applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions that are common with shiny components and specular surfaces. The SQ7000+ inspects for defects and measures critical parameters with a comprehensive coordinate measurement software suite.

The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities. The sensor provides 2D and 3D height measurements for high resolution inspection of various packaging such as wire bonds, including loop height measurement and related applications.

Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for Automated X-Ray Inspection (AXI) systems that reveals incredible details, significantly enhanced data quality, and clear layer separation with 3D reconstruction algorithms. The performance is significantly advanced with a larger field of view and an accelerated image acquisition that is 2X faster than Planar CT.

Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor and SMT applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revalution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.

Nordson’s superior lab-based Acoustic Micro-Imaging Inspection (AMI) system, the D9650™is powered by C-SAM® and designed with high-accuracy and maximum flexibility. The system is ideal for failure analysis, process development, material characterization and low volume production inspection for back-end semiconductor and SMT applications.

Visitors to the Nordson TEST & INSPECTION booth at APEX can see demonstration of the latest inspection and metrology solutions that improve yields, process and productivity.

For more information, visit www.nordson.com/testinspect.

About Nordson TEST & INSPECTION

Nordson TEST & INSPECTION, a global leader in Inspection and Metrology Solutions, offers its SMT & Semiconductor customers a broad, differentiated portfolio of Acoustic, Optical and both Manual and Automated X-ray Inspection systems, X-ray Component Counting systems and Semiconductor measurement sensors. Nordson TEST & INSPECTION is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.

About Nordson

Nordson Corporation (Nasdaq: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.