WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Amkor. The incentives, which are part of the CHIPS and Science Act, will support Amkor’s advanced packaging operations in Arizona. The Commerce Department previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.

“Today’s Amkor announcement will strengthen U.S.-based advanced packaging operations—a critical step in the chip production process—while further expanding Arizona’s booming semiconductor ecosystem and bringing more jobs and economic growth to the state. We commend Amkor for investing ambitiously in U.S.-based advanced packaging, which is an area that needs to be strengthened in the U.S. chip ecosystem, and we salute the U.S. Commerce Department for continuing to make impressive headway in getting CHIPS Act incentives out the door in a timely and effective manner. We look forward to continuing to work with leaders in government and industry to ensure the CHIPS Act delivers maximum benefits for America’s economic strength, national security, and supply chain resilience.”

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032, ranking second only to Taiwan (31%).

SINGAPORE – ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools.

Chiplets deconstruct SOCs into their composite parts, creating smaller chips that can then be packaged together to operate as a single system, to provide potential benefits that can include improved energy efficiency, faster system development cycle time, and reduced costs. However, packaging advances are needed to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in AI computing.

This latest agreement builds on an existing collaboration between ASMPT and IBM, resulting last year in the debut of a new hybrid bonding approach* that optimizes bonding quality between two chiplets. Now, they will continue to work together on the development of bonding technologies for chiplet packages.

“IBM has been at the forefront of developing advanced packaging technology for the age of AI,” said Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, IBM Research. “We are proud to continue our work with ASMPT to advance chiplet packaging technology to pave the way for smaller, more powerful, and more energy efficient chips.”

“We are excited to build on our strong relationship with IBM to drive the frontiers of Advanced Packaging in tandem with accelerating innovations in artificial intelligence,” said Lim Choon Khoon, Senior Vice President, ASMPT. “We are pleased to work with IBM to advance next generation packaging and Heterogeneous Integration solutions for the AI era.”

AUBURN HILLS, MI – The Murray Percival Company, the premier manufacturer’s rep in the Midwest and one of the longest tenured distributors in the electronics industry, is pleased to announce its new partnership with BIMOS ESD seating. The Murray Percival Company will now represent BIMOS ESD seating solutions across Michigan, Ohio, Indiana, Kentucky, Illinois, Wisconsin, and Western Pennsylvania, enhancing their comprehensive product offerings.

BIMOS, renowned for its innovative and ergonomic seating solutions, designs chairs that prioritize comfort, durability, and safety, specifically tailored for laboratory and production environments. These high-quality seats are crafted to meet the stringent requirements of ESD (Electrostatic Discharge) protection, ensuring both employee well-being and the safeguarding of sensitive electronic components.

“We are thrilled to bring BIMOS ESD seating to our customers in the Midwest,” said Murray Percival III, Sales Manager at the Murray Percival Company. “The quality and ergonomic design of these seats are unparalleled in the market. BIMOS products not only enhance workplace safety and comfort but also contribute significantly to productivity and employee satisfaction. We believe they are the best on the market, and we are excited to provide such high-caliber solutions to our clients.”

The Murray Percival Company has always been dedicated to offering top-tier products and personalized support to its customers. With the addition of BIMOS ESD seating, they continue to demonstrate their commitment to improving workplace efficiency and safety. Customers can expect the same legendary service and expert guidance that the Murray Percival Company is known for, now complemented by the superior quality of BIMOS seating solutions.

This new representation signifies a strategic step for the Murray Percival Company, reinforcing their mission to provide the best possible solutions to their customers and staying at the forefront of industry innovations.

For further inquiries or to explore how The Murray Percival Company can address your PCB supply needs, please visit www.murraypercival.com 

NUEVO LEON, MEXICO – Selectronic Assembly is pleased to announce the appointment of Eliud Herrera as the new Production Manager. With a robust background in production management and a proven track record of driving efficiency and quality, Herrera brings a wealth of experience to his new role.

An accomplished professional with extensive expertise in various aspects of manufacturing and production, Herrera joins Selectronic Assembly with an impressive resume. His expertise spans across multiple areas, including the implementation of preventive maintenance plans, TPM (Total Productive Maintenance), and the development of internal operating documents.

In his previous role, Herrera successfully led a team of engineers and operators, establishing procedures and work instructions, and making fixtures for new product launches. Prior to that, he developed a track record for contributing significantly to process improvements and troubleshooting, showcasing his capability in handling SMT processes, wave solder processes, and conformal coating processes.

Herrera’s dedication to continuous improvement and his ability to manage complex manufacturing environments make him an invaluable addition to the Selectronic Assembly team. His leadership skills, coupled with his technical knowledge, will be instrumental in driving the company's production capabilities to new heights.

Selectronic Assembly is confident that Eliud Herrera will play a pivotal role in enhancing production efficiency, ensuring quality, and leading the company towards achieving its strategic goals.