SUWANEE, GA – With its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.

At its Booth 1436 in the Anaheim Convention Center, global player ASMPT will once again demonstrate that it covers almost the entire SMT production chain with its products and services and functions as a trendsetter for the industry. At this year’s IPC APEX EXPO, ASMPT will present its holistic hardware and software innovations for electronics manufacturers that range from the machine and line level to the factory and enterprise levels. Of particular importance will be the company’s Intelligent Factory concept with its holistic approach to integrative data analysis and usage that covers the entire factory and reaches across production locations. It optimizes processes, minimizes errors, improves material flows and deploys employees based on their qualifications in a highly effective manner – all while never losing sight of maximizing the return on investment.

Greater yields with existing production equipment

“Thanks to interfaces such as IPC-2591 CFX, you can now combine data from ASMPT machines and third-party systems and use it for in-depth analyses and improvements,” explains Mark Ogden, Marketing Manager Americas at ASMPT. “If you consistently implement the Intelligent Factory principle, you will quickly realize that you can get more out of your existing production equipment with this holistic, data-driven strategy: more productivity, more quality and greater yields. Interested visitors can find out from the experts at our booth what this looks like in practice.”

A complete production line

ASMPT will present a complete SMT production line at the IPC APEX EXPO 2024. It starts with a DEK TQ solder paste printer, whose output will be checked and automatically improved, if necessary, by a Process Lens SPI system. They will be followed by the highly flexible SIPLACE SX and the high-speed SIPLACE TX placement platforms. The machines will be complemented by a new, automated paste transfer system and equally new quick-change squeegees for solder paste printing, the high-precision TWIN pick-and-place head for the end-of-line placement of large, heavy components and special designs, as well as measuring devices for placement forces and electrical properties that can be easily added thanks to their standard feeder formats.

Software that adds real value

In the software area, ASMPT’s WORKS Software Suite plays an important role for all workflows on the SMT shop floor with applications such as WORKS Logistics for material flow optimization, WORKS Operations for effective personnel deployment across multiple lines, WORKS Monitoring for keeping track of important production parameters, and WORKS Optimization for quality optimization along the entire SMT line, which integrates SPI and AOI systems regardless of manufacturer. Other interesting components in ASMPT’s software portfolio include SMT Analytics for process analysis and optimization, Factory Equipment Center for production-wide asset and maintenance management, and the AI and NLP-based Virtual Assist, the personal assistant that engineers and technicians can access via their smartphones.

Visitors will also be able to learn about the training offerings of the ASMPT Academy as well as the modern MES from ASMPT’s software subsidiary Critical Manufacturing that was designed especially for the needs of the electronics manufacturing industry. “A visit to the ASMPT booth is always worthwhile,” says Ogden. “Here, visitors can experience live and in person how ASMPT hardware and software work together, how the Intelligent Factory combines standalone operations into an integrative whole, how SMT manufacturers can meet the ever-growing requirements of the global market, and how they can implement the Intelligent Factory step-by-step in their companies.”

CLINTON, NY – Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.

Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

“By demonstrating Indium Corporation products on live equipment at IPC APEX, attendees get an accurate and honest depiction of the material’s performance,” said Product Development Specialist Miloš Lazić. “The program is a great embodiment of Indium Corporation’s motto, ‘From One Engineer to Another®’, and we are tremendously proud of it.”

This year’s program will highlight Indium Corporation materials, including:

• CW-807 – electronics soldering cored wire
• CW-818 – no-clean, high-reliability flux-cored wire
• FP-500 – no-clean flux pen
• Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
• Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
• Indium12.8HF – jetting and microdispensing solder paste
• PicoShot® – jetting paste series with exceptional jetting performance
• Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
• TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)

You can see these products at the following partner booths:

• AIR-VAC Engineering (booth #2120)
• Apollo Seiko (booth #1408)
• Essemtec (booth #2409)
• Finetech (booth #4209)
• GPD Global (booth #1504)
• Hakko USA (booth #2600)
• ITW EAE (booth #2327)
• JBC Tools (booth #3642)
• Juki Automation Systems (booth #714)
• Koh Young Technology (booth #2112)
• KYZEN (booth #4237)
• MicroCare (booth #1812)
• Mycronic (booth #742)
• Nano Dimension (booth #2409)
• NSW Automation (booth #3523)
• Panasonic Connect (booth #2332)
• PARMI USA (booth #4036)
• Pillarhouse USA (booth #733)
• PVA (booth #2042)
• Smart Sonic (booth #3906)
• Thermaltronics USA (booth #1003)
• Trans-Tec America (booth #2825)
• Universal Instruments Corporation (booth #2405)
• VERMES Microdispensing - (booth #2814)
• Yamaha Motor Corporation (booth #2820)
• ZESTRON Corporation (booth #3620)

If you see an Indium Corporation product running in a booth, be sure to use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Lazić at mlazic@indium.com 

MORRISVILLE, NC – Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.

As the industry evolves with new applications and architectures, complexity in design and manufacturing and the supporting infrastructures (e.g., metrology, standards, etc.) will be challenging. iNEMI and IPC have recently published a white paper, “Complex Integrated Systems: The Future of Electronics Manufacturing,” intended to guide and focus cross-industry efforts and partnerships in the necessary research and development, as well as the manufacturing capability scale-up, that will be critical to success.

The paper explores several issues, including:

• Sample use-case applications needing CIS, such as:
  • Massive wireless broadband with 5G mmWave systems
  • High-performance computing applications in mobile equipment and data centers
  • XR (extended reality) devices, including augmented reality (AR) virtual reality (VR) and mixed reality (MR)
  • Advanced driver assistance systems for passenger vehicles
  • Integrated photonics
• The CIS manufacturing ecosystem and the challenges of shifting roles within that ecosystem
• The impact on the complete product life cycle, including design, test, manufacturing and end of life
• Roadmap of technical needs along with gaps, challenges and potential solutions
• Recommendations and calls to action

“CIS is driven by fast-growing market segments such as 5G mmWave communications, advanced assisted driving systems, and virtual and augmented reality,” said Grace O’Malley, iNEMI chief technology officer. “Electronics manufacturing is already investing tens of billions of dollars annually into manufacturing capabilities for CIS. This white paper grapples with the big technology issues that the industry should collectively address to ensure an adaptive, profitable CIS manufacturing ecosystem.”

“It’s great that INEMI and IPC were able to collaborate on such an important topic as complex integrated systems,” said Matt Kelly, IPC chief technology officer and vice president, technology solutions. “The concept of CIS is important to understand. It is an integral part of a 'silicon to systems’ approach that is needed for next-generation electronic products spanning HPC, AI, 5G/6G wireless, and EV automotive electronic applications.”

"Complex Integrated Systems: The Future of Electronics Manufacturing is now available. Visit https://go.ipc.org/complexintegratedsystems to download the white paper.

HANOVER, GERMANY – With excitement mounting for the IPC APEX Expo 2024 in Anaheim, California, Viscom is readying to unveil revolutionary innovations crafted specifically for the discerning audience of electronics manufacturing professionals. Immerse yourself in the forefront of electronics manufacturing advancements by joining us at Booth No. 2828 from April 9th – 11th, 2024, where our team of industry-leading experts will share invaluable insights and demonstrate the latest in inspection technology.

Experience the Future of Inspection:

Viscom is proud to unveil its latest marvel at the IPC APEX – the iX7059 One, a cutting-edge 3D X-ray inspection system designed to revolutionize defect detection with unparalleled precision. Witness firsthand how this state-of-the-art system ensures 100% defect detection, setting a new standard in quality assurance.

Revolutionizing AOI Solutions:

Discover our suite of innovative AOI solutions engineered to optimize cycle times and achieve maximum inspection depth. In today’s dynamic electronics manufacturing landscape, automatic optical inspection (3D AOI) is indispensable for maintaining impeccable quality standards. Viscom's AOI systems stand out with superior 3D capabilities and advanced software attributes, delivering unmatched accuracy and exceptional image quality.

Unlock the Power of AI and Software:

Explore our new AI and software solutions, including vAI – a suite of three robust AI solutions meticulously crafted to enhance manufacturing and quality control processes. From NPI to AI-supported image processing and AI-based verification, Viscom empowers you to elevate machine productivity and streamline operations. Immerse yourself in efficiency with vVision 4.0, our groundbreaking software update that seamlessly merges innovation with productivity. Don't miss out on our multipurpose platform, vConnect, featuring the all-new Statistical Process Control solution: vSPC 2.0, designed to optimize performance and drive continuous improvement.

Unrivaled Inspection Portfolio:

In addition, delve into Viscom's extensive range of inspection systems, spanning 3D AOI inspection, 3D X-ray inspection, 3D solder paste inspection, conformal coating inspection, and 3D wire bond inspection. With Viscom, you're not just keeping pace with industry standards – you're setting them.

Join us at IPC APEX Expo 2024 and embark on a journey into the future of electronics manufacturing. Elevate your expertise with Viscom – where innovation meets excellence.