Press Releases
PHELPS, NY – Z-AXIS, a fast-growing provider of electronic design and manufacturing services, is the first company on the U.S. East Coast to install Mycronic MYPro series A40DX™ pick-and-place machines for PCB assembly. Mycronic, a world-leading provider of electronics manufacturing equipment, credits Z-AXIS’ co-owner and president, Michael Allen, for his continuing commitment to innovation. Z-AXIS now operates seven Mycronic machines and has two additional units on order. The company is in the second phase of a $1.5 million expansion.
“Michael Allen is always innovative,” said Liz Morrill, Mycronic’s Regional Sales Manager for the Eastern United States and Canada. “We’ve had a 25-year relationship with Z-AXIS, and Michael is always one of the first to adopt our latest technologies. In fact, Z-AXIS is one of the largest users of Mycronic equipment in the commercial industry.”
Mycronic MYPro A40DX™ pick-and-place machines are designed to help electronics manufacturers speed high-mix PCB assembly in medium to higher volumes. With a top speed of 59,000 components per hour (CPH), these new machines include high-speed mount heads and support on-the-fly changeovers. Mycronic MYPro A40DX™ equipment can also pick-and-place larger and longer components while speeding workflows thanks to an easy-to-use touchscreen interface. These modular units can achieve 48% faster top placement speeds while supporting full traceability.
Z-AXIS learned about this new equipment from Mycronic and then saw it in-person at IPC APEX Expo in Anaheim, California in April. Under Michael Allen’s leadership, Z-AXIS has also invested in MYTower 6x component storage systems and a MYPro S30™ Stencil Printer since this industry-leading tradeshow. MYTower technology puts generous but flexible storage in a compact design with rotating columns, enabling the storage of nearly 2,000 reels (8 mm). The MYPro S30 stencil printer features an advanced vision system for complete alignment between the stencil and PCB and a climate control system that maintains the physical qualities of solder paste for consistent print quality.
“Z-AXIS is committed to continuous improvement and innovation,” said Michael Allen. “As we continue our most recent expansion, we’re confident that the investments we’re making in the latest equipment will help us continue to become more efficient as we grow.”
MILLEDGEVILLE, GA – TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428. The exhibit will include leading TopLine products including CCGA, Superconducting Solder Column, Bonding wire, IC Chip Tray, Zero-Ohm Jumper and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice.
TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. For more information, visit Booth B4.428 at Electronica.
Electronica is the world's leading trade fair and conference for electronics, produced every 2 years since 1964 by Messe München.
Chelmsford, MA – VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is excited to announce its expansion into India with the addition of Ganesh Shettigar to its sales team. Ganesh joins VJ Group in India with 25 years of experience in the electronics industry and will promote and sell VJ Electronix as well as VJ Technologies solutions. He will be based in Bangalore and responsible for managing VJ Electronix’s distribution network and direct sales efforts across India.
With a deep background in the sales of SMT equipment, SMT processes and services, Ganesh’s expertise will be instrumental in growing VJ Electronix’s customer base and addressing the unique challenges of the Indian market. His technical knowledge, combined with his ability to build and maintain long-term customer relationships, positions him to drive VJ Electronix’s success in the region.
“Ganesh’s extensive experience in the electronics industry, particularly in providing technical solutions, makes him an ideal fit for our team,” said David Hamel, Director of Global Sales and Marketing at VJ Electronix. “His understanding of the technology behind our machines and his proven sales skills will enable him to offer tailored solutions to our customers in India.”
In his new role, Ganesh will focus on developing a strong customer base, managing challenging accounts, and providing both technical and sales support. His hands-on experience with advanced electronics manufacturing technologies will play a key role in VJ Electronix’s continued growth and ability to meet the evolving needs of the Indian market.
For more information about VJ Electronix and its range of rework technologies, X-ray inspection systems and component counting solutions, visit www.vjelectronix.com
AUSTIN, TX – Austin American Technology (AAT) is excited to announce the newest addition to its service team, Dustan Carr. With extensive experience as a field service technician, Carr will play a key role in supporting AAT's ongoing growth and further enhancing the company’s exceptional customer service.
Carr is a veteran of the United States Marine Corps, bringing with him a dedication, mindset and work ethic honed through military service. His expertise in customer service, service automation, quality assurance and maintenance planning will strengthen AAT's ability to provide top-tier service to its customers. Carr is currently undergoing comprehensive training and will soon be independently handling service, maintenance and equipment startups for both the AAT and Aqua Klean Systems (AKS) brands.
“We are pleased to add Dustan to our superior service team to assist us in our unprecedented growth," said Todd Rountree, CEO of Austin American Technology. "Dustan’s experience and work ethic are invaluable to our organization, and we look forward to the positive impact he will bring to both our team and our customers."
As AAT continues to expand, the addition of highly skilled professionals like Carr ensures the company can maintain and exceed its high standards of service and customer support.
For more information about Austin American Technology, please visit www.aat-corp.com
NEUSS, GERMANY – Yamaha Motor Robotics FA Section showcased new collaborations with system integrators at Motek 2024 in Stuttgart, automating industrial processes across the production lifecycle including assembly, sorting, and testing.
“We continue to grow our portfolio of projects that embed Yamaha robots to provide fast and repeatable picking and placing or lifting and moving, with highly accurate positioning,” said Tatsuro Katakura, FA Sales Manager, Yamaha Motor Europe Robotics Business, Factory Automation Section. “These examples show how we can help companies serving sectors such as consumer electronics, automotive components, textiles, pharmaceuticals, and food production to boost production quality and raise productivity.”Yamaha’s booth demonstrations at Motek showed how SCARA and cartesian robots add value to custom automation designed for repetitive processes like punching, sorting, and testing.
The robotic punching machine configures electrical connectors at high speed, leveraging the compact YK-XE SCARA’s ability to quickly change tooling, position each connector quickly and accurately, and inspect after punching using the integrated vision system.
The sorting machine contains Yamaha’s YK-XG series SCARA with ultra-precise and reliable beltless motion to quickly palletise small components by accurately picking from detected positions.
In addition, the team presented a versatile automatic PCB tester that integrates Yamaha’s XY-X cartesian robot to provide flexible positioning for in-circuit tests, functional tests, and programming.
The demonstration showing end-of-line handling for EV batteries, featuring the larger YK1200X SCARA, showing how the combination of high payload capacity and optimised internal balance to manage inertia enables lifting and moving heavy items at speed, and final positioning with sub-millimetre accuracy.
A further showcase featuring Yamaha’s LCMR200 flexible transport system gave insights into how enterprises can reimagine conventional production lines to raise output, enhance uptime, ease scalability, and utilise factory floorspace efficiently.
The LCMR200’s horizontal and vertical circulation units, and the traversing unit that adds further flexibility, are ultra-reliable, simplify product traceability, and permit production-line maintenance with non-stop productivity.
“Motek attracted visitors from a wide range of industries and many came with intriguing automation challenges, making for a high-quality audience,” added Tatsuro Katakura. “As always, there were many opportunities to explain how our robots can help enterprises to become more competitive, agile, and futureproof. We look forward to strengthening the connections we made with potential new customers.”
CLINTON, NY – Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia. Five experts from Indium Corporation will present their cutting-edge research on Pb-free soldering solutions that address critical challenges in modern power electronics and advanced packaging applications.
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation, titled Materials and Reliability for Advanced Packaging and Heterogeneous Integration. The keynote will explore the increasing complexity of interconnect reliability in advanced packaging, driven by the demand for high-density, high-performance applications and the rise of heterogeneous integration.
Product Manager (Semiconductor) Dean Payne will deliver a presentation, titled Making the Move from High-Pb Solder to Pb-Free for Die-Attach in Discrete Power Devices. It will highlight the shift from traditional high-lead (Pb) solder to Pb-free alternatives for die attach applications in discrete power devices. This session will provide insights into the future of die attach solutions and how Indium Corporation is innovating to address these challenges and find a sustainable Pb-free solution for power discrete die attach.
The following presentation will be given by R&D Sintering Project Manager Demi Yao, and is titled Pressure and Pressure-less Cu Sintering Paste Developed for Next-Generation Interconnection Material. This session will offer insights into high-reliability copper (Cu) sintering pastes developed for high-power applications, offering key advantages such as low cost, high thermal and electrical conductivity, and elimination of the need for precious metal plating like gold or silver.
Additionally, Assistant Product Manager for Power Electronics Sunny Neoh will offer a poster presentation, titled Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Application for Improved Thermomechanical Performance. The presentation will explore advancements in low- and mid-temperature Pb-free solder preform technologies for substrate attach in high-power density electronics. It will also highlight the development of high-reliability alloys, such as SAC-In, Sn-Sb, and SAC-Sb, which are designed to withstand thermal cycling and improve the performance of large-area solder joints.
Research Chemist Mary Li Ma will also deliver a poster presentation, titled Voiding Control of Lead-Free Soldering at Quad-Flat No-Lead Package Components. This presentation addresses the challenge of controlling thermal pad voiding in quad-flat no-leads (QFN) packages, which is critical for applications where size, weight, and thermal properties matter. Through this study, a low-voiding paste was developed, offering a reliable solution for improved QFN performance.
For more information on Indium Corporation’s Pb-free soldering solutions, visit our experts at IEMT, at Booth #1.
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