Press Releases

CLINTON, NY – Indium Corporation is pleased to announce several key promotions within its Research and Development (R&D) team. Dr. Jie Geng has been promoted to the role of Senior Research Metallurgist, while Dr. Sihai Chen, Dr. Guangyu Fan, and Jim Hevel have all been promoted to the role of Senior Research Chemist.

In their new roles, these team members assume responsibility for leading research projects and working innovatively to deliver timely solutions for both customers and the market. This encompasses the design, implementation, and adjustments of experiments; analyzing the root cause of product failures and testifying solutions; and training and leading research associates in laboratory projects and works.

“As a company built on perpetual innovation, Indium Corporation believes in fostering an industry-leading R&D department,” said Dr. Yan Liu, Director, Global R&D. “The promotions of Dr. Geng, Dr. Chen, Dr. Fan, and Mr. Hevel are well earned and representative of our commitment to remaining at the forefront of materials science.”

Dr. Geng joined Indium Corporation in 2017 as a Research Metallurgist. Since that time, he has excelled in technology development, as demonstrated by his recent success with Indalloy®292 and Durafuse® HR. He holds a doctorate degree in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering.

Dr. Chen joined Indium Corporation in 2007. He holds a doctorate degree in physical chemistry from the Chinese Academy of Sciences, is a Six Sigma Green Belt, and is certified as an IPC Specialist for IPC-A-610.

Dr. Fan joined Indium Corporation in 2011. He has a doctorate degree in polymer chemistry and physics, a master’s degree in polymer chemistry, and a bachelor’s degree in chemistry. He is also a graduate of the Dale Carnegie Leadership Skills for Success program.

Hevel has been with Indium Corporation since 2004 and has over 30 years of wave flux product development experience. He has been a driving force behind several of Indium Corporation’s successful products, including the recent award-winning CW-818. He holds a bachelor’s degree in chemistry from Michigan State University.

LAKEVILLE, MN – ITW EAE opens new Semiconductor Technology Center, located at 14th room, 6th Floor, No. 6, Zhongsi Road, Qianzhen District, Kaohsiung City, Taiwan. This new center will be a key and efficient resource facilitating collaborations around equipment demonstrations, technology training and co-development of Semiconductor packaging solutions.

By offering equipment demonstrations and comprehensive technology training, the center will strive to enhance the knowledge and expertise of industry professionals. ITW EAEs objective of the center is to provide a platform where customers can engage in teamwork with our technical experts to address their challenges and work towards solving their high value problems. This initiative is expected to accelerate advancements in semiconductor technology and offer customers tailored solutions that meet their specific requirements.

NEUSS, GERMANY – Yamaha Robotics will display the latest-generation 1 STOP SMART SOLUTION at A3.323 at Productronica 2023, bringing together the complete set of new YR series printers, surface-mounters and inspection machines. The new YRM20DL dual-lane mounter will premiere on the booth, and a full area will be dedicated to Yamaha software solutions. Additionally, a Factory Automation demonstration will present flexible robots for mechanical assembly.

The latest YR series surface-mount machines from Yamaha deliver increased accuracy and stability and enable fully automated changeovers for unprecedented speed and efficiency. In the new YRP10 premium printer, automation permits immediate stencil change for sustained high throughput and consistent solder-paste condition. The YRM20 mounter permits non-stop cart and feeder changes, combined with high placement speed and a choice of flexible heads to maximise throughput. And the YRi-V 3D AOI system with high-resolution vision, high-speed graphics processing, and AI to boost component recognition, eases programming, cuts cycle time, and raises inspection accuracy.

The YRM20DL dual-lane mounter will be on display for the first time in Europe. With equal board-size adjustment range and support for all automated features on each lane, the YRM20DL enables owners to increase throughput, flexibility, and efficiency at the same time.

An area dedicated to software will let visitors check out the latest YSUP graphical user interface (GUI) and intelligent factory tools that ensure best performance from the YR series machines. With easy-to-use menus and rich 3D graphics, the YSUP suite helps setup and monitor all equipment in the line and automatically identifies causes of inspection failures to help solve any issues and restore maximum productivity.

The Yamaha booth will also showcase industrial robots for general assembly tasks. Highlighting the flexibility of the LCMR200 workpiece transport solution, the demonstration will show how items can be moved quickly between various assembly processes. These can be performed directly on LCMR200 sliders using a SCARA or cartesian robot. Horizontal and vertical circulation units for the LCMR200 allow building 2D and 3D transport networks, giving flexibility to optimize production and individualise products while achieving a compact assembly cell size.

“The latest-generation YR surface-mount series of our 1 STOP SMART SOLUTION offers exciting opportunities for Europe’s high-tech manufacturers, with more speed, greater accuracy, and more powerful tools to optimize productivity,” said Daisuke Yoshihara, General Sales Manager. “We are also excited to show how our robots can automate miscellaneous assembly and transportation tasks to further boost production.”

As always, Yamaha Robotics’ booth will be staffed by technical experts and sales professionals, ready to highlight Yamaha Intelligent Factory and explain the details. Visit us in Hall 3, booth 323 at Productronica 2023, November 14-17 in Munich, Germany.

CONKLIN, NY – Universal Instruments will join parent company Delta, a global leading provider of IoT-based Smart Green Solutions, to exhibit a comprehensive portfolio of smart solutions for semiconductor processing, including Delta’s Wafer Inspection and Grinding solutions and Universal’s Multi-die Advanced Packaging solutions. Universal will also demonstrate its FuzionSC™ Platform equipped with a High-Speed Wafer Feeder (HSWF) while Delta will highlight its Wafer Edge Grinding, Edge Profile Measurement, Sorter, and IR Pinhole Inspection capabilities. Visit us at Booth Q5446 (TaiNEX 2) at the SEMICON Taiwan trade show in Taipei on September 6–8.

The FuzionSC Platform delivers precision accuracy, the widest component range and the highest flip chip throughput across the largest area. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor space. The HSWF is the world’s fastest rapid-exchange multi-die feeder. Combined with FuzionSC, it provides the highest utilization and best overall economics for advanced multi-die applications.

“With multi-die packages burgeoning, we introduced a solution capable of placing multiple die types in a single cell and eliminated the need to move product between cells, which compromises both accuracy and efficiency,” said Universal Instruments Vice President of Marketing, Glenn Farris. “The flexibility, accuracy and throughput of this system make it the world’s only all-in-one solution for heterogeneous integration and leading-edge applications such as EV power module assembly. We’re thrilled to be able to showcase it alongside Delta’s breadth of precision processing solutions to the semiconductor community at the exhibition.”

Along with visiting the booth, Universal encourages attendees join one or both technical presentations by Glenn Farris, Universal Instruments Vice President of Marketing. On Wednesday, September 6 at 3:30 pm CST at FLEX Taiwan, he will present “Advanced Packaging Technology Enabling Wearable Electronics”. On Friday, September 8 at 2:40 pm CST, he will present “Intelligent System Architectures for Heterogeneous Integration Assembly” at the HITECH Smart Manufacturing Forum.

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit

TORRINGTON, CT – Dymax , a leading manufacturer of light-curing materials and equipment, is pleased to announce that their ground-breaking conformal coating, 9771 , has completed the rigorqualification testing for Military Specification MIL-I-46058C. This UL94V0 and UL746E recognized dual-cure coating has also been approved to the IPC-CC-830B standard and fully complies with RoHS2 Directives 2015/863/EU.

The MIL-I-46058C standard establishes conformal coating compliance requirements and evaluates them to an extensive list of properties, including curing time and temperature, material thickness, moisture resistance, funresistance, insulation resistance, flexibility, hydrolytic stability, and flame resistance. 9771 is now listed in the DOD QPL (Qualified Products Listing) database so military manufacturers know it is approved.

Along with this important recognition, 9771 coating passes NLow Outgassing ASTM E595 specification for cleaner PCBs during extreme conditions and meets low-ionic content compliance with Mil-Std 883 Method 5011. Additionally, 9771 is NMAPTIS listed and assigned material number 09841, so suppliers searching for low-outgassing coatings can easily find it in the database.

Dymax 9771 conformal coating is 100% solids with a blue fluorescing tracer. This high-performance, dual-cure reworkable conformal coating cures with UV/Visible light and moisture in shadow areas.

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that DRI India Relay Pvt Ltd. has purchased Pulsar solderability testing and Photon steam aging systems for installation in their India facility.

The Pulsar utilizes the highly proven dip-and- look test method that is a qualitative type test performed by comparative analysis. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208. The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement component lead tinning machines designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability military and aerospace applications.

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