CLINTON, NY – Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.

Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

“By demonstrating Indium Corporation products on live equipment at IPC APEX, attendees get an accurate and honest depiction of the material’s performance,” said Product Development Specialist Miloš Lazić. “The program is a great embodiment of Indium Corporation’s motto, ‘From One Engineer to Another®’, and we are tremendously proud of it.”

This year’s program will highlight Indium Corporation materials, including:

• CW-807 – electronics soldering cored wire
• CW-818 – no-clean, high-reliability flux-cored wire
• FP-500 – no-clean flux pen
• Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
• Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
• Indium12.8HF – jetting and microdispensing solder paste
• PicoShot® – jetting paste series with exceptional jetting performance
• Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
• TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)

You can see these products at the following partner booths:

• AIR-VAC Engineering (booth #2120)
• Apollo Seiko (booth #1408)
• Essemtec (booth #2409)
• Finetech (booth #4209)
• GPD Global (booth #1504)
• Hakko USA (booth #2600)
• ITW EAE (booth #2327)
• JBC Tools (booth #3642)
• Juki Automation Systems (booth #714)
• Koh Young Technology (booth #2112)
• KYZEN (booth #4237)
• MicroCare (booth #1812)
• Mycronic (booth #742)
• Nano Dimension (booth #2409)
• NSW Automation (booth #3523)
• Panasonic Connect (booth #2332)
• PARMI USA (booth #4036)
• Pillarhouse USA (booth #733)
• PVA (booth #2042)
• Smart Sonic (booth #3906)
• Thermaltronics USA (booth #1003)
• Trans-Tec America (booth #2825)
• Universal Instruments Corporation (booth #2405)
• VERMES Microdispensing - (booth #2814)
• Yamaha Motor Corporation (booth #2820)
• ZESTRON Corporation (booth #3620)

If you see an Indium Corporation product running in a booth, be sure to use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Lazić at mlazic@indium.com 

MORRISVILLE, NC – Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.

As the industry evolves with new applications and architectures, complexity in design and manufacturing and the supporting infrastructures (e.g., metrology, standards, etc.) will be challenging. iNEMI and IPC have recently published a white paper, “Complex Integrated Systems: The Future of Electronics Manufacturing,” intended to guide and focus cross-industry efforts and partnerships in the necessary research and development, as well as the manufacturing capability scale-up, that will be critical to success.

The paper explores several issues, including:

• Sample use-case applications needing CIS, such as:
  • Massive wireless broadband with 5G mmWave systems
  • High-performance computing applications in mobile equipment and data centers
  • XR (extended reality) devices, including augmented reality (AR) virtual reality (VR) and mixed reality (MR)
  • Advanced driver assistance systems for passenger vehicles
  • Integrated photonics
• The CIS manufacturing ecosystem and the challenges of shifting roles within that ecosystem
• The impact on the complete product life cycle, including design, test, manufacturing and end of life
• Roadmap of technical needs along with gaps, challenges and potential solutions
• Recommendations and calls to action

“CIS is driven by fast-growing market segments such as 5G mmWave communications, advanced assisted driving systems, and virtual and augmented reality,” said Grace O’Malley, iNEMI chief technology officer. “Electronics manufacturing is already investing tens of billions of dollars annually into manufacturing capabilities for CIS. This white paper grapples with the big technology issues that the industry should collectively address to ensure an adaptive, profitable CIS manufacturing ecosystem.”

“It’s great that INEMI and IPC were able to collaborate on such an important topic as complex integrated systems,” said Matt Kelly, IPC chief technology officer and vice president, technology solutions. “The concept of CIS is important to understand. It is an integral part of a 'silicon to systems’ approach that is needed for next-generation electronic products spanning HPC, AI, 5G/6G wireless, and EV automotive electronic applications.”

"Complex Integrated Systems: The Future of Electronics Manufacturing is now available. Visit https://go.ipc.org/complexintegratedsystems to download the white paper.

HANOVER, GERMANY – With excitement mounting for the IPC APEX Expo 2024 in Anaheim, California, Viscom is readying to unveil revolutionary innovations crafted specifically for the discerning audience of electronics manufacturing professionals. Immerse yourself in the forefront of electronics manufacturing advancements by joining us at Booth No. 2828 from April 9th – 11th, 2024, where our team of industry-leading experts will share invaluable insights and demonstrate the latest in inspection technology.

Experience the Future of Inspection:

Viscom is proud to unveil its latest marvel at the IPC APEX – the iX7059 One, a cutting-edge 3D X-ray inspection system designed to revolutionize defect detection with unparalleled precision. Witness firsthand how this state-of-the-art system ensures 100% defect detection, setting a new standard in quality assurance.

Revolutionizing AOI Solutions:

Discover our suite of innovative AOI solutions engineered to optimize cycle times and achieve maximum inspection depth. In today’s dynamic electronics manufacturing landscape, automatic optical inspection (3D AOI) is indispensable for maintaining impeccable quality standards. Viscom's AOI systems stand out with superior 3D capabilities and advanced software attributes, delivering unmatched accuracy and exceptional image quality.

Unlock the Power of AI and Software:

Explore our new AI and software solutions, including vAI – a suite of three robust AI solutions meticulously crafted to enhance manufacturing and quality control processes. From NPI to AI-supported image processing and AI-based verification, Viscom empowers you to elevate machine productivity and streamline operations. Immerse yourself in efficiency with vVision 4.0, our groundbreaking software update that seamlessly merges innovation with productivity. Don't miss out on our multipurpose platform, vConnect, featuring the all-new Statistical Process Control solution: vSPC 2.0, designed to optimize performance and drive continuous improvement.

Unrivaled Inspection Portfolio:

In addition, delve into Viscom's extensive range of inspection systems, spanning 3D AOI inspection, 3D X-ray inspection, 3D solder paste inspection, conformal coating inspection, and 3D wire bond inspection. With Viscom, you're not just keeping pace with industry standards – you're setting them.

Join us at IPC APEX Expo 2024 and embark on a journey into the future of electronics manufacturing. Elevate your expertise with Viscom – where innovation meets excellence.

ATLANTA – According to ACDi (American Computer Development, Inc.), “Flexible, reliable, and equipped to keep your project on schedule, is what you need as an electronics manufacturing services partner.” That ethos explains why they have always been at the vanguard of manufacturing technology and did not hesitate to upgrade from 2D AOI (Automatic Optical Inspection) to 3D AOI and 3D SPI (Solder Paste Inspection) in 2018. Almost five years later, they remain at the forefront of manufacturing technology and recently ordered the 23,000th inspection machine manufactured by Koh Young.

As the team at ACDi explained, all their capital equipment decisions are driven by the desire to be at the forefront of technological advancements, in the rapidly evolving industry of EMS. What’s more, ACDi has a large presence in the aerospace and defense sectors, including some very high- profile companies with strict traceability and reliability requirements.

Garret Maxson, ACDi’s Vice President of Operations, oversaw the inspection equipment selection, and said, “We evaluated a few competitors with demo equipment, performed some simulations and analysis, and Koh Young was the clear decision.”

Software-Driven Manufacturer

Garret added, “we are a data-driven manufacturer, so for us the big draw is data collection, not just ‘go/no-go’ calls, but real, actionable data. KSMART delivers significant metrics like first-pass yield, continuous improvement, review of top-five defects, and more. This is actionable data that can drive real process improvement.” ACDi also values the low false calls they see, which means they can operate the equipment with a small, but well-trained team. They currently have ten machines, with live dashboards across each of its factories in Maryland, North Carolina, and Connecticut. Instrumental in the development of the technology partnership between ACDi and Koh Young is Nagy Bayoumi, President of Atlantech. Nagy has been in the industry for close to 40 years and has led Atlantech for 34 of those years.

Nagy explains, “It’s a pleasure to work with companies like ACDi who see the real value we can deliver, not just in quality control, but also in performance, efficiency, and manufacturing excellence.” He adds, “Garret is a strategic leader of an impressive team that continues to grow organically and inorganically, including their most recent acquisition in Connecticut.”

Garret adds, “the market for skilled labor is tough, partially motivated by labor shortages, so we want less manual inspection dependent on human labor. The latest Koh Young AOI includes a higher height capability, so we can inspect even taller components in 3D. This means less manual visual inspection, and that’s what we need.” He concludes, “Nagy and the team at Atlantech and Koh Young have been important partners for ACDi, and we expect that to continue.”

You can learn more about ACDi at https://www.acdi.com/. ACDi recently ordered the 23,000th machine from Koh Young, a Zenith Alpha HS+ True3D AOI machine, more details at https://kohyoungamerica.com/zenith-alpha/.