SAN JOSE, CA – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, today announced the appointment of Mark Crebs to Products and Platform Director of Business Development. Mark brings over 25 years of experience in sales and business development, including roles in National and Regional Sales management and in roles with major electronic components distributors across North America.

In his new role, Mark will drive Naprotek’s top-line growth by leveraging the company’s unique offering of RF products and the complete Naprotek platform offering. He will work closely with the executive leadership team to formulate and execute growth strategies that promote its RF Center of Excellence in RF components, micro-e assembly, and fabrication services, including wafer dicing, lithography, and thin film circuits, along with the PCBA and Box Build Center of Excellence in high-mix, high-complexity PCB assembly, integration, and testing.

Mark recently served as the Western Region Sales Director for Richardson Electronics and prior to that, he served as the Western Region Sales Manager for Richardson RFPD, an ARROW company. Prior to Richardson Electronics, Mark worked for RF OEM, MACOM, selling products and running distribution for the West.

“We are excited to welcome Mark to Naprotek,” said Freddie Chavez, Vice President of Business Development. “His deep experience in RF technology, strategic customer interface, and leadership in business development will be crucial in advancing our growth across the enterprise. We look forward to the innovative strategies and leadership he will bring to our organization.”

“I’m excited to join Naprotek and help shape the next phase of its growth,” said Mark. “Working alongside such a skilled team, I look forward to advancing our product and platform strategy while ensuring we deliver exceptional value to our customers and partners.”

For more information, visit www.naprotek.com.

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.

The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and 2, will focus on the role of metal-based TIMs in addressing key challenges across TIM1, TIM1.5, and TIM2 interfaces, including the need to reduce thermal resistance, minimize voiding, and enhance mechanical reliability under thermal cycling. Metal TIMs provide high thermal conductivity, excellent structural stability, and reliable performance across a range of interface conditions, including warped or non-planar surfaces.

“As AI and HPC systems continue to advance, thermal management has become essential to support increasing power densities and packaging complexity,” said Foo. “By highlighting application insights and recent advancements, this presentation will provide a practical perspective on how metal TIMs are enabling next-generation AI and HPC packaging through more reliable, efficient thermal solutions.”

As assistant product manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.

Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.

The presentation will take place on Thursday, September 18, at 10:50 a.m.

To learn more about Indium Corporation’s solder solutions, visit https://www.indium.com/.

SAN DIEGO, CA – PARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Prosperar Solutions, led by Henrique Dantas, Commercial Director, as its new representative in Brazil.

Based in Campinas, São Paulo, Prosperar Solutions is recognized as a key partner to the electronics industry, providing solutions for PCB assembly, semiconductor manufacturing, 3D inspection, optoelectronic measuring systems, industrial automation, BGA rework, X-ray inspection, and smart component storage. With its strong presence in Brazil’s “Silicon Valley,” Prosperar is ideally positioned to support PARMI’s growth and customer service in the region.

Henrique Dantas brings more than two decades of industry expertise, including leadership roles in sales, account management, and manufacturing engineering across the SMT, THT, and EMS sectors.

His career highlights include founding and managing an EMS company, building strong partnerships in the SMT market, and delivering significant sales growth through customer-focused strategies.

"We are very excited to welcome Prosperar Solutions and Henrique Dantas to the PARMI network," said Juan Arango, Head of Sales and Business Development, PARMI USA, Inc. "Brazil is a vital market for electronics manufacturing, and Henrique’s expertise and strong relationships will allow us to better serve customers while expanding our footprint in the region."

Prosperar Solutions will represent PARMI’s full portfolio of 3D inspection systems, providing Brazilian customers with local technical expertise, responsive support, and access to world-class inspection technology.

MANASSAS, VA – ZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA: The EPS by i-Tech AG 75 Pallet Cleaning System. This expanded capability allows ZESTRON to better support customers by demonstrating a maintenance cleaning process that supports PCBA manufacturing.

The EPS by i-Tech AG 75 Pallet Cleaning System is a highly efficient air agitation cleaning system designed for the precision cleaning of solder frames and carriers, solder and coating pallets, and condensation filters. With the addition of this advanced system, ZESTRON’s Technical Center is now better equipped to simulate production-scale processes for comprehensive testing and evaluation.

The EPS by i-Tech AG 75 Pallet Cleaning System, other maintenaince cleaners, and PCBA cleaners are available for testing with the full range of ZESTRON’s chemistries at its Technical Center in Manassas, VA. Customers are invited to schedule live demos or send samples for testing with ZESTRON’s range of chemistries to explore the benefits of these advanced cleaning technologies.