Press Releases
Irvine, California, USA – TopLine® Corporation announces, effective immediately, a Fixed Price Guarantee on all Tanaka-made Aluminum Bonding Wire and Ribbon, free of tariffs to U.S. customers. “Our customers need not fear a 25% tariff on aluminum imports set to take effect on March 12, 2025”, stated TopLine CEO Martin Hart. “We provide our customers with peace of mind and price stability so that they can smoothly plan their production,” he added. “We do this by offering a fixed price guarantee, in writing. Our quoted price is the invoice price our U.S. customers pay, without threat of market volatility potentially caused by sudden changes in trade policy.”
Large diameter aluminum bonding wire and ribbon is a mainstay ingredient in battery chargers, power-packs and electrical systems for EV autos, planes and nautical vehicles. Small diameter aluminum wire is ubiquitous in integrated circuits and modules used in Mil-Defense, Aerospace and industrial markets. Tanaka aluminum bonding wire is the world’s best quality product manufactured in Japan and Singapore.
About TopLine
TopLine is the exclusive distributor for Tanaka-made bonding wire in North America. Tanaka is the world’s premier manufacturer of the full range of Gold (Au), Silver (Ag), Copper (Cu), Platinum (Pt) and Aluminum (Al) wire covering all applications of wedge, ball and bump bonding. And Yes – Only One Spool is OK for minimum orders. To learn more, visit www.TanakaWire.com, or call (+1) 800 – 776-9888.
LIVONIA, Mich., Feb. 25, 2025 /PRNewswire-PRWeb/ -- Located in Livonia, MI, IPS Assembly serves a diverse range of industries, including industrial, defense & aerospace, medical, lighting & entertainment, and energy sectors. IPS Assembly partners with customers to provide end-to-end solutions, from PCB design support to quick-turn prototyping, assembly, repair, and rework services. Their agility and dedication to quality and speed, especially in government contracts, sets them apart from the competition.
Their strategic location near Detroit's automotive hub allows IPS Assembly to offer automotive customers unparalleled support for rapid prototyping, PCB assembly, and repair/rework services. With their focus on automation, including order forecasting, inventory management, and production scheduling, they're empowered to stay ahead in an increasingly competitive market.
Previously, IPS Assembly managed their operations using a combination of manual processes and legacy software. As their company scaled, these systems became inefficient and error-prone, prompting an extensive search for a system tailored to electronics manufacturing that ensured seamless compliance with industry standards like ISO and NIST.
Cetec ERP's cloud-based platform stood out because of its ability to handle the unique needs of a contract manufacturer. With its robust features for inventory, production, and compliance management, Cetec ERP was the ideal choice for IPS Assembly's business. Its' focus on streamlining production and inventory processes aligned perfectly with IPS Assembly's long-term goals.
"Cetec ERP has been more than just a software solution; it's been a strategic partner in our growth journey," said Tej Sutariya, CISO at IPS Assembly. "The automation capabilities and customizability have helped us achieve efficiencies we couldn't imagine with our previous systems."
The transition to Cetec ERP began with a comprehensive inventory audit, where errors in part records were identified and corrected. The improved inventory accuracy had a measurable impact on turn and lead times, enabling IPS Assembly to fulfill orders faster and more efficiently. Optimized kitting and de-kitting, enhanced order forecasting, and improved production scheduling provided real-time data insights, increased operational efficiency, and simplified reporting for audits and certifications.
Since adopting Cetec ERP, IPS Assembly has experienced reduced production lead times, improved inventory accuracy, and fewer compliance issues, all of which contribute to significant cost savings. Automation in processes like MRP/purchasing and production scheduling has also improved resource utilization and allowed them to handle more complex projects, directly impacting revenue growth.
"Cetec ERP will play a critical role as we expand into new markets and continue to refine our operations. Its flexibility will help us adapt to evolving customer demands, while its advanced automation features for inventory management, order forecasting, and production scheduling will ensure we maintain compliance and scale efficiently. Additionally, its robust reporting capabilities will support our commitment to continuous improvement and data-driven decision-making.
Cetec ERP is disrupting a stagnant, high dollar industry that has resisted change for decades. Since 2015, and without any major marketing initiatives or venture capital funding, Cetec ERP has independently migrated hundreds of companies off legacy technology platforms like Oracle and NetSuite, saving companies hundreds of thousands of dollars, onto a new generation of lower cost ERP technology. Learn more at https://cetecerp.com!
IPS Assembly Corporation is an experienced Electronics Contract Manufacturer specializing in PCB assembly since 2014. IPS was founded by two brothers, Perry and Ishvar Sutariya, after spending 25+ years in printed circuit board manufacturing. Operating multiple high output assembly lines in a state-of-the-art 42,000 square foot facility in Livonia, MI, IPS is capable of assembling prototypes, small runs, and high volume orders.
SAN JOSE, CA – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, proudly announces securing over $9 million in contract value in FY24, supporting the Space Development Agency's (SDA) Tranche 1 Tracking Layer (T1TL) and Tranche 2 Tracking Layer (T2TL) programs through our customer. These awards highlight our commitment to advancing space technology and our growing presence in the space industry.
Naprotek provides complex, high- reliability PCBA services for the T1TL and T2TL Alpha and Gamma satellites through its customer. Naprotek’s expertise and dedication to quality are instrumental in supporting the SDA’s mission to enhance space-based tracking capabilities.
“We are thrilled to contribute to the SDA’s T1TL and T2TL programs and to provide high-complexity, high- reliability PCBA services to our customer,” said Teh-Kuang Lung, President and CEO of Naprotek. “This achievement underscores our capability to deliver critical services for advanced space systems and reflects the significant growth we are experiencing in the space sector.”
Naprotek continues to expand its footprint in the space industry, driven by its commitment to customer partnerships, quality, innovation, and excellence. The company’s support for the SDA through its customers and collaboration with other key players in the space sector positions it at the forefront of this rapidly growing industry.
For more information about Naprotek and its high-reliability manufacturing services, please visit www.naprotek.com or contact the company’s support team.
FLORHAM PARK, NJ – Heller Industries, the global leader in thermal technology solutions, announced REStronics has been appointed our sales representative for New England. REStronics New England, led by Managing Partner Hunter Adams, is a manufacturer’s representative specializing in products and services covering circuit board production and semiconductor assembly.
“We are excited to welcome REStronics New England to the Heller team,” noted Frank Hart, SVP of Global Sales and Marketing for Heller Industries. “I have had the great privilege to work with Hunter Adams for nearly two decades. His success speaks for itself. We look forward to growing our business in New England and trust Hunter will be a major factor in achieving that goal.”
Heller’s partnership with REStronics in New England extends the companies’ relationship beyond the Metro NY, NJ, PA region and follows the appointment of Tim Glasgow in the Southeast territory in 2024.
Heller Regional Sales Manager Caleb Eagle added, “This is an exciting time at Heller as we aggressively grow our global business. I see New England as a region that values our high quality, engineered thermal solutions and customization for high mix environments. I am confident that Heller is best positioned for the future with REStronics New England.”
POOLE, UK – CEEI SRL Industrial Electronics, a leading provider of electronic board and system design for industrial and professional applications, continues to advance its manufacturing capabilities with Europlacer’s high- performance pick-and-place solutions. With a focus on flexibility, precision, and efficiency, Europlacer has played a key role in helping CEEI streamline operations and meet growing customer demands.
For over 40 years, CEEI has been delivering high-quality products while maintaining agility in production processes. As customer expectations for shorter lead times and high- mix manufacturing continue to rise, CEEI sought a partner capable of supporting scalable and adaptable production.
Europlacer emerged as the ideal choice, offering advanced SMT placement solutions tailored to CEEI’s needs.
“In 2016, we were experiencing rapid growth and needed a technology partner that could support our expansion,” said Giorgio Mazzolatti, CEEI SRL. “With the introduction of Europlacer’s iineo2 machine, we immediately saw improvements in quality and efficiency. Within a year, our productivity increased by 20%, and our delivery times were reduced by 15-20%, allowing us to better serve our customers.”
Europlacer’s technology has allowed CEEI to minimize downtime through offline production setup capabilities, ensuring seamless transitions between production runs. The intuitive programming interface has also streamlined workflows, reducing setup time and enhancing operational efficiency.
The versatility of Europlacer’s SMT solutions has been particularly beneficial, enabling CEEI to manage both large-scale production and rapid prototyping with ease. The ii-tab mobile solution has further optimized efficiency, providing real-time data for workflow improvements, production monitoring, and enhanced traceability.
“As our business continued to grow, we needed a solution that would support increasing production volumes without sacrificing flexibility,” added Giorgio Mazzolatti. “The decision to invest in Europlacer’s Atom3 machine was a natural next step. Its speed and precision have allowed us to expand high-volume production capabilities, meeting our customers’ evolving needs with greater agility.”
Beyond the technology, CEEI values the strong relationship it has built with Europlacer. From initial implementation to ongoing technical support, Europlacer has provided responsive service and expert guidance, ensuring seamless integration and long-term success.
“The Europlacer team’s professionalism and commitment to our success have been outstanding,” Giorgio Mazzolatti noted. “They go beyond simply resolving issues—they actively work with us to optimize processes and improve operations. This level of support has been a game-changer for us.”
Looking ahead, CEEI sees Europlacer as a vital partner in its continued growth, particularly in prototyping and high-mix, low-volume production. As the market demands greater speed and precision, CEEI is confident that Europlacer’s cutting-edge solutions will continue to drive success.
For more information about Europlacer and its SMT solutions, visit www.europlacer.com
NASHVILLE – Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will present the technical paper “Methods used to Qualify Soldering and Cleaning Materials and Processes” on Tuesday, March 18 at the 2025 IPC APEX EXPO Technical Conference.
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean flux residues, partially cleaned flux residues, and wash fluids not fully rinsed during cleaning. These contaminants interact with their environment leading to the deterioration of components, ultimately causing system malfunctions.
Testing methodologies, such as Surface Insulation Resistance (SIR), Ion Chromatography (IC), and C3 testing, are designed to identify potential failure points and ensure electronic systems can withstand the challenges of different environments. Bixenman’s research paper will provide insight into the effects of process contamination and the use of these methods to qualify the assembly process.
Bixenman’s presentation, “Methods used to Qualify Soldering and Cleaning Materials and Processes” will be one of four presentations during the “Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness” session.
Additional presentations during the session are: “From the Corrosion to Short Circuiting in Electronics: Investigation of The Detrimental Dendrite Development” presented by Dr. Kapil Kumar Gupta of Technical University of Denmark, “Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness” presented by Dr. Rajan Ambat of Technical University of Denmark, and “Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics” presented by Dr. Anish Rao Lakkaraju of the Center for Electronic Corrosion (CELCORR).
For more information about the technical conference or to register to attend, visit the official website of IPC APEX 2025. For more information about Magnalytix, click here.
Press Releases
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- Kurtz Ersa Names AtlantechUSA as 2024 Representative of the Year for Rework and Machines during APEX; Ernie Grice and Nagy Bayoumi Comment
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- Amtech Redefines Manufacturing Standards with Agile, AI-Powered Approach