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May 2026 — VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, has appointed The Murray Percival Company as its manufacturers’ representative for Illinois and Southern Wisconsin.

A third-generation, family-owned business with more than 60 years of experience, The Murray Percival Company is well known throughout the PCB and electronics assembly industry for its technical knowledge and strong customer relationships. The company supports manufacturers with a broad range of assembly equipment, materials, and production solutions, along with a focus on helping customers improve processes and maximize return on investment.

Through this partnership, Murray Percival will represent VJ Electronix’s full line of solutions, including automated rework systems, X-ray inspection platforms, and component counting systems. The goal is simple—provide local support and help manufacturers solve real production challenges with practical, proven technology.

“Bruce Clark and the Murray Percival team bring a deep understanding of the industry and a long track record of supporting customers the right way,” said Don Naugler, General Manager at VJ Electronix. “Their approach aligns well with how we work, and we’re looking forward to building on that in the Midwest.”

Bringing Murray Percival on board gives VJ Electronix a stronger local presence in a region with a solid base of electronics manufacturing, making it easier for customers to access support and expertise when they need it.

VJ Electronix continues to grow its North American rep network to stay closer to customers and respond more quickly.

For more information about VJ Electronix, visit www.vjelectronix.com. For more information about The Murray Percival Company, visit www.murraypercival.com.

Byron Center, MI – May 2026 – ubersmt, a U.S.-based electronics manufacturing services provider, has added a new reflow system from Heller Industries, expanding its SMT capability and supporting growing customer demand across prototype, low-volume, and production builds.

The newly installed MK7 reflow oven is designed for high-volume SMT and semiconductor applications, bringing improved thermal control, better efficiency, and more stable process performance to ubersmt’s production line.

For ubersmt, the investment ties directly back to the type of work the company was built around: supporting startups and engineers who need a manufacturing partner that can flex with their needs. Founder and President Michael Antwih has focused on building a lean, responsive operation that can handle everything from first articles to scalable production without unnecessary complexity.

The Heller MK7 supports that approach with tighter temperature uniformity and reduced Delta T across the board, helping improve solder joint consistency on complex assemblies. For customers, that means more reliable first-pass results and fewer surprises when moving from prototype into production.

Efficiency was another key driver behind the decision. The oven’s upgraded gas management system significantly reduces nitrogen consumption, while its insulated, low-profile design reduces energy loss and improves visibility across the production floor. Those gains translate into lower operating costs and a more controlled, predictable process environment for customers.

Maintenance and uptime were also central considerations. The MK7’s flux management system captures and removes flux buildup in a way that reduces manual cleaning requirements and helps extend preventive maintenance intervals. That allows ubersmt to keep equipment running longer between service interruptions, supporting more consistent lead times.

The system also includes built-in process monitoring and Industry 4.0 connectivity, giving the team better visibility into process performance and traceability. For customers, that level of data access supports tighter quality control and stronger documentation for regulated or high-reliability applications.

Since installation, the oven has already delivered consistent profiles across a range of assemblies, giving the team added confidence as production requirements continue to grow.

As ubersmt scales its capabilities, the addition of the Heller MK7 helps the company continue doing what it set out to do from the beginning—make it easier for innovators to move from idea to built product, without being constrained by traditional manufacturing barriers.

For more information, visit www.ubersmt.com.

Congratulations to Cerebras Systems on their IPO and on continuing to prove that breakthrough performance comes from fundamentally rethinking architecture — not incrementally optimizing legacy assumptions.

Cerebras challenged one of the most deeply embedded constraints in computing: the assumption that high-performance systems must be assembled from many smaller chips connected through increasingly complex interconnect layers. Instead, they pursued a wafer-scale architecture that minimizes fragmentation, reduces latency, increases bandwidth density, and collapses system complexity into a more unified computational fabric.

That thinking has strong parallels to the philosophy behind the OCCAM methodology’s “Build Electronics” rather than assemble.

Traditional PCB and electronics assembly approaches evolved around discrete packaging, layered interconnects, solder joints, connectors, and compartmentalized subsystems — each adding latency, yield loss opportunities, thermal bottlenecks, reliability risks, and manufacturing complexity. OCCAM approaches the problem from the opposite direction: eliminate unnecessary intermediaries, reduce structural fragmentation, embed functionality directly into the system architecture, and simplify the signal and manufacturing path itself.

The data increasingly supports both approaches:

  • Modern AI systems are now constrained as much by data movement and interconnect overhead as by raw compute density.
  • Advanced electronics manufacturing faces similar scaling limits driven by interconnection complexity, assembly yield, thermal management, and labor intensity.
  • In both domains, the winning architectures are becoming those that reduce interfaces, minimize translation layers, and treat the system as an integrated physical fabric rather than a collection of discrete parts.

Cerebras demonstrated that the next leap forward often comes from removing complexity instead of adding more abstraction on top of it.

That is not just a semiconductor lesson — it is increasingly becoming the defining principle of next-generation electronics manufacturing itself.

Excited to see the continued success of Cerebras and what it signals for the broader future of integrated system architecture, AI infrastructure, and advanced manufacturing.
To learn more about the “Built Electronics” approach to system design, contact Ray Rasmussen at: ray@theoccamgroup.com. Again, congratulations to the team at Cerebras!

Scanfil is pleased to announce the expansion of its partnership with the AXS Division of the Life Science & Medtech company Bruker. Key Bruker AXS products currently supported include a range of high‑end analyzers and a wide portfolio of PCBAs.

At present, Scanfil’s plants in Mysłowice and Pärnu supply PCBAs, enclosures, and high‑level assemblies to Bruker AXS in Germany and Belgium. The partnership will now be extended through the wider Scanfil network to support the Bruker AXS division globally. 

“Our goal is to provide comprehensive service for the Bruker AXS division worldwide,” says Scanfil Global Sales Manager Andreas Bohner. “With our experience, advanced manufacturing capabilities, and strong commitment to continuous improvement, we aim to deliver solutions that meet Bruker AXS’ needs. This expansion strengthens our partnership, and we look forward to continuing our shared growth and success.” 

“We are excited to deepen our collaboration with Scanfil,” says Christian Streib, Senior Director Global Supply Chain of Bruker AXS. “Their commitment to quality and global supply capabilities have been instrumental in supporting our growth and innovation. We look forward to continued success together as we expand our partnership across additional regions.” 

The expanded partnership further strengthens Scanfil’s growth, especially within its strategic Medtech & Life Science focus areas. 

San Jose, CA — May 2026 — JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, has expanded its quality and inspection capabilities with the installation of four new AOI systems from Nordson Test & Inspection, including three SQ3000 systems and one SQ3000-X designed to support large-format assemblies.

The new systems were recently brought online with installation and training support, as the team begins integrating the equipment into production across multiple lines.

The investment adds both scale and flexibility to JAVAD EMS’s inspection process. Three of the new systems are Nordson SQ3000 platforms, while the fourth—Nordson SQ3000-X—extends inspection capability to assemblies up to 710 x 610 mm. That added capacity is especially important for customers building larger, more complex boards that require consistent accuracy at production speeds.

At the core of the upgrade is Nordson’s Multi-Reflection Suppression (MRS) technology, designed to reduce reflection-based distortion on shiny or highly specular surfaces. The result is more stable, repeatable measurement performance across a wide range of components, including those commonly found in SMT, microelectronics, and machined assemblies.

The SQ3000 platform combines four multiview 3D sensors with a parallel projector system, enabling metrology-grade inspection at production speeds. By capturing multiple images simultaneously and fusing them with proprietary algorithms, the system produces high-resolution 3D data that improves defect detection and measurement accuracy without slowing throughput.

For JAVAD EMS, the upgrade also brings improvements in usability and programming speed. The SQ3000 software suite is designed for fast setup and simplified operation, with intuitive multi-touch controls and 3D visualization tools that reduce training time and operator interaction.

A key feature is AI2 (Autonomous Image Interpretation) technology, which enables rapid setup using a preloaded, data-rich library and automated learning scripts. In many cases, programming can be completed in under 13 minutes, helping accelerate changeovers and supporting high-mix production environments where flexibility is critical.

The system’s ability to detect a wide range of defects in a single inspection, without manual parameter tuning or algorithm adjustments, further reduces complexity on the production floor while improving consistency.

With the addition of these four systems, JAVAD EMS is strengthening its ability to support customers with higher complexity assemblies, larger board formats, and tighter quality requirements—while maintaining the speed and efficiency needed in a competitive EMS environment.

For more information, contact JEMS at 408-770-1700, info@javadems.com or visit www.javadems.com.

Cyient DLM Limited has announced the appointment of Ramakanth Alapati as President and Chief Strategy and Growth Officer, effective May 19, 2026, in a leadership hire designed to accelerate the Hyderabad-based integrated electronics manufacturer’s growth in high-potential global markets — particularly data centres, artificial intelligence infrastructure, and next-generation computing platforms.

Alapati will be based in Dallas, USA — a strategic location for engaging with major North American technology customers — and will lead Cyient DLM’s strategic initiatives in emerging growth sectors while building out a robust global customer pipeline. The appointment was disclosed to stock exchanges through a Regulation 30 filing signed by Company Secretary and Compliance Officer S. Krithika on May 19, 2026.

Alapati brings over two decades of leadership experience spanning advanced electronics manufacturing, high-precision packaging, capital equipment, and deep-tech environments. His expertise covers complex, high-scale production ecosystems and next-generation computing platforms, complemented by a track record of building engineering teams and delivering mission-critical programmes across global technology organisations. His specialised experience in scaling advanced manufacturing capabilities for data centres, AI infrastructure, and adjacent technology sectors directly aligns with Cyient DLM’s strategy of targeting high-growth, high-complexity manufacturing contracts from leading global technology customers.

Rajendra Velagapudi, Managing Director and CEO of Cyient DLM, described the appointment as coming at a pivotal moment in the company’s growth journey, saying that Alapati’s deep expertise across advanced technology and manufacturing ecosystems, combined with his proven ability to scale high-precision manufacturing capabilities, will be instrumental in shaping strategic direction and accelerating global expansion. Velagapudi added that Alapati’s leadership will strengthen the company’s ability to tap into emerging opportunities and build enduring partnerships with leading global customers.

Alapati, commenting on his new role, said he is excited to join Cyient DLM at a transformative phase in its journey, citing the company’s strong engineering foundation and its ambition to scale in high-growth sectors as a compelling opportunity. He said he looks forward to working with the leadership team to strengthen global presence, expand the customer ecosystem, and drive sustainable long-term growth.

Alapati holds an M.S. in Chemical Engineering from the University of Kansas and a Bachelor’s degree in Engineering from Osmania University, Hyderabad, and has completed the Executive Leadership Development Programme at Harvard Business School.

Cyient DLM, established in 1993 and listed on the NSE under the symbol CYIENTDLM, is a leading integrated electronics manufacturing solutions provider offering design-led manufacturing — covering design, manufacturing, testing, precision machining, and certification support — for safety-critical electronics in highly regulated industries including aerospace, defence, and industrial technology.

The appointment is strategically significant at a moment when India’s electronics manufacturing sector is receiving accelerated policy support through the PLI scheme and DPIIT localization mandates, while global technology companies are diversifying their supply chains away from China-concentrated manufacturing toward India-based alternatives. Cyient DLM’s positioning as a design-led, safety-critical electronics manufacturer — rather than a commodity assembler — places it in the premium segment of this supply chain shift, and the appointment of a US-based senior leader with data centre and AI manufacturing expertise signals a deliberate push to engage the largest category of global technology capex currently underway.

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