TORRINGTON, CT – Dymax, a leading manufacturer of rapid and light-curing materials and equipment, will exhibit at SMTA International 2024 in Rosemont, IL, from October 21-24. Engineers and electronics professionals are invited to visit booth 2713, where Dymax will present curing materials and equipment designed for the evolving needs of the avionics, electronics, and industrial sectors.

At this year's event, Dymax will feature solutions tailored for critical PCB-level electronics applications, including dual-cure 9771 low-outgassing conformal coating, which meets Mil-Std-883 Method 5011 for aerospace, defense, and unmanned systems technologies. Attendees will have the opportunity to see multipurpose PCBs with staking materials, flexible encapsulants, and board-level maskants, along with high-performance conformal coatings like 9483, built for heat, chemical, and corrosion resistance, and 9451 black conformal coating, for shielding sensitive circuitry.

Dymax will demonstrate the dispense of 9-7004 PCB maskant and 7501-T-UR-SC dielectric protective coating for battery modules and curing with a BlueWave® high-intensity UV/LED light-curing system powered by the MX-MIM. Engineers working on electric vehicle technologies can view a battery module shell to see the practical applications of Dymax materials.

The booth will provide an opportunity for engineers to consult with Dymax's technical experts on specific challenges in electronics design and assembly. Whether developing advanced automotive systems or working on space-bound electronics, the team can share insights on how light-curing technologies can streamline processes.

Electronic Coating Technologies (ECT), a partner specializing in critical electronics protection and contract manufacturing services, will co-exhibit with Dymax. ECT representatives will be available to discuss solutions for protecting critical electronics in demanding environments.

"Many engineers seek an integrated approach to electronics processing that avoids needing multiple service providers," said David Miller, Territory Manager, Central & North Midwest Sales. "By collaborating with ECT, we aim to offer a coordinated solution that combines light-curable materials with coating services, helping to simplify the manufacturing process."

Engineers involved in electronics design are encouraged to stop by booth 2713 for discussions on material solutions and process improvements.

CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies. This innovative process significantly increases production yields while reducing the production cycle time for each assembly. NEOTech remains committed to continuous improvements, particularly in the manufacturing of extraordinarily high-tech microelectronics products for the nation’s leading OEMs in the Aerospace & Defense, Medical Device, and Industrial markets. As part of this commitment, NEOTech has researched, tested, and qualified an advanced wire bonding technique known as Standoff Stitch (SOS), which further reinforces the company’s dedication to delivering high-quality, precision-driven solutions.

NEOTech, already recognized as an industry leader in SMT electronics manufacturing, stands at the forefront of high-tech microelectronics circuit assembly as well. The company’s original first- pass yields for wire bond and bond pull test processes were already excellent, achieving a 99.3% success rate. However, for mission-critical electronics used in aerospace, defense, space, and medical implantable device applications, even this high yield rate required further improvement. Common methods to enhance wire bond yield and reliability, such as the Burnishing process and the Security Bonding process, have been effective but significantly increase production time. To address this challenge, NEOTech has researched and implemented the SOS wire bond process, which not only boosts reliability but also reduces the production cycle time, offering a more efficient solution without compromising quality.

The SOS wire bond process is a superior method for ensuring high-quality interconnects of micro fine wires to the conductive pads on the substrate surface, which are often uneven or wavy due to the screen-printing process. When standard wire bonding methods are applied to these uneven surfaces, poor bond adherence can result, impacting overall quality. The SOS process addresses this issue by incorporating a gold ball approximately 2.5 mil in diameter during the first step of the wire bonding process. This gold ball accommodates the uneven surfaces without the need for additional steps, significantly reducing production time for each assembly. Furthermore, the increased surface area at the substrate bond interface created by the gold ball forms a more robust bond, enhancing reliability. NEOTech has seen remarkable improvements from this method, with production yields increasing to 99.99% and throughput doubling.

Jim Doyle, Chief Executive Officer of NEOTech’s Aerospace & Defense Business, expressed his enthusiasm for the recent advancements, stating, “At NEOTech, we are dedicated to fostering a culture of continuous improvement to ensure we consistently deliver the highest quality products to our customers. The implementation of the SOS wire bonding process is a testament to our commitment to innovation and operational excellence. By enhancing our wire bonding capabilities, we not only improve production efficiency but also ensure the reliability and performance of mission-critical microelectronics for the aerospace, defense, medical, and industrial sectors. We are proud of our team’s unwavering focus on quality and their efforts to push the boundaries of what’s possible in electronics manufacturing.”

NEOTech distinguishes itself through its broad capabilities and exceptional service offerings, serving industries such as aerospace/defense, medical devices, industrial, and high-tech sectors. Renowned for delivering high-quality products and solutions, NEOTech has become a trusted partner for complex, mission-critical electronic manufacturing projects. The company’s cutting-edge facilities and advanced manufacturing technologies guarantee precision and reliability in every product. NEOTech’s commitment to quality is evident through its adherence to stringent standards, backed by certifications like ISO 9001:2015, ISO 13485:2016, and AS9100. At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics 

STEINACH, SWITZERLAND – Variosystems AG is reinforcing its Executive Leadership Team with its new Chief Financial Officer (CFO), Markus Nikles, an international finance specialist with industry experience. After expanding the leadership this year to include Stefan Hasenfratz, responsible for business development in Asia, and Anthony Pugliese, Head of the North America Region, Variosystems is finishing the reinforcement of its Executive Leadership Team by appointing Markus Nikles as CFO.

Variosystems is a global service partner for all-inclusive electronics solutions with customer organizations in Europe, North America, the Asia-Pacific region, and China. The company, based in Steinach, Switzerland, is on a growth trajectory and expanding in all regions, with an aim of doubling its revenues by 2026. Variosystems is drawing on international management expertise to achieve this.

Since the start of the year, Stefan Hasenfratz (Head of Variosystems Asia) and Anthony Pugliese (Head of Variosystems North America) have been reinforcement for the Executive Leadership Team consisting of CEO Stephan Sonderegger, COO Stefan Walther, CHRO Christine Peter, CIO André Bättig, and cofounder Norbert Bachstein. With the appointment of CFO Markus Nikles as of October 1, 2024, the team is now complete. The finance expert, who comes from Interlaken, Switzerland, and is experienced in the stock markets, succeeds Raymund Scheffrahn, who left the company at his own request at the end of July.

“We want to be the most trusted and sustainable electronics service partner, including on a global scale. With the reinforcement provided by Markus Nikles, we are working toward this objective. He contributes long-standing international experience in financial management at major industrial enterprises and has spent many years in positions in the United States and China. These markets are strategically important for our growth,” says Stephan Sonderegger, CEO of Variosystems. The new CFO, Markus Nikles, is looking forward to his duties: “Variosystems is one of Switzerland’s best-managed companies and has a clear vision and strategy. This is just as inspiring as it is motivating. Contributing my expertise, I wish to have a hand in achieving the ambitious goals.”

Financial expertise for global growth

Markus Nikles was most recently CFO at Meyer Burger Technology AG and, before that, spent 22 years in leadership positions for the Bühler Group, including ten years in the United States and three in China. With a degree in business and an executive master’s in corporate finance, he is based at Variosystems’ head office in Steinach and reports directly to the CEO.

NEUSS, GERMANY – Yamaha Robotics announced today that the Company has held a ceremony to celebrate the completion of renovation and expansion work at the Hamamatsu Robotics Office, which develops, manufactures, and sells surface mounters and industrial robots, as well as the 40th anniversary of the Robotics Business, which started in 1984 as the IM Division. The ceremony was attended by approximately 200 people, including business partners, and included a ribbon-cutting by President and Representative Director Yoshihiro Hidaka.

The renovation and expansion work began in January 2023, achieving 1.6 times increase in the total floor area of the office buildings and 1.8 times expansion in production area. As a result, the production capacity for surface mounters will be approximately doubled.

Additionally, with the installation of additional solar panels in the expanded area, the conversion of the entire facility, including the cafeteria, to electric power, and the introduction of CO2-free electricity starting in 2022, this will be the Company’s first Carbon Neutral Factory.

The strengthening of the base through this expansion and renovation is part of the company's strategic investment in growing businesses under its medium-term management plan (2022-2024). Yamaha Motor will further enhance its customer- oriented systems for technology, sales, and services, which is the strength of its robotics business, and work towards reinforcing profitability by expanding the scale and business area in a growing market.