SANTA CLARA, CA – Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce the continued success of its initiative to recruit and develop young engineering talent. Building on the momentum from last year’s hiring of two recent college graduates, Absolute EMS has expanded the program with the addition of a third newly graduated engineer to its team.

Absolute EMS’s investment in young, enthusiastic engineering graduates is already exceeding expectations. The first two hires have quickly distinguished themselves, advancing within the organization and bringing fresh perspectives, innovative ideas, and a contagious enthusiasm for manufacturing.

Recognizing the industry-wide concern about the shortage of young professionals entering the manufacturing sector, Absolute EMS is proud to be part of the solution. By offering opportunities for professional development, mentorship, and hands-on experience, the company is helping foster the next generation of engineering leadership.

The first two engineers played an active role in interviewing, onboarding, and mentoring the newest team member. Their collaborative approach has fostered strong synergy, pride, and a deep sense of responsibility — fueling daily learning, growth, and innovation across the team.

“We’re incredibly proud of how these young engineers have embraced the challenges and opportunities at Absolute EMS,” said Doug Dow, COO at Absolute EMS/ “Their success shows the incredible potential that emerges when you invest in people early in their careers and create an environment where they are empowered to grow and lead.”

Absolute EMS is proud to operate a 4.0 manufacturing facility that combines cutting-edge technology with an emphasis on lean processes and continuous improvement. With certifications including ISO 13485, AS9001D, and ISO 9001, Absolute EMS continues to lead the charge in providing high-precision electronics manufacturing solutions (EMS).

For more information about Absolute EMS, visit www.absolute-ems.com.

SANTA CLARA, CA – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced it has expanded its manufacturing line, adding two advanced systems designed to support the industry’s most demanding microelectronics applications. The newly installed LPKF CuttingMaster 2127 ultraviolet (UV) laser depaneling and Koh Young aSPIre 3 automated solder paste inspection (SPI) systems bring heightened flexibility, quality, and throughput to the company’s advanced, best-in-class assembly process offerings.

The new tools represent key next steps in Promex’s efforts to enable continued high-level integration – from the chip/wafer level all the way to finished boards – on a wide variety of substrate materials. “These investments reinforce our commitment to helping customers build more advanced, compact, and reliable electronic assemblies,” said Dave Fromm, chief operations officer, Promex. “Together, the new laser and SPI systems expand our core capabilities and allow us to deliver higher quality, yield, and consistency—from prototype to production—reflecting our commitment to not just meeting but staying ahead of industry and customer needs.”

UV laser depaneling

The LPKF CuttingMaster 2127 system delivers ultra-precise UV laser singulation, micromachining, and cutting for a wide range of organic and composite materials common in many microelectronics products, especially those employing heterogeneous integration to co-package electronic and non-electronic components. Materials processed include polyimide and liquid crystal polymer (LCP) flexible circuit boards, FR4 circuit boards, organic/laminate substrates and interposers, and overmolded plastics/composites. With a <20 µm spot size and ±25 µm positional accuracy, the laser allows engineers to design boards with complex form factors and tighter layouts. This precision reduces up to 30% of dead space between components on the panel, maximizing design efficiency.

Enabling clean, stress-free singulation of flex and rigid-flex circuits is key to meeting customer demand for chip-on-flex and flexible packaging solutions. Offering this capability in-house allows Promex to improve turnaround times, enhance process control, and ensure consistent quality for critical applications.

Inline SPI metrology

To meet the stringent demands of fine-pitch surface mount technology (SMT), Promex has also added the Koh Young aSPIre 3 SPI system. Designed to perform 100% inline metrology, the system inspects solder paste deposits at every location on every panel—across rigid and flexible substrates—capturing detailed statistical data and building paste libraries for each design.

This data-driven approach delivers the highest standard in the True 3D SPI market, enhancing yield, enabling predictive quality control, and supporting tighter process windows essential to assembly of advanced components such as ball grid arrays (BGAs), chiplets, and high-density interconnects. These capabilities are especially critical for advanced assembly on thin, flexible circuit boards, where solder printing cannot be assumed to be consistent across the print area (as it would be for traditional, rigid circuit boards).

The new tools are already in use at the Promex site, supporting customer programs in emerging areas such as artificial intelligence, medical electronics, and space systems. Combined with the company’s existing laser micromachining and advanced assembly capabilities, they position Promex to deliver fully integrated, high-quality solutions at scale.

About Promex

Promex Industries, Inc. specializes in advanced design, packaging and assembly services for key subsystems used in a wide range of applications, such as optical, photonics, diagnostics, life sciences, medical and MEMS devices. The company is skilled at heterogeneous integration of tiny components with unique functionality and complex, custom or detailed assembly requirements. Founded in 1975, Silicon Valley-based Promex provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services provided in the company’s Class 100/Class 1000 cleanrooms include RoHS-optimized SMT, wafer thinning, dicing, die bonding, wire bonding, flip chip, and combining microelectronic and non-microelectronic components. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. https://promex-ind.com/

PEORIA, AZ – HyRel Technologies , a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.

This year’s intern class includes Lily Neal, Kaylee Browning, and Veronica Macke—each bringing unique strengths, ambition, and creativity to the HyRel team. From SolidWorks design and 3D printing to accounting and machine component innovation, these interns represent the future of engineering and tech talent.

“What we’re seeing is the result of creating the right environment,” said Brian Watson, Founder, HyRel Technologies. “We’re incredibly proud of our interns—this program is not just about introducing them to careers; it’s about watching them grow into young professionals who already rival early-career engineers.”

Lily Neal began her internship in October 2024, focusing on accounting. What started as a learning opportunity quickly turned into a permanent role at HyRel, where she now balances bookkeeping responsibilities and hands-on work with taping parts. Lily credits HyRel’s supportive culture and flexible scheduling for helping her manage the demands of her senior year while gaining valuable experience.

She plans to pursue a degree in accounting at Arizona State University and continue working with the team that helped launch her career. Kaylee Browning has proven herself as a rising engineering talent. She’s led the design of the base platform for HyRel’s upcoming VersaCell system, producing work that closely aligned with the company’s mechanical engineering team. She’s tackled complex SolidWorks projects, including designing a custom machine cover for a fluxer using unfamiliar components like gas struts and quarter-turn fasteners—skills she mastered through independent research and problem-solving.

Veronica Macke, an aspiring mechanical engineer, has hit the ground running. She’s already gained hands-on experience in 3D printing and manufacturing tray design for HyRel’s assembly process. Veronica values HyRel’s strong mentorship culture and plans to study Mechanical Engineering at Northern Arizona University, where she will also participate in the Air Force ROTC program. “HyRel is my first stepping stone to a great career,” she shared. “I will be forever grateful for the experience.”

What makes this year’s class even more special is the organic connection to HyRel’s extended family: some of the interns are friends of former HyRel high school interns now pursuing engineering degrees at ASU—proof that the program is building not only skills but a powerful pipeline of young talent.

Adding to this momentum, HyRel recently secured a paid engineering internship through ASU’s Blackstone LaunchPad program, further expanding opportunities for college students and reinforcing the company’s dedication to real-world learning. HyRel is dedicated to not only advancing its business but also to fostering the growth and potential of individuals who will shape the future of the semiconductor industry. For more information about HyRel’s innovative internship program and its dedication to community engagement, visit www.HyRel.tech .

About HyRel Technologies

HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HyRel provides robotic hot solder component tinning, component solder ball removal and replacement, component tape and reel packaging services and component bake and dry pack services to customers worldwide. HyRel is also developing proprietary micorobotic innovations to elevate the speed, reliability, and safety of standard semiconductor processes. For more information about HyRel Technologies, please visit www.HyRel.tech .

ROLLING MEADOWS, IL – BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

BEST’s EZReball™ is a reballing preform that consists of an array of solder spheres positioned with a high-temperature polyimide stencil and an adhesive-backed carrier to hold the solder balls in their precise location. These preforms can be made quickly without tooling charges in almost any possible array pattern, including various solder alloys, lead pitches, and ball diameters.

Our EZReball™ preforms are simple and easy-to-use for reballing BGAs. BEST’s EZReball preforms are manufactured from a specialty high temperature-rated film which aligns the balls with the corresponding array. The preforms are cut using a precision laser to meet exacting device requirements. Solder balls are captured and retained by the preform and are aligned to the prepped BGA device and reflowed. After reflowing the preform is simply peeled away. EZReball™ performs can be used on the smallest pitch CSPs and BGAs with pitches down to 0.35mm and ball sizes down to 6 mils.

A significant benefit of the EZReball™ process is that the reballing preforms will accurately place a new array of solder balls relying on simple physical properties rather than requiring operator dexterity or skill. With other reballing methods that use loose solder spheres you can typically process only one component at a time.

Using the EZReball™ preforms, you can process several parts at the same time with only a few minutes of labor. Based on time studies of reballing 10 or more devices, EZReball™ method has shown to be 30% faster than other reballing methods using metal stencils. EZReball™ is in full compliance with the IPC 7711/21 Procedure 5.7.6. for BGA rework processes as one of the methods for reballing a BGA and allows for better yields and faster reballing times.

About BEST Inc.

BEST Inc. is an ISO 9001:2015 and ITAR certified provider of BGA reballing, PCB and component rework services, focusing on quality, reliability, and sustainability. With a commitment to innovation, and customer satisfaction, we leverage advanced technologies to deliver comprehensive solutions for the electronics industry.