Press Releases
FREMONT, CALIFORNIA ― Anda Technologies, a leading provider of fluid application and custom automated manufacturing equipment, will showcase its latest innovations at Booth 1038 during the 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Anda Technologies will be highlighting their large platform machines, emphasizing the capabilities of the iCoat-5 JetSelect Ultra High Precision Conformal Coating Machine, the AP-3P Inline Atmospheric Plasma Treatment System, and the UV-2 Curing System featuring new UV light safety doors.
iCoat-5 JetSelect Ultra High Precision Conformal Coating Machine
Anda Technologies introduces the iCoat-5 JetSelect, a revolutionary solution addressing the escalating demands for precision in conformal coating applications. This cutting- edge system integrates state-of-the-art jetting valve technology with advanced coating valves, delivering unmatched accuracy in areas requiring precision while ensuring enhanced speed in less stringent regions.
Key features of the iCoat-5 JetSelect include:
- Micro coating facilitated by the JET-8600 pneumatic jetting valve.
- Gantry running accuracy of ±0.02 mm (20um) (±0.0007”).
- Five axes of movement (X, Y, X, U rotation) and 35º tilt.
- Single-head rotational turret design supporting up to three valves.
- One fixed JET-8600 jetting valve and two coating valves with tilting ability arranged in various nozzle configurations.
AP-3P Inline Atmospheric Plasma Treatment System
Featuring servo motors and a high-speed ball screw linear actuator system, the AP-3 machines ensure unmatched precision. The AP-3P model, equipped with a single plasma nozzle positioned above the substrate, excels in treating, cleaning contaminants, and activating surfaces, enhancing surface energy critical for optimal coating and adhesive adhesion.
UV-2 Curing System with UV Light Safety Doors
Anda Technologies introduces the UV-2 Curing System with newly designed UV light safety doors. The system's innovative doors, situated at the entry and exit ends, open and close to allow product movement while minimizing exposure to harmful UV rays, ensuring an added layer of protection for operators.
Visit Anda Technologies at Booth 1038 during the 2024 IPC APEX EXPO to experience firsthand the capabilities of these cutting-edge machines, and explore how they elevate precision and efficiency in conformal coating and plasma treatment applications.
To learn more, visit www.anda.us
NORTH READING, MA ― Accu-Assembly Inc., a leading industrial automation company, is set to exhibit at the upcoming 2024 IPC APEX EXPO, scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Accu-Assembly will be exhibiting its revolutionary AccuLiFT SMT Component Reel Vertical Modular Storage and Retrieval System at Booth 4030.
The AccuLiFT system has redefined SMT component reel storage and retrieval, setting new standards for efficiency and adaptability. With a focus on rapid changeover and user-friendly operation, the AccuLiFT empowers manufacturers to seamlessly interchange small and large reels on the storage pallet, offering unprecedented operational flexibility.
Key Features of AccuLiFT:
- Automation Excellence: The AccuLiFT employs a robotic workcell for automated loading/unloading of reels from reel stacking units, eliminating the need for manual intervention. This key feature maximizes throughput with fast cycle times and exceptional accuracy.
- Impressive Capacity: The base unit alone can store up to 3,800 7” reels, and the system offers the option to integrate two additional vertical storage units, resulting in an astonishing total storage capacity of up to 8,300 reels. The reels are securely housed on durable pallets with a robust steel frame and ESD plastic trays for comprehensive protection.
- VLM Technology: Leveraging Vertical Lift Module (VLM) technology, the AccuLiFT ensures efficient parts storage and retrieval. Its modular design enables seamless vertical expansion, optimizing floor space as manufacturers require additional reel storage. The Direct Drive Technology with auto correction eliminates the need for calibration.
- Automated Dual-Level Robotic Station: The AccuLiFT features an automated dual- level robotic reel loading/unloading station, allowing efficient loading and unloading of reels. This innovation significantly reduces cycle times and enhances overall operational efficiency.
- Input Stacking Units: The capability to automatically load up to 200 reels at a time for loading into the AccuLiFT.
- Advanced Barcode Scanning: The system integrates automatic barcode scanning of all reels on the pallet and automatic reel thickness detection, enhancing accuracy and reliability. Multiple job sorting capabilities enable faster kitting processes.
- Flexible Software Interface: AccuLiFT's flexible software interface facilitates seamless integration with SMT placement equipment and MES/ERP systems, showcasing Accu- Assembly's proficiency in software development and interfacing with various databases.
Visit Accu-Assembly at Booth 4030 during the 2024 IPC APEX EXPO to witness the future of SMT component reel storage and retrieval.
The AccuLiFT is proudly manufactured in the USA.
For more information about Accu-Assembly’s automation and productivity solutions, visit www.accuassembly.com
SAN DIEGO, CA – Intraratio, the leading provider of Advanced Manufacturing enterprise software solutions, announces its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Intraratio is set to exhibit its cutting-edge smart manufacturing and Industry 4.0 solutions that redefine visibility, traceability, and control in Semiconductor and Surface Mount Technology (SMT) electronics manufacturing operations in Booth 2342.
With customer testimonials for excellence, Intraratio offers a comprehensive suite of solutions designed to enhance, manage, and optimize electronics manufacturing processes and drive operational efficiency.
Their featured solutions include:
Seamless Factory and Equipment Integration (Data Automation/IoT) for AI/ML: Intraratio establishes seamless connectivity between factories and equipment, eliminating the need for third-party software or middleware. Deployable in 12 weeks or less. This cost-effective and robust integration forms the foundation for data-driven decision-making, and the application of AI/ML.
Full-Featured Manufacturing Execution System (MES/RunCard): Intraratio's MES solution, RunCard, optimizes manufacturing processes, streamlining operations and enhancing overall efficiency, with direct AI/ML integration.
Serialized Product Traceability: Intraratio empowers manufacturers with end-to-end product traceability, ensuring quality and compliance throughout the production lifecycle.
Real-Time IoT, Yield and Quality Monitoring (DataCard): With DataCard, Intraratio provides real-time visibility into IoT, yield and quality data, enabling proactive measures to enhance product quality, reduce waste, and the ability to leverage AI/ML.
Global Supplier Data Management (ServiceCard): ServiceCard simplifies global supplier data management, fostering collaboration and efficiency in the supply chain.
These solutions are enriched by state-of-the-art Machine Learning (ML) based analytics, facilitating outlier detection and predictive maintenance. Intraratio’s offerings are meticulously designed to accelerate the digital transformation journey of customers in the electronics manufacturing industry.
Visit Booth 2342 at the 2024 IPC APEX EXPO to experience firsthand how Intraratio’s advanced manufacturing software solutions revolutionize operational visibility, traceability, and control, setting new benchmarks for excellence in the industry.
For more information about Intraratio, visit www.Intraratio.com
SHINGLE SPRINGS, CA – PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.
The PDR IR-E3 is an advanced rework station designed to cater to BGA/SMT components with precision and efficiency. This cutting-edge system boasts key features such as advanced focused IR component heating, quartz IR PCB preheating with up to 3 zones, and a Split Beam prism system enabling simultaneous PCB/component viewing.
The station ensures precision in component placement up to 10um, precise PCB handling, and includes a Component Nest/Flux Application Facility. With closed- loop non-contact temperature sensing, advanced automatic thermal process control, a reflow process observation camera, and PCB forced air cooling, the IR-E3 streamlines the rework process, setting a new standard for accuracy and control across a diverse range of components.
Additionally, PDR will showcase the GenX-90P, an ultra-high- performance X-ray system designed for precision inspection.
Key features include:
- Compact system, accommodating PCB sizes up to 21” (533mm) X 17.5” (445mm)
- Customizable Flat Panel Detectors or Image Intensifier options
- 90kV, 8 Watt, 4um X-Ray tube, 0.18mA with Magnification up to 1100X
Primarily designed for BGA inspection and analysis, counterfeit inspection, porosity/voiding detection, medical device inspection, wire bond inspection, and LED inspection, this system ensures precise and reliable results. With radiation levels less than 1 uSv/hr (0.1 mR/hr) and compliance with USFDA 21 CFR-1, J-1000, 1020.40 standards, it prioritizes safety in all operations. The GenX-90P is equipped with programmable 4-axis (X, Y, Z1/Z2) fully motorized motion control, facilitating comprehensive inspection capabilities. Its BGA/QFN/Flip Chip software includes Pass/Fail criteria, Sphere Size, Void analysis, and a 3D Gray Scale Option.
Visit PDR at Booth 3829 during the IPC APEX EXPO to explore these groundbreaking solutions and learn more about how PDR is shaping the future of electronic rework and inspection.
For more information about PDR Rework and its innovative solutions, please visit www.pdr-rework.com
CLINTON, NY – Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.
Tuesday, Apr. 9
- Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve up to 25% Energy Savings presented by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch, in partnership with Daniel Hamann, SMT Thermal Discoveries
Wednesday, Apr. 10
- Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies presented by Product Specialist Evan Griffith, in partnership with Kalyan Nukala, Zestron Americas
- Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing presented by Product Development Specialist for Thermal Interface Materials Miloš Lazić, in partnership with Sunny Agarwal, ITWEAE
- The Attempt of Lower Temperature Soldering Process for Large Plastic Ball Grid Array Board-Level Assembly presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. HongWen Zhang
- Optimization of Photonic Soldering Processes for SIR Performance co-authored by Technical Support Engineer Thuy Nguyen, presented by Ara Parsekian, PulseForge, Inc.
- Liquid Metal Patterning for Electronic Circuits and Thermal Management co-authored by Miloš Lazić, Associate Director ESM Product Management Jon Major, and Material Research Scientist Dr. Ricky McDonough; presented by Michael Dickey, North Carolina State University
Thursday, Apr. 11
- Panel Discussion: PCBA Reliability and Test for EV Applications featuring Principal Engineer, Global Accounts Technical Manager, Dave Sbiroli
Click here for an interactive schedule of all presentations taking place at IPC APEX 2024 and be sure to visit with Indium Corporation’s experts at booth 4227.
Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
Griffith is a Product Specialist for Indium Corporation’s Semiconductor and Advanced Assembly Materials product line, which includes Indium Corporation’s fine-powder solder pastes (SiPastes) and semiconductor assembly fluxes. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned a Master of Engineering Management, Bachelor of Engineering in Materials Science and Engineering, and a Bachelor of Arts in Engineering Sciences and French, graduating with honors, all from the Thayer School of Engineering at Dartmouth College. He has also earned his Lean Six Sigma Green Belt from Dartmouth College and has received certifications in Product Management from Columbia University and Product Marketing from Cornell University.
Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.
As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of the varieties of Pb-free solder materials and the associated technologies for low-temperature, high-temperature, and/or high-reliability applications. He was instrumental in inventing the Durafuse® technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. Dr. Zhang has published two book chapters and more than 50 conference and journal papers, and he has been granted more than ten patents in the U.S. and globally. Dr. Zhang was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2023.
Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials. She holds a bachelor’s degree in chemistry from Utica College and is a Certified SMT Process Engineer (CSMTPE).
As Principal Engineer, Sbiroli utilizes his experience to characterize soldering materials’ critical performance attributes and assist in the development of new materials and accelerated test methods to augment their critical performance. As the Technical Manager of Global Accounts, he is also responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
SAN JOSE, CA ― SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
In response to the escalating demands for heightened product reliability and safety in automotive electronic components, SHENMAO proudly presents comprehensive solutions tailored to meet the specific needs of the automotive electronics industry.
SHENMAO will introduce the PF918-P250A Thermal Fatigue Resistance No-Clean Lead-free Solder Paste, meticulously formulated with the groundbreaking SHENMAO Sn/4Ag/3Bi Alloy. This innovative alloy is engineered for high thermal impact reliability, ensuring the longevity of electronic products with stringent reliability requirements. Notably, it excels in voiding performance and printability, mirroring the melting point of SAC305 for seamless integration into existing SAC305 reflow profiles. With its cutting-edge flux design, voiding is effortlessly controlled to less than 10 percent.
Furthermore, extensive Board level thermal cycling tests, utilizing an actual automotive IC product, reveal that the thermal cycling life of PF918 surpasses that of the SAC305 alloy, doubling its longevity. PF918-P250A enhances thermal reliability performance by a minimum of 30 percent, demonstrating superior mechanical shock resistance compared to typical solder alloys like SAC305 and SAC405. This solder paste is ideal for various applications, including consumer electronics, high-power components, servers, and automotive electronics.
Supplementing this advanced offering is the PF606-P250 No-Clean Lead-free Solder Paste, featuring the widely used Sn/3Ag/0.5Cu Alloy. PF606-P250 stands out with its impressive solderability, printability, and voiding performances, while remaining compliant with RoHS, RoHS 2.0, and REACH standards.
For those prioritizing water-soluble options, the PF918-PW216 Thermal Fatigue Resistance Water-Soluble Lead-free Solder Paste is specially designed for water cleanability. Formulated with the newly designed high-reliability lead-free alloy (Sn/4Ag/3Bi), it achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. Its innovative flux design ensures outstanding voiding performance, allowing it to seamlessly follow the regular SAC305 reflow profile. This solder paste caters to the needs of consumer electronics, servers, automotive electronics, and electronic products with extended service life and high reliability requirements. Also available is the PF606-PW216 Water-Soluble Lead-free Solder Paste, which adheres to the commonly used Sn/3Ag/0.5Cu Alloy, offering excellent cleanability, solderability, printability, and voiding performance.
In order to enhance the solder joint protection, SHENMAO has launched two specialized products with built-in epoxy. The Joint Enhanced Solder Paste (JEP) PF606-EP305 seamlessly combines the advantages of conventional solder paste and anisotropic conductive paste, delivering self-alignment and planar insulation. JEP facilitates soldering and joint encapsulation in one-step reflow, featuring a new epoxy-based solder material designed for very fine pad size (70 μm) soldering. It is compatible with various surface finishes, leaving a transparent residue, and requires no cleaning. SHENMAO’s JEP is eco-friendly, boasting both lead-free and halogen-free attributes, meeting J-STD and IEC standards.
Finally, the SMEF-Z52 Active Epoxy Flux is designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator eliminates solder balls, ensuring smooth solder joints. Post-reflow, the epoxy flux residue cures to provide mechanical support to the joint. Epoxy clad in solder joints after curing shields and strengthens joints by 30 percent compared to conventional rosin flux. This newly designed flux requires no cleaning and exhibits exceptional compatibility with molded underfill (MUF) and capillary underfill (CUF). SMEF-Z52 is well-suited for various IC packages, including system-in-package (SIP), wafer-level-package (WLP), and flip-chip technologies.
SHENMAO’s advanced pastes and fluxes are compliant with RoHS, RoHS 2.0, and REACH standards.
Visit SHENMAO at the 2024 IPC APEX EXPO to experience firsthand the innovative solder technology driving the future of automotive electronics manufacturing.
For more information, please visit www.shenmao.com
