Merrimack, NH – Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility. This investment significantly enhances Microsembly’s fine-pitch interconnect and high-power bonding capabilities—supporting expanding customer demand across aerospace, defense, medical, and telecom markets.

The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond bonders, and a Besi Datacon 2200 Evo Bonder. They’ve also added a Palomar SST 5100 Vacuum Pressure Furnace for void free eutectic die attach.

With this equipment, Microsembly delivers a full spectrum of wire bonding and die attach services for the manufacturing of RF/microwave PCBAs used in complex mixed technology RF/microwave assemblies.

Wire and Ribbon Bonding and Die Attachment capabilities enabled by these systems include:

• Gold (Au) ribbon bonds as small as .002” x .0005”
• Au wedge bonds down to .0007” on FETs, MMICs
• Au ball bonds and stitch-on-ball (SOB) bonds down to .0007”
• Quad diode package bonding with Au ribbon bonds down to .003” x .00025”
• Conductive epoxy die attach bond line thicknesses as little as .002”
• Combination bonds including ball, stitch-on-ball, and ribbon bonding
• Omega wrap (Double-C) ribbon bonds on feedthroughs
• Beam lead tacking with waffle patterning
• Cross bond stitching on ultra-small mesa diodes
• Precise MMIC-to-capacitor interconnects
• Void Free Eutectic Die Attach

“These machines not only add speed and repeatability but also allow our technicians to perform extremely precise and specialized bonds critical to high-reliability systems,” said Phuong “Kent” Dang, President at Microsembly. “From ultra-fine interconnects on microwave dies to rugged ribbon bonds on high-power components, we can handle a wide range of RF and microwave assembly challenges with confidence.”

This enhanced wire bonding and die attach suite supports Microsembly’s vertically integrated model, offering everything from initial design and prototyping to high-frequency testing and full-volume production. Customers benefit from rapid development cycles, U.S.-based manufacturing, and proven quality assurance processes built for mission-critical environments.

HUTTO, TX – May 2025 – ViTrox Americas Inc. is pleased to announce the launch of the ViTrox Training Center (VTC) at its ViTrox Demo Center (VDC) in Hutto, Texas. The new VTC enhances the customer experience by pairing hands-on training with access to ViTrox’s most advanced smart Inspection solutions and automation technologies.

The VTC provides dedicated, in-person training sessions on ViTrox’s latest systems, including SPI, AOI, AXI, and ARV platforms, using the high-end equipment featured in ViTrox’s expanded VDC. Each training session is limited to 1-4 trainees for personalized instruction and takes place during the first month of every calendar quarter.

Q3 2025 Training Schedule:

• SPI SMT Basic Training: July 7-11
• AOI SMT Basic Training: July 28-August 1
• AXI SMT Basic Training: July 14-18
• ARV V9i Basic Training: July 21-25

Advanced training is available upon request, and custom or dedicated sessions can be arranged based on availability.

Training takes place at ViTrox’s Demo Center, which now features cutting-edge systems such as the V510i 3D MicroAOI, V510i DST Dual-Side AOI, V9i XL for large-format ARV inspection, and the V97i with flipper conveyor for post-solder and final assembly inspection. With access to a full lineup of 3D SPI, SMT AOI, AXI, and ARV systems – plus software solutions like V-One SPC, V-OLP, and VVTS Review – trainees gain valuable hands-on experience in a real-world manufacturing environment.

“With the launch of the VTC, we’re not just showcasing technology, we’re empowering our customers to use it to its full potential,” said Sy Creed, Business Development Director at ViTrox Americas. “Pairing world-class training with our state-of-the-art Demo Center allows users to gain hands-on experience with the latest ViTrox innovations, from advanced 3D AOI to automated final inspection. It’s a complete ecosystem for skill-building, process improvement, and real-world problem-solving.”

Whether onboarding new personnel or upskilling seasoned engineers, the VTC provides the knowledge and confidence operators need to maximize system value and achieve production goals.

To view the full quarterly training schedule through early 2026, visit www.vitrox.com or contact the team directly.

NEWELL, VA – ATC Diversified Electronics, maker of a broad range of devices for automation, motor protection, electrical safety, and power quality, makes remote process monitoring effective and affordable with SENSERT. With this cloud-based monitoring and alert system, a variety of sensors can be wirelessly connected via remote I/O or hardwired directly to the SENSERT base unit.

SENSERT works with any commercially available sensors that conform to the following parameters: 0-20 milliamp, 4-20 milliamp, 0-5 volt, or 0-10 volt. The system can monitor a variety of conditions including temperature, humidity, vibration, pressure, and more. Data is monitored in real time and can be accessed via web portal or mobile app. Alerts are triggered based on customizable thresholds.

SENSERT is appropriate for a wide range of applications, including agriculture, food and beverage, manufacturing, water/wastewater, and medical.

A manufacturer of cardboard cartons recently piloted SENSERT in its plant to help prevent unscheduled outages of one of its box-making machines. SENSERT was able to narrow the issue to worn bearings in an exhaust fan that removes dust particles from the machine.

By detecting the signs of bearing wear, maintenance teams are now able to schedule bearing replacement at convenient times and prevent shutdowns that were costing upward of $30,000 annually in lost productivity. The manufacturer now plans to deploy SENSERT in other machines throughout the plant.

To read a case study on this pilot program, visit Application Briefs online.

HARRISBURG, PA ― Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.

EcoClaim™ offers a streamlined approach to managing waste streams such as solder dross, metals, e-waste, and used containers, including plastics, helping companies meet their sustainability goals without disrupting operations.

“As sustainability becomes a priority across the electronics industry, manufacturers are looking for smarter ways to manage waste and reduce their environmental footprint,” said Jeremy Wagner, President & CEO at CE3S. “EcoClaim is our answer to that need: a simple, no-hassle solution that brings together efficiency, environmental responsibility, and compliance.”

The EcoClaim™ program includes:

• Free assessments
• Collection and processing of recyclable materials includingoingg solder, dross, metal scraps, e-waste, and flux containers
• Rebates on certain recovered materials, creating value while reducing waste
• Certificate of Recycling and other necessary documentation provided for compliance and reporting

EcoClaim™ is designed to support companies of all sizes – from high-volume EMS providers to niche OEMs – by offering a flexible solution that fits into any production environment. Whether a company is seeking to enhance its ESG initiatives or simply reduce disposal costs, EcoClaim™ makes it easy to act.

To learn more and request a pick-up, visit: https://ce3s.productionsupplystore.com/recycling.

For more information about CE3S, please visit www.ce3s.com or contact sales@ce3s.com.