PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to exhibit at SMTA International 2024, taking place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. The company will showcase the advanced capabilities of the HR 600 XL rework system in Booth 3029.

The Ersa HR 600 XL is engineered for professional rework of BTC components on large board assemblies. Its impressive heating area of 24.6 x 24.6 inches and fixturing of PCB’s up to 10 mm thick make it ideal for rework in multiple business segments such as military, aerospace, telecommunication, network, and infrastructure.

Key features of the HR 600 XL include:

• Bottom-Side IR Matrix Heater™: The 15-kW heater consists of 25 individually controllable heating elements, allowing for precise heat distribution tailored to each specific application.
• Hybrid Heating Head: A highly efficient 2,800 W heating head ensures Ersa-quality desoldering or installation of components, from chip resistors to 120 x 150 mm BGAs or sockets.
• Auto Scavenger: Non-contact residual solder removal can automatically occur immediately following the component removal without adding an additional heat cycle to your process.

Visit Kurtz Ersa at Booth 3029 to find out more about the Kurtz Ersa line of reworks systems and discover just how easy rework can be.

For more information about Kurtz Ersa Inc., visit www.ersa.com 

OXFORD, CT – MIRTEC, ‘The Global Leader in Inspection Technology’, is excited to announce its participation in the highly anticipated SMTA International 2024, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI- VISION ® 3D Inspection Technology in Booth #2834.

Leading the Way in Innovation

MIRTEC will display its Award-Winning MV-6 OMNI 3D AOI Series at the SMTAI 2024. The MV-6 OMNI series features MIRTEC’s state-of-the-art OMNI-VISION ® 3D Inspection Technology, which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC's revolutionary Digital 12 Projection BLUE Moiré 3D Technology. This innovative combination delivers unparalleled accuracy and performance.

Precision and Performance through Proprietary Technology

The proprietary Ultra-High Resolution CoaXPress Vision System, meticulously designed and manufactured by MIRTEC, stands as the cornerstone of the company's 3D inspection systems. Powered by MIRTEC's Digital 12 Projection Digital BLUE Moiré Technology, the MV-6 OMNI machines offer true 3D inspection, providing precise height measurement data crucial in detecting lifted component and lifted lead defects, as well as post-reflow solder volume. The fully equipped MV-6 OMNI machines are configured with four 10MP or 18MP Side-View Cameras, a 15MP or 25MP CoaXPress Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.

Empowering the Future with AI

MIRTEC’s INTELLI-PRO Smart Factory Automation Solution, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning Based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

"We look forward to showcasing our Leading-Edge Inspection Solution at this year’s SMTAI Exhibition,” stated Brian D'Amico, President of MIRTEC’s North American Sales and Service Division. “We invite attendees to join us at this upcoming event to experience the future of Inspection Technology first-hand and to explore how MIRTEC can help them to achieve the highest levels of Quality, Efficiency and Profitability."

OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to announce that it will exhibit its TempSave series in Booth #2850 at the SMTA International Exposition, scheduled to take place October 22-24, 2024 at the Donald E. Stephen Convention Center in Rosemont, IL. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C and can be used for wave soldering. While TempSave B37 is a ductile hypoeutectic SnBi alloy and can be reflowed with a peak temperature of 190°C. Additionally, the high-speed jetting paste version, TempSave B37 P611, is available and ensures consistent dot sizes.

High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys.

LF-C2 P608 is a completely halogen free, lead-free, low voiding solder paste. The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.

SN100CV® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver- containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag 3 Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305.

The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 P608 both deliver excellent performance over a wide range of component types and process parameters.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english 

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce plans to exhibit at SMTA International 2024, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees are invited to visit KYZEN in Booth 2717 to discover the latest innovations in process control and cleaning chemistry, featuring the combination of Process Control Systems (PCS and ANALYST²) and the highly effective AQUANOX A4727.

KYZEN's Process Control System (PCS) and ANALYST² are designed to provide unmatched precision and reliability in cleaning processes. These systems ensure that all parameters are meticulously monitored and controlled, leading to consistent, high-quality results. By integrating PCS and ANALYST² , manufacturers can achieve superior process control, reducing defects and enhancing the overall efficiency of their operations.

KYZEN’s AQUANOX A4727 has been lab and field-tested in spray-in-air processes and has proven effective on all solder flux residues, including the most difficult Pb-free and no-clean formulations. Additionally, the cleaning chemistry is well-known for its effectiveness in ensuring data center reliability.

In the demanding environment of data centers, all systems and components must perform their required roles 24/7/365 ~ among the most demanding in the world. AQUANOX A4727 plays a critical role in this by ensuring that all printed circuit boards (PCBs) used in these systems are thoroughly clean and residue-free. This high level of cleanliness directly contributes to the reliability and longevity of data center components, meeting these highest in the industry performance standards.

KYZEN’s recent research emphasizes the value of thorough cleaning in maintaining the integrity and reliability of PCBs regardless of end use. AQUANOX A4727 has been proven to remove even the most stubborn residues, ensuring that PCBs are completely clean and capable of meeting the most stringent reliability standards in the industry.

KYZEN invites all attendees to Booth 2717 to experience how their combination of advanced process control systems and cutting-edge cleaning chemistries. Visitors will have the opportunity to learn more about how the combination of PCS, ANALYST² and AQUANOX A4727 can elevate their cleaning standards and ensure the highest levels of reliability.

Join KYZEN at SMTA International 2024 to discover innovative solutions that are driving the future of process control and cleaning in the electronics manufacturing industry.