AUSTIN, TX – Austin American Technology (AAT) & Aqua Klean Systems (AKS) is thrilled to announce its participation in the 2025 IPC APEX EXPO, taking place March 18-20, 2025 at the Anaheim Convention Center in Anaheim, California. At Booth 2626, AAT will showcase an inline cleaner, a batch cleaner, and the groundbreaking X-30A Fully Automatic Stencil, PCB, & Misprint Cleaner.

The state-of-the-art X-30A is the first electronic cleaning system to fully incorporate SMART I/O Link devices, earning its distinction as the industry's most advanced and "SMARTEST" cleaning solution. Designed for versatility, the X-30A employs a Vertical Format Batch Cleaning System that supports a variety of cleaning agents, including aqueous, semi-aqueous, alcohol-based, and hybrid solvents. This flexibility makes it an ideal choice for removing flux residues, solder pastes, inks, adhesives, and other contaminants from PCBs, stencils, and production tooling.

The X-30A offers groundbreaking features, including patented rotational spraying technology that generates dynamic zones of force for superior cleaning results. Its innovative design also prioritizes environmental and safety concerns with filtration systems and selectable open-loop or closed-loop configurations. Fully automated, the X-30A seamlessly integrates washing, rinsing, and drying cycles, eliminating manual intervention and enhancing operational efficiency. To optimize valuable floor space, the system features a compact design with a low-profile automated lift, making it one of the most efficient cleaning solutions on the market.

In addition to the X-30A, AAT/AKS will present both its Typhoon Inline Cleaning and batch cleaning systems, showcasing a comprehensive suite of solutions that cater to the diverse needs of electronics manufacturers. These systems underline AAT’s dedication to advancing cleaning technology and delivering solutions that drive productivity while addressing environmental sustainability.

Attendees of IPC APEX EXPO 2025 are invited to visit Booth 2626 to see these systems in action and discover how AAT’s solutions can transform manufacturing operations.

For more information about Austin American Technology, please visit www.aat-corp.com 

HANAU, GERMANY – Heraeus Electronics is pleased to announce its participation in the 2025 IPC APEX EXPO, taking place March 18–20, 2025, at the Anaheim Convention Center in Anaheim, California. Attendees can visit Heraeus at Booth 3702 to explore its latest innovative solder paste solutions, including the Microbond® SMT660 Innolot®, SMT650, and SMT712 series. There will also be the new module attach sinter past mAgic® PE360 on display for large area sintering.

Microbond® SMT660 Innolot®: High-performance Solder Paste

SMT660 Innolot® paste stands for highly reliable, high- performance paste with a competitive Total Cost of Ownership (TCO) offering. Innolot® is a well-known alloy, allowing for higher creep resistance, resulting in longer product lifecycles at higher operating temperatures. The SMT660 Innolot® solder paste performs in air without additional N2 during reflow, while keeping defects low, reducing your TCO. This specifically means reduced pin and blowhole behavior, very low BGA voiding and low area voiding.

Microbond® SMT650: High-Reliability Solder Paste

Heraeus Electronics will also showcase the SMT650, designed to meet the needs of miniaturized systems in the automotive industry. This high-reliability solder paste delivers consistently high surface insulation resistance, preventing electrochemical migration. By pairing the new F650 flux system with the Innolot® alloy, the SMT650 provides exceptional performance in challenging applications, enhancing reliability for next-generation devices.

Microbond® SMT712: Excellent General-Purpose Solder Paste

The SMT712 solder paste offers a wide process window and outstanding high-speed printing and wetting properties. Its exceptional ability to minimize head-in-pillow defects during the soldering process makes it an excellent choice for demanding SMT applications across industries.

mAgic® PE360: A new benchmark in Large Area Sintering

A significant challenge in adopting sintering for module attach applications lies in effectively managing large areas. The new mAgic PE360 Silver Sinter Paste tackles this challenge with its superior workability and drying behavior, minimizing voiding in the paste layer. The mAgic PE360 offers enhanced thermal performance compared to traditional soldering methods.

Engineered to deliver a highly reliable joint with exceptional thermal conductivity, this paste overcomes the limitations of conventional soldering techniques. Lead-free and halogen-free, the mAgic PE360 ensures compliance without compromising performance or reliability. Its ability to sinter at very low pressure and temperature levels makes it ideal for sintering finished molded modules, simplifying the manufacturing process compared to conventional sinter pastes for die attach.

Heraeus Electronics is at the forefront of innovation, empowering manufacturers with cutting-edge solutions that meet the dynamic demands of the electronics market. Visitors to Booth 3702 will have the opportunity to engage with Heraeus’ team of experts, explore its wide portfolio, and learn how these products are shaping the future of electronics manufacturing.

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its return to the IPC APEX EXPO 2025, the largest electronics manufacturing event in North America. The event will take place at the Anaheim Convention Center, California, from March 18–20, 2025, where ViTrox will present its full and comprehensive suite of advanced SMT PCBA solutions at Booth #1810.

Attendees will have the opportunity to explore ViTrox’s cutting-edge technologies, including Solder Paste Inspection (SPI), Advanced 3D Optical Inspection (AOI), Advanced 3D X-Ray Inspection (AXI), Advanced Robotic Vision Solutions (ARV), and Industry 4.0 Manufacturing Intelligence Solutions (V-ONE). Complementing these SMT PCB Assembly Solutions, ViTrox will also showcase its VisionXpert solutions - Smart Code Reader and Smart Camera, which redefine precision and efficiency in manufacturing.

In addition, ViTrox is seizing this golden opportunity to unveil two groundbreaking new solutions at IPC APEX EXPO 2025: the V510i Advanced 3D Optical Inspection (AOI) DST and the V510iR (Conformal Coating and Final Inspection)! These innovations are equipped with advanced, intelligent features that promise to revolutionize production lines and deliver unparalleled efficiency and quality control.

Throughout the event, ViTrox’s expert team from both its global headquarters and the U.S. will be available to provide live demonstrations, share in-depth technical insights, and engage in meaningful discussions with attendees.

Discover how ViTrox’s innovative solutions can transform your operations and drive success. Schedule an exclusive consultation with our specialists by visiting Booth #1810 or accessing the link below: [Schedule Your Consultation Here]

Contact us via enquiry@vitrox.com for more information. We look forward to seeing you at IPC APEX EXPO 2025!

PALO ALTO, CA – Arch Systems, a leader in machine data, AI, and analytics for manufacturers, will exhibit at the 2025 IPC APEX EXPO, taking place from March 18-20 at the Anaheim Convention Center in California. Visitors can explore Arch's latest innovations at Booth #1102, where the company will introduce Arch Systems’ Automated Downtime and its collaborative efforts in global electronics manufacturing.

Arch Systems continues to set new standards in manufacturing intelligence through its collaborations with Flex, Jabil, Plexus, HARMAN, and other respected manufacturers. These collaborations have propelled Arch to the forefront of AI-driven solutions, enabling manufacturers to unlock deeper insights and take smarter actions to optimize their operations.

At the IPC APEX EXPO, Arch Systems will unveil the transformative capabilities of Arch AI, designed to optimize manufacturing operations through proactive alerts, intelligent recommendations, and accelerated operator training. A key highlight is the Automated Downtime Labeling feature, which revolutionizes how downtime events are captured, labeled, and acted upon with minimal operator intervention. Leveraging machine learning and human insights, Automated Downtime Labeling provides manufacturers with unprecedented visibility into the root causes of downtime, enabling them to reduce unplanned downtime costs—estimated to total $50 billion annually, according to industry reports—and enhance operational efficiencies.

Arch AI combines the ‘Voice of the Operator’ and the ‘Voice of the Process’ to provide a holistic view of production. It captures and analyzes human insights alongside machine data, creating an evolving knowledge repository that continuously learns and adapts to new operational challenges. This unique approach streamlines workflows, enhances decision-making and drives continuous improvement on the shop floor.

Arch Systems invites attendees to visit their booth to experience firsthand how Arch AI is shaping the future of manufacturing. Discover how these solutions can help streamline operations, reduce costs, and empower teams to achieve higher productivity and quality standards.

For more information about Arch Systems and its AI-powered solutions, please visit archsys.io.