ZION, IL – Stannol, a leader in soldering technology, is pleased to announce its participation in SMTA International 2024, where the company will showcase its latest advancements in soldering technology at Booth 2863. The event is scheduled to take place Oct. 21-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees will have the opportunity to explore Stannol's cutting-edge products designed to enhance performance and sustainability in the soldering industry.
Stannol is proud to introduce its new water-based cleaning line, designed to meet the rigorous demands of modern manufacturing while prioritizing environmental compatibility. The new Flux-Ex series includes broadband and specialty cleaners that are perfectly tailored to their respective areas of application – e.g. for cleaning before the soldering process or for removing residues after soldering. All cleaners are delivered as a ready-to-use-mix.
Stannol's EF180 Bio PV Flux represents a significant advancement in the soldering industry, particularly within the photovoltaic module sector. This bio-flux utilizes renewable raw materials to reduce reliance on fossil fuels, setting a new standard for sustainable manufacturing. Its innovative zero-halogen, resin-free formulation ensures high-quality performance while prioritizing environmental responsibility.
Also on display, Stannol’s Kristall 600-Series and Fairtin and Flowtin solder wires are at the forefront of soldering technology. The innovative use of micro-additives in Flowtin extends the usage of solder tips by up to 30% and enhances the overall quality and durability of solder joints. The Kristall 600-Series, featuring the Fairtin product line, combines synthetic resins and modern activators for fast, safe wetting and minimal, transparent residues, ensuring superior soldering results.
Stannol's solder paste SP6000 is specially developed for use with alloys TSC305 (Sn96.5Ag3Cu0.5) T4 and TSC105 (Sn98.5Ag1Cu0.5) T4. During its development, special focus was placed on environmental compatibility alongside technical properties. The result is an impressive reduction of CO2 emissions by more than 85% compared to common solder pastes. This achievement is made possible through the use of recycled solder, sustainable packaging materials, and climate-neutral transport. With SP6000, Stannol emphasizes both performance and sustainability.
Visitors to Stannol's booth at SMTA International 2024 can experience firsthand the innovative solutions that are shaping the future of the soldering industry. Don't miss the opportunity to learn more about how Stannol's products can elevate your manufacturing processes while promoting environmental sustainability.
For more information, visit www.stannol.com
MANASSAS, VA – ZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is pleased to announce that its Senior Application Engineer, Ravi Parthasarathy, will present at SMTA International 2024. The presentation, titled “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components,” will take place on Wednesday, October 23, 2024, from 2:00 PM to 3:30 PM CDT in Room 48 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
Ravi Parthasarathy will be joined by Patrick Lawrence from ITW EAE and Evan Griffith from Indium Corporation to explore the latest strategies and solutions for optimizing cleaning processes in advanced packaging applications. The presentation will address the unique challenges associated with low standoff components and offer insights into effective cleaning techniques that can improve the reliability and performance of electronic assemblies.
“We are thrilled to share our expertise on advanced packaging cleaning strategies at SMTA International 2024,” said Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas. “This collaboration with ITW EAE and Indium Corporation allows us to present comprehensive solutions that meet the demands of modern electronics manufacturing, particularly in addressing the complexities of low standoff components.” For more information on the presentation and trials performed, watch this informative video: https://pages.zestron.com/2024-smtai
This presentation is a must-attend for professionals seeking to enhance their knowledge of advanced cleaning methodologies and looking for actionable insights to improve their manufacturing processes. Attendees can engage with industry experts and explore real-world applications that drive quality and efficiency in electronic manufacturing.
ZESTRON invites all SMTA International 2024 attendees to attend this informative session and visit them at booth #2920 to learn more about their range of high-precision cleaning solutions, including their innovative low-VOC chemistries. For more information on ZESTRON’s presence at SMTA International or to schedule a meeting, please visit https://www.zestron.com/usa/en/home
GREAT NECK, NY – Thermaltronics USA, Inc., a manufacturer of award- winning solder robots, is pleased to announce its participation at SMTA International 2024. The event is scheduled to take place October 21-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Thermaltronics will be exhibiting at Booth 2004, where attendees can experience firsthand the advanced capabilities of the TMT-R9800S and TMT-R8000S soldering robots, as well as the comprehensive range of Thermaltronics hand soldering products.
The TMT-R9800S is an advanced soldering robot designed to meet the rigorous demands of high-precision soldering applications. It features dual cameras for fiducial recognition and component alignment, ensuring superior accuracy and consistency. The TMT-R9800S also supports selective soldering and multi-point soldering, making it ideal for complex assemblies. With its intuitive user interface and easy programming, the TMT-R9800S enhances productivity while maintaining high-quality standards.
The TMT-R8000S offers a versatile solution for automated soldering, combining precision and reliability. It features a compact design and is equipped with advanced motion control technology to deliver consistent soldering results. The TMT-R8000S supports a wide range of soldering applications, including through-hole and surface-mount components. Its user-friendly software allows for quick setup and programming, making it an excellent choice for manufacturers looking to improve efficiency and quality.
In addition to its soldering robots, Thermaltronics will display its extensive hand soldering line, known for its reliability, precision, and ease of use. Thermaltronics hand soldering products are designed to meet the needs of various soldering tasks, from intricate PCB assembly to heavy-duty industrial applications. The line includes soldering stations, tips, and accessories that provide excellent thermal performance and durability, ensuring optimal results for soldering professionals. Attendees are invited to visit Booth 2659 to see live demonstrations of the TMT-R9800S and TMT- R8000S soldering robots and explore the full range of Thermaltronics hand soldering solutions.
Thermaltronics’ experts will be on hand to answer questions, provide technical insights, and discuss how Thermaltronics’ products can enhance your manufacturing processes.
For more information or to request a sample, please contact info@thermaltronics.com or visit www.thermaltronics.com
CHINO, CA – Scienscope International is thrilled to announce its participation in SMTA International 2024, from October 22 to 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois. Visit Booth #2929 to experience our latest innovations in component counting, material management, and X-ray inspection.
AXC-800 III: Unleashing the Power of AI in Component Counting
Meet the new Scienscope AXC-800 III, featuring the same reliable software you love with a more compact and user-friendly design. This leading component counting system integrates AI algorithms and X-ray technology to achieve an astounding 99.9% accuracy rate. Seamlessly syncing with Manufacturing Execution Systems (MES), the AXC-800 III delivers real-time results and automatic label generation, setting a new standard for precision and efficiency in component counting.
Smart Rack for Reels and Stencils: Elevate Material Management
Transform your material management with Scienscope’s Smart Storage Rack family. Designed for peak efficiency, accuracy, and customization, these innovative racks feature automatic reel detection and multi-color LEDs for simultaneous multi-kitting. Streamline your material handling process and enhance operational performance like never before.
IMS-100: Automating and Simplifying the Incoming Process
The IMS-100 revolutionizes the incoming materials process with a high-resolution barcode camera that reads and stores data for multiple reel sizes. By significantly reducing human errors and maximizing efficiency, the IMS-100 ensures smooth and accurate inventory management.
Xspection 3000: The X-ray Revolution
Step into the future of quality assurance with Scienscope’s Xspection 3000. This flagship offline X-Ray inspection system offers unmatched quality control and process stability with top-of-the-line 130kV closed-tube technology. The Xspection 3000 is the ultimate choice for businesses seeking uncompromising quality control and superior inspection capabilities.
Experience Innovation at Booth 2929!
Danny Lumbreras and the Scienscope team will be at Booth 2929, ready to demonstrate these cutting- edge systems and discuss how they can enhance your manufacturing processes. Don’t miss this opportunity to discover how Scienscope’s innovative solutions can transform your operations.
For further information, please email Scienscope at info@scienscope.com, call 1-909-590-7273, or visit www.scienscope.com
TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced plans to exhibit at SMTA International, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Seika Machinery will be showcasing a range of innovative products at Booth 2813 including the Sayaka CT23S router, Malcom RCX profiler, Malcom Dip-Tester, Sawa ultrasonic SC-500HE portable stencil cleaner, Unitech PCB Cleaner and Kyowa Strain Gage tester.
Sayaka CT23S Router: The Sayaka CT23S is a state-of-the-art PCB router designed for precision and efficiency in depaneling processes. Its advanced features ensure high accuracy and ease of use, making it an essential tool for PCB manufacturers.
Malcom RCX Profiler: The Malcom RCX profiler provides real-time data acquisition and analysis for reflow soldering processes. This tool enables manufacturers to optimize soldering conditions, ensuring high-quality results and enhanced production efficiency.
Malcom Dip-Tester: The Malcom Dip-Tester is a versatile instrument for evaluating solder paste and flux performance. It offers accurate measurements of wetting force and spread, helping manufacturers maintain high standards of solderability and process control.
Sawa Ultrasonic SC-500HE Portable Stencil Cleaner: The Sawa ultrasonic SC-500HE utilizes ultrasonic waves for thorough and gentle cleaning of stencils. Its portable design makes it ideal for on- site cleaning needs, ensuring stencils are free of contaminants.
Unitech PCB Cleaner: The Unitech PCB Cleaner effectively removes contaminants and residues from PCBs, ensuring optimal performance and reliability. Its advanced cleaning technology is designed to handle delicate PCB components with care.
Kyowa Strain Gage Tester: The Kyowa Strain Gage tester is an essential tool for measuring and analyzing strain in electronic components. It provides precise data that is crucial for quality control and ensuring the reliability of electronic products.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com
DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation at SMTA International, where it will be exhibiting the new StenTech BluPrint™ vapor deposition coating technique at Booth 3025. The event is scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois.
The SMT industry has long faced challenges with the degradation and disintegration of stencil coatings caused by various cleaning solutions, squeegee pressures, and manufacturing processes. Recognizing these issues, StenTech has developed a coating that overcomes these obstacles without requiring changes to established processes.
Introducing the StenTech BluPrint™ vapor deposition coating technique, a groundbreaking solution that is virtually indestructible and consistently delivers high-quality results across different SMT lines, especially in high-volume printing. This exclusive coating allows engineers to design PCBs with area ratios significantly below 0.6, increasing surface area for components. This advancement leads to less frequent cleaning, with some contract manufacturers experiencing a 50% boost in efficiency, cleaning once every four prints instead of every two, and others seeing up to a 67% efficiency increase by cleaning once every six prints. Additionally, the coating enhances transfer efficiency from 84% to an impressive 98%.
StenTech BluPrint™ is designed to enhance existing manufacturing processes, making them more efficient and cost-effective. This results in reduced quality control time, as the company’s stencils ensure that fully assembled PCBs are more likely to pass inspection. From the first print to the 50,000th, StenTech stencils maintain their integrity, eliminating bottlenecks in the initial steps of PCB assembly.
Visit Booth 3025 at SMTA International to see how StenTech BluPrint™ can transform your SMT production lines. StenTech’s team will be available to demonstrate the technology's capabilities and discuss how it can be customized to suit your specific needs.