MORRISVILLE, NC – iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.

Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.

Registration
This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Mark Schaffer (marks@inemi.org).

Monday, September 30, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
5:00-6:00 p.m. CEST (Europe)
Register for this webinar

HAVERHILL, MA – Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning. The equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA's with lead-free solder to tin-lead solder.

These state-of-the-art machines are high-volume, high-mix systems featuring auto load/unload, multi-component vacuum pickup heads, and dynamic solder waves. All process parameters are controlled, including immersion depths, dwell times, insertion and extraction speed, acceleration, solder pump speed, and temperatures, ensuring that the tinning process complies with stringent industry standards including GEIA-STD-006, J-STD-001, and IEC-TS-62647-4.

"For over 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification, rework, and damage repair services," said Andy Price, Sales Manager. "We are thrilled to announce our increased capacity, offering our defense and high-reliability customers electronic component tinning and alteration services with the same exceptional quality and service that they have come to expect from our company."

OULU, FINLAND – Scanfil, a leading provider of advanced electronics manufacturing services, is proud to announce the approval of its near-term science-based targets by the Science Based Targets initiative (SBTi). This significant achievement underscores Scanfil’s commitment to sustainability and climate action.

The SBTi has validated that Scanfil’s greenhouse gas (GHG) emissions reduction targets align with the latest climate science and are consistent with the goals of the Paris Agreement. Specifically, Scanfil commits to:

• Reduce absolute scope 1 and 2 GHG emissions by 55.8% by 2030 from a 2020 base year. Scope 3 inventory was not reported for that year.
• Reduce absolute scope 3 GHG emissions from purchased goods and services, capital goods, fuel- and energy-related activities, upstream transportation and distribution, waste generated in operations, business travel, and employee commuting by 25% by 2030 from a 2022 base year.

“These ambitious targets reflect Scanfil’s dedication to driving meaningful change and contributing to a sustainable future. By setting and achieving these goals, Scanfil not only demonstrates leadership in environmental stewardship but also inspires other organizations to take bold steps towards reducing their carbon footprint”, says CEO Christophe Sut.

SBTi’s Target Validation Report highlights Scanfil’s comprehensive approach to GHG emissions management. In 2020, Scanfil reported a total of 16,901 tCO2e for scope 1 and 2 emissions. By 2022, the company reported 955,102 tCO2e across scopes 1, 2, and 3, with a significant portion (65.22%) attributed to purchased goods and services. The report confirms that Scanfil’s targets meet the SBTi’s stringent criteria and are aligned with a 1.5°C trajectory.

“We are thrilled to receive this validation,” says Mats Lindblad Director of Quality and Sustainability at Scanfil. “SBTi’s approval is a testament to our team’s hard work and our commitment to making a positive impact on the environment. We believe that by taking decisive action today, we can help create a better tomorrow for future generations.”

Scanfil’s sustainability journey is a continuous one, and the company remains dedicated to exploring innovative solutions and partnerships that will further enhance its environmental performance.

MANASSAS, VA – ZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its participation in the upcoming SMTA International (SMTAI) (SMTAI) 2024. The event will occur from October 20-24, 2024, at the Donald E. Stephens Convention Center in Rosemont, IL, USA. ZESTRON will exhibit at booth #2920.

At SMTAI, ZESTRON will spotlight its state-of-the-art Manassas Technical Center, which houses a comprehensive range of cutting-edge cleaning equipment. This facility is designed to support the most demanding cleaning challenges in electronics manufacturing, offering advanced cleaning solutions tailored to ensure high reliability in electronic assemblies. Visitors to ZESTRON’s booth will have the opportunity to take a virtual tour of the Manassas Technical Center, gaining an inside look at the sophisticated equipment and technologies available to customers for testing and process optimization. This virtual experience will showcase the latest innovations in cleaning technology, including equipment for precision cleaning, environmental testing, and more, all designed to improve cleaning efficiency and product quality.

In addition to its exhibit, ZESTRON’s Senior Application Engineer, Ravi Parthasarathy, will present a technical paper titled “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components.” This presentation, conducted in collaboration with Patrick Lawrence from ITW EAE and Evan Griffith from Indium Corporation, will take place on Wednesday, October 23, 2024, from 2:00 PM to 3:30 PM CDT in Room 48. The session will explore the latest strategies and innovations for optimizing cleaning processes in advanced packaging applications, highlighting the challenges and solutions associated with low standoff components.

Join ZESTRON at booth #2920 to learn how their products and services can enhance your cleaning processes and improve product reliability. For more information about ZESTRON’s participation at SMTA International 2024 or to schedule a meeting with their team, please visit https://pages.zestron.com/2024-smtai