HANOVER, GERMANY – Viscom AG, a global leader in automated optical inspection, X-ray inspection, and software solutions, is excited to announce its participation in SMTconnect 2024, taking place in Germany from June 11 to 13 at the Nuremberg Exhibition Grounds. For Viscom, this prestigious event is a key date in the year to showcase its most innovative inspection solutions designed to meet the evolving needs of electronics manufacturers worldwide.

At Booth 4A-145, Viscom will proudly present its 3D-AOI inspection flagship, the "iS6059 PCB Inspection Plus" renowned for its exceptional reliability and precision. This cutting-edge system offers manufacturers unmatched accuracy in defect detection, ensuring the highest standards of quality control throughout the production process. Additionally, visitors will have the opportunity to experience the lightning-fast performance of Viscom’s "iS6059 SPI" system, revolutionizing solder paste inspection with its speed and efficiency.

In a significant debut, Viscom will unveil the latest addition to its X-ray inspection lineup – the high-speed variant of the "iX7059" series. This advanced system sets a new benchmark for automatic X-ray inspection, offering companies enhanced throughput without compromising on inspection accuracy. With its state-of-the-art technology, the iX7059 high- speed variant empowers manufacturers to achieve optimal quality assurance in the most demanding production environments.

Furthermore, attendees can explore the all-new features of Viscom’s flagship software vVision which now integrates advanced AI capabilities, enabling more intelligent and efficient inspection processes. With vVision release 4.0, manufacturers can leverage AI-driven algorithms to enhance defect detection accuracy, streamline inspection workflows, and optimize production efficiency.

Viscom will also showcase the latest enhancements and redesign of its vConnect software suite, providing users with a new level of connectivity, flexibility, and usability. With its intuitive interface and advanced functionalities, vConnect offers seamless integration with Viscom’s inspection systems, enabling real-time data analysis, remote monitoring, and comprehensive quality management.

“We are thrilled to return to SMTconnect this year and to showcase our latest innovations in inspection technology,” said Carsten Salewski, Board Member of Viscom AG. “At Viscom, we are committed to pushing the boundaries of excellence in automated inspection solutions, and SMTconnect provides an ideal platform for us to demonstrate our capabilities and engage with industry professionals from around the world.”

Viscom’s participation in SMTconnect extends beyond its booth presence, with the company’s experts hosting informative sessions and technical presentations throughout the event. Visitors will have the opportunity to gain valuable insights into emerging trends, best practices, and the future of inspection technologies, further solidifying Viscom’s position as a thought leader in the industry.

“As the electronics manufacturing landscape continues to evolve, it is essential for manufacturers to stay ahead of the curve with advanced inspection solutions,” added Salewski. “At Viscom, we are committed to empowering our customers with the tools they need to achieve excellence in quality control and production efficiency.”

Viscom invites attendees to visit Booth 4A-145 at SMTconnect 2024 to discover firsthand how Viscom’s solutions can elevate their manufacturing processes to new heights of performance and quality.

CLINTON, NY – Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.

Indium Corporation is a leading solder supplier for laser and optical applications. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.

Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s gold-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

• Highly accurate solder volume and BLT control
• Precision edge quality
• Flat and free of warping or bends
• Optimized cleanliness control
• Default waffle-pack method

Indium Corporation’s gold PDA preforms are available in the following primary and development alloys:

Primary alloys:

• 80Au/20Sn
• 79Au/21Sn

Development alloys:

• 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
• 88Au/12Ge
• 96.8Au/3.2Si
• 82Au/18In

Indium Corporation’s AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA® product line also comes in 78Au/22Sn and 79Au/21Sn compositions.

Indium Corporation’s AuLTRA® ThInFORMS® are 0.00035”-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS® help combat common issues such as:

• Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
• Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device

Indium Corporation’s AuLTRA® Fine Ribbon is our Indalloy®182 fine-grade precision ribbon, for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.

A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn: the pillar alloy of the microelectronics industry with a melting point of 280°C, 80Au/20Sn works great in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:

• Highest tensile strength of any solder
• High melting point compatible with subsequent reflow processes
• Superior thermal conductivity
• Resistance to corrosion

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #214 at the show.

WASHINGTON – Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director. USPAE is an IPC subsidiary that focuses on partnership with the U.S. Government to support a more robust defense electronics industrial base. Over its short history, USPAE has steered more than $30 million to industry for high priority projects.

As executive director of USPAE, Will is responsible for growing the organization to help ensure the U.S. Government has access to trusted, secure, and resilient electronics supply chains. One of the organization’s signature programs is the Defense Business Accelerator (DBX), which aims to revolutionize how the Department of Defense (DOD) drives dual-use technology development by harnessing the size and speed of the commercial market to accelerate the growth of a resilient dual-use electronics ecosystem.

An engineer by training, Will comes to USPAE with a strong technical and operational background in the electronics industry and is active in industry organizations, including the National Defense Industrial Association (NDIA) and International Microelectronics Assembly and Packaging Society (iMAPS). His background includes leading and supporting enterprise A&D programs, from foundry to packaged and qualified high-reliability components. As a contractor to the Department of Energy National Nuclear Security Administration, he supported trusted foundry, semiconductor products and components, and assurance interests. Will, most recently, led aerospace and defense business development for SkyWater Technology Foundry. His additional commercial experience includes roles at Motorola and Infineon, from engineer to engineering management, including involvement in a 300mm fab startup.

“I am excited to build USPAE’s role as a trusted third party that connects industry and U.S. Government stakeholders to promote an assured electronics supply chain,” said Will. “Strengthening public-private sector collaboration is critical to both U.S. national security and economic growth. I am honored to leverage my experience developing solutions for the aerospace and defense industries to further USPAE’s mission of building a robust domestic ecosystem for electronics manufacturing.”

“With Jim’s extensive background in driving innovation and adopting solutions throughout the electronics supply chain, he is uniquely qualified in growing and positioning USPAE to help ensure the U.S. Government has access to trusted, secure, and resilient electronics,” said John Mitchell, USPAE Chairman of the Board. “Jim is well-respected in the defense manufacturing community, and we’re thrilled to have him at the helm of USPAE.”

For more information on USPAE, visit www.USPAE.org or send inquiries to info@uspae.org 

WALTHAM, MA – Essemtec is exhibiting at SMTconnect booth 4.209.

We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.

We are presenting the latest product advancements and SMTconnect premieres:

• Tarantula Underfill
• Fully Integrated PCB Inspection
• BGA Dispensing and Reballing

Tarantula Underfill is our latest addition to our machine lineup. Our new solution will meet your underfill process needs while also performing all other traditional dispensing operations in the same machine, thanks to the 5 different valve options from Essemtec. These valves cater to a wide range of dispensing applications such as Solder Paste, SMT Glue, LED Encapsulation, Silver Epoxy, and Dam, among others.

Furthermore, we will showcase our flagship equipment Puma All-in-One with multiple functionalities:

• High-Speed Solder Paste Jetting Solution with our Jet-on-the-fly
• Integrated Inspection System for PCB inspection
• EVO feeder 4mm, 08004 Pick-and-Place

The All-in-One platform with dispensing and pick-and-place functionalities will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting multiple fluids three times faster, and efficient rework on populated boards.

On our production line, we will demonstrate the reballing and flux dispensing with pick-and- place in one go, as well as our line change preparation using our Smart Manufacturing Solution.

Under the motto “Our Focus - Your Solution,” we also focus on proven solutions in various segments for electronics production, such as NPI, High-mix / Low-Volume, High-speed Dispensing, Printed Electronics, and Complex repair.

More information on our latest solutions:

Integrated Inspection System – for all product platforms

For the first time in the industry, an Integrated Inspection System (I2S) in the Pick-and-Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process.

Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function. The system is already integrated in production sites by various companies.

Smart Material Management - integrated solution for factory 4.0

The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual components. The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage locations to fully automated storage cabinets. The solution offers high ROI and is fully integrated with the production machine and the ERP systems.

Our team of engineers will share the best tips on SMT topics to help you increase the flexibility of your production line and optimize your manufacturing costs. Visit us in Hall 4 at booth 209 and be inspired by our solutions!